An electronic device according to various embodiments comprises: a case for accommodating at least one electronic part; an upper cover for covering at least one part of an upper end of the case; and a connector, which is arranged on the upper cover, for electrically connecting an external module and the at least one electronic part, wherein the upper cover can guide heat generated from the at least one electronic part such that the heat is discharged to the outside along a side part of the upper cover. Additional other embodiments are possible.

A method for controlling an output of an energy module of a modular energy system. The energy module can comprise a plurality of amplifiers configured to generate a drive signal at a frequency range and a plurality of ports coupled to the plurality of amplifiers. The method includes determining to which port of the plurality of ports the surgical instrument is connected, selectively coupling an amplifier of the plurality of amplifiers to the port of the plurality of ports to which the surgical instrument is connected, and controlling the amplifier to deliver the drive signal for driving the energy modality to the surgical instrument through the port.

Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. At least part of the at least one electrically insulating layer structure comprises or consists of a material having a curing shrinkage value of less than 2%.

A display which thickness is allowed to be reduced is provided. A display includes: a display panel; and a back-face member having rigidity and provided on a back face of the display panel, the back-face member covering the back face, or the back face and other part of the display panel.

A modular electronics assembly comprising: removable electronic modules comprising a module housing containing electronic circuitry and bearing a module electrical connector coupled to the electronic circuitry each removable electronic module having a first alignment formation; an enclosure having an interior dimensioned to contain the removable electronic modules therein, the enclosure including, one or more enclosure electrical connectors corresponding to one or more of the module electrical connectors for establishing a connection, guide members extending into the interior of the enclosure for guiding respective ones of the module housings toward the enclosure electrical connectors; second alignment formations each arranged to cooperate with a respective first alignment formation of the removable electronic modules for aligning module electrical connectors with enclosure electrical connectors to thereby establish connection; wherein the first alignment formations are positioned on the module housings to register with respective second alignment formations upon the module housings abutting respective guide members.

A modular arrangement is provided for housing electronic equipment and associated cooling structure in a data center environment. The modular units provide cooling air on an as-needed basis to individual pieces of equipment by way of individual plenums and associated valves. The units can be interconnected by vertical stacking, in side-to-side arrangements, and back-to-back arrangements. A number of units can be interconnected to form a cell. The cells can be interconnected to form larger units. In this manner, data centers can be configured in any desired arrangement without requiring complicated cooling design.

A power conversion device includes a first stage, a second stage, a first electric field relaxation shield unit, a second electric field relaxation shield unit, and a plurality of stage posts. The first electric field relaxation shield unit is arranged to surround outer periphery of the first stage. The second electric field relaxation shield unit is arranged to surround outer periphery of the second stage. The plurality of stage posts connect the first stage and the second stage. The plurality of stage posts have outer peripheral surfaces formed of insulating bodies. Power conversion units loaded on the first stage are arranged inside a columnar region which includes at least some of the plurality of stage posts as sides.

Plug-on ground fault modules are configured with a housing and at least one ground fault terminal. The at least one ground fault terminal can be a rigid or semi-rigid member that is configured to slidably engage a circuit breaker terminal. The modules also include aground fault circuit coupled to the ground fault terminal and at least one printed circuit board in the housing with components of the ground fault circuit including at least one solenoid assembly coupled thereto with a respective magnetized or magnetic plunger member residing on or adjacent thereto, and at least one current transformer. The modules also include at least one collar assembly residing in the housing spaced apart from the solenoid assembly and plunger member that is arranged to be able to engage a lever in the circuit interrupter to delatch the circuit interrupter.

A data storage module includes one or more carrier circuit board assemblies mounted in a rack. An array of removable solid state data storage devices (such as USB thumb drives or SD cards) is coupled to the circuit board assemblies. A data storage controller is coupled to the solid state data storage devices in the array. The data storage controller stripes data across at least two of the solid state data storage devices.