A support for computer data back-up units is designed to receive at least two distinct sizes of back-up units. The support has a bottom and at least one stationary wall perpendicular to the bottom. The support also has an additional wall extending perpendicularly to the bottom of the support and parallel to the stationary wall. The additional wall is mounted to be movable relative to the bottom of the support between at least two receiving slots respectively associated with the distinct sizes of the back-up units.

A circuit board assembly includes a circuit board having a first side and a second side opposite to the first side, a light sensor arranged on the circuit board and electrically coupled to the circuit board, and a camera module. The camera module includes a connector arranged on the circuit board and electrically coupled to the circuit board. Projections of the light sensor and the connector on a plane parallel to the first side and the second side are fully or partially overlapped with each other. A related terminal is also provided.

A guide module for use with a plug-in module assembly to properly position the plug-in module in a slot of a chassis. The guide module has a leading surface and oppositely facing trailing surface. The guide module has a top wall, a bottom wall, a first inside side wall and an oppositely facing second outside side wall. The leading surface of the guide module extends beyond a leading end of the plug-in module assembly. As the plug-in module is inserted into the chassis, the leading surface of the guide module prevents damage to other components of the plug-in module assembly.

A mechanism to mitigate assembly torsion on an electronics assembly is provided. The mechanism including an electronics assembly and a first connector, mounted to the electronics assembly with a lower portion of the first connector proximal to the electronics assembly and an upper portion of the first connector distal to the electronics assembly. The mechanism includes a spring, mounted so as to press the upper portion of the first connector and preload the first connector against assembly force imparted by assembly of the first connector to a second connector. A method to mitigate assembly torsion on an electronics assembly is also provided.

A modular I/O device includes a terminal base with a terminal block that includes a plurality of wiring connectors. An auxiliary wiring device includes a plurality of auxiliary wiring connectors and is selectively physically connectable to the terminal base in an operative position and selectively physically removable from the terminal base. The terminal block includes a receiver and the auxiliary wiring device includes a body including at least one mounting tab that projects outwardly from the body and that is located in the receiver. The receiver includes a projecting lip about which the auxiliary wiring device is pivotable relative to the receiver on a pivot axis. The terminal base includes at least one catch and the auxiliary wiring device further includes at least one latch arm that is adapted to engage the catch when the auxiliary wiring device is physically connected to said terminal base in its operative position.

An electrical component module is provided in which a heat sink is applied as a cooling unit for a power element and space can be saved. The electrical component module includes: a first holder having substrate holding structures on a first surface portion and a second surface portion located on a back-surface side of the first surface portion; a second holder disposed perpendicular to the first holder at an end portion of the second surface portion of the first holder and having a substrate holding structure on one surface of the second holder; a first substrate held on the first surface portion of the first holder; a second substrate and a heat sink both held by the second holder; and a third substrate held on the second surface portion of the first holder, and connected to the first substrate and the second substrate by a line.

The invention relates to an automation module for building automation, which is designed to be installed in a wall of a house as an at least partially concealed installation. The automation module comprises a high voltage region (6) and a low voltage region (4). It additionally comprises an insulation region (5) for separating said high (6) and low (4) voltage regions, a first circuit board (41, 41) having at least one input interface (411, 414), a second circuit board (42) having at least one control unit (422), and a third circuit board (61) having at least one switching element (611). Said first, second and third circuit boards (41, 41; 42, 61) and the insulation region (5) are arranged one above the other in layers.

A card connector that is removably fixable to a main body of a carrier system. For example, an outer flange of the card connector may be removably fixed (e.g., with fasteners, such as bolts) to the main body of the carrier system. A protrusion of the card connector may include a connector configured to electrically couple to the plugin card. The protrusion may extend into an interior of the main body when the card connector is removably fixed to the main body, such that the plugin card is disposed entirely within the main body. The card connector provides for a user to easily remove the card connector from the main body (e.g. by unfastening bolts and sliding the card connector out of the main body) and removably fix a new card connector to the main body. The new card connector may include different internal electronics or external porting than the original card connector.

Stacked circuit board structures and methods of assembly are described. In an embodiment, a stacked circuit board structure includes first circuit board and a second circuit board including a plurality of pins mounted thereon, and the plurality of pins are secured in a plurality of receptacles that are coupled with the first circuit board to provide electrical connection between the first circuit board and the second circuit board.

A mechanism to mitigate assembly torsion on an electronics assembly is provided. The mechanism including an electronics assembly and a first connector, mounted to the electronics assembly with a lower portion of the first connector proximal to the electronics assembly and an upper portion of the first connector distal to the electronics assembly. The mechanism includes a spring, mounted so as to press the upper portion of the first connector and preload the first connector against assembly force imparted by assembly of the first connector to a second connector. A method to mitigate assembly torsion on an electronics assembly is also provided.