A circuit board includes a substrate, a plurality of electronic components disposed on the substrate, and at least one cable management structure. The substrate is provided with a first surface and a second surface. The first surface and the second surface are correspondingly disposed. The cable management structure is used for limiting a configuration direction of at least one cable. The cable management structure includes at least one cable management column and at least one cable collection member. The cable management column is disposed on the first surface of the substrate. The cable collection member is disposed at an edge of the substrate, and the cable management column is located beside the cable collection member. The cable is capable of bypassing the cable management column and passing through the cable collection member from the edge of the substrate to the second surface, to achieve cable management and positioning effects.

A circuit board includes a substrate, a plurality of electronic components disposed on the substrate, and at least one cable management structure. The substrate is provided with a first surface and a second surface. The first surface and the second surface are correspondingly disposed. The cable management structure is used for limiting a configuration direction of at least one cable. The cable management structure includes at least one cable management column and at least one cable collection member. The cable management column is disposed on the first surface of the substrate. The cable collection member is disposed at an edge of the substrate, and the cable management column is located beside the cable collection member. The cable is capable of bypassing the cable management column and passing through the cable collection member from the edge of the substrate to the second surface, to achieve cable management and positioning effects.

A display panel and a display apparatus containing the display panel are disclosed. The display panel includes a substrate, a circuit structure, and a first bonding adhesive. The substrate has a first bonding area. The circuit structure has a second bonding area that opposingly faces the first bonding area. The first bonding adhesive is arranged between, and configured to contact the first bonding area and the second bonding area. At least one of the first bonding area or the second bonding area comprises at least one first indentation. The first bonding adhesive at least partially fills one or more of the at least one first indentation.

A circuit structure includes a first busbar, a second busbar, an insulating member including an insulating portion located between the first busbar and the second busbar, a first wiring board provided on one main surface of the first busbar, one main surface of the second busbar and the insulating portion, and a first electronic component provided on the first wiring board. The first electronic component has a first connection terminal electrically connected to the first busbar and bonded to the first wiring board, and a second connection terminal electrically connected to the second busbar and bonded to the first wiring board.

A circuit structure includes a first busbar, a second busbar, an insulating member including an insulating portion located between the first busbar and the second busbar, a first wiring board provided on one main surface of the first busbar, one main surface of the second busbar and the insulating portion, and a first electronic component provided on the first wiring board. The first electronic component has a first connection terminal electrically connected to the first busbar and bonded to the first wiring board, and a second connection terminal electrically connected to the second busbar and bonded to the first wiring board.

A circuit structure includes: an upper case having positioning holes; bus bars that are provided in an inductor disposed in the upper case and that have through holes; terminals that are connected to electric wires and that have bolts disposed thereon that penetrate the through holes; nuts that sandwich the bus bars between the nuts and the terminals by being screwed onto the bolts; and a lower case that is attached to the upper case. The lower case includes: front walls, left walls, and right walls that project upward from the lower case and position the terminals relative to the lower case by coming into contact with the terminals; and case positioning portions that project upward from the lower case and that are inserted into the positioning holes.

A power circuit includes multiple bus bars that are connected to multiple terminals of an FET, are provided flush with each other, and are each insulated from each other. The power circuit includes one bus bar that is connected to drain terminals of the FET, a solder fixing portion of the FET that is arranged on the bus bar, and another bus bar that is connected to source terminals of the FET via a conductive connection sheet.

A power circuit includes multiple bus bars that are connected to multiple terminals of an FET, are provided flush with each other, and are each insulated from each other. The power circuit includes one bus bar that is connected to drain terminals of the FET, a solder fixing portion of the FET that is arranged on the bus bar, and another bus bar that is connected to source terminals of the FET via a conductive connection sheet.

A consumer electronic product includes at least a transparent housing and a flexible display assembly enclosed within the transparent housing. In the described embodiment, the flexible display assembly is configured to present visual content at any portion of the transparent housing.

A consumer electronic product includes at least a transparent housing and a flexible display assembly enclosed within the transparent housing. In the described embodiment, the flexible display assembly is configured to present visual content at any portion of the transparent housing.