An enclosure for an electronic device includes a housing having a wall that defines a cavity that is configured to receive an electronic assembly therein. The wall includes tongue formed at a distal end. A cover includes a top wall and a side surface extending from the top wall to form a chamber. The housing is at least partially received within the chamber and the tongue of the housing is welded to a groove positioned within the chamber. Flash from the weld is contained within the enclosure so that no weld flash is visible on the exterior surface of the enclosure.

An enclosure for an electronic device includes a housing having a wall defining a cavity that is configured to receive an electronic assembly therein. The wall includes a distal end having a tongue. A cap is sized to attach to the housing with a corresponding groove that is formed in a perimeter of the cap. A double shear weld joint is formed between the tongue and the groove such that flash from the weld is contained within the enclosure and is not visible on the exterior surface of the enclosure.

Various embodiments of a hermetic assembly and a method of forming such assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by a laser bond, and a ferrule having a body and a flange extending from the body. The flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.

Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.

The method manufactures a hermetic sealing lid member used for an electronic component housing package including an electronic component arrangement member on which an electronic component is arranged. The method includes forming a clad material in which a silver brazing layer that contains Ag and Cu and a first Fe layer arranged on the silver brazing layer and made of Fe or an Fe alloy are bonded to each other by roll-bonding a silver brazing plate that contains Ag and Cu and a first Fe plate made of Fe or an Fe alloy to each other and performing first heat treatment for diffusion annealing; softening the clad material by performing second heat treatment; and forming the hermetic sealing lid member in a box shape including a recess portion by bending the softened clad material.

Described are enclosures that include a friction stir weld, including electronic device enclosures, and precursors thereof, that contain a base and a cover that in an assembled condition form a joint at which a friction stir weld can be produced, as well as methods for producing a friction stir weld at a joint of such an assembly.

The present invention relates to an airbag control unit including a housing that forms an enclosure and has an opening at an end thereof; a PCB that is coupled to the housing by coupling to a corner portion in the opening and an electrical connection structure in which a terminal pin is inserted into a terminal pin hole; and a cover provided in a shape covering the opening and includes an edge joined and fixed along an edge of the opening.

A method includes contacting a second layer of a glass sheet with a forming surface to form a shaped glass article. The glass sheet includes a first layer adjacent to the second layer. The first layer includes a first glass composition. The second layer includes a second glass composition. An effective viscosity of the glass sheet during the contacting step is less than a viscosity of the second layer of the glass sheet during the contacting step. A shaped glass article includes a first layer including a first glass composition and a second layer including a second glass composition. A softening point of the first glass composition is less than a softening point of the second glass composition. An effective 10.sup.8.2 P temperature of the glass article is at most about 900 C.

A housing includes a first surrounding wall connected around a base wall. The first surrounding wall has a first joint portion opposite to the base wall, a first outer surface and a first inner surface. The first outer and inner surfaces extend from the first joint portion toward the base wall. The first joint portion is stepped and has a first projecting portion adjoining the first outer surface, and a first shoulder portion indented from the first projecting portion and proximal to the first inner surface. The first shoulder portion has a plurality of parallel spaced-apart ribs protruding therefrom in a same direction as the first projecting portion. Each of the ribs has a tip that does not extend beyond a top end of the first projecting portion.

An electronics housing includes a first enclosure portion defining an internal cavity, a second enclosure portion sealing the internal cavity, at least one vent positioned in one of the first enclosure portion and the second enclosure portion, the vent comprising a through hole protruding from an exterior edge of the vent to an interior edge of the vent, a malleable sealing member disposed in the vent, and a rigid retaining member disposed in the vent.