A cooling system includes a diaphragm, at least one conductor layer disposed on the diaphragm, at least one dielectric film layer, and a controller. The controller is programmed to operate the cooling system in a contact mode and in a non-contact mode. In the contact mode, the diaphragm is controlled to oscillate at a first amplitude such that the conductor layer contacts the dielectric film layer. In the non-contact mode, the diaphragm is controlled to oscillate at a second amplitude such that the conductor layer does not contact the dielectric film layer while the diaphragm oscillates.

Example implementations relate to an adaptive cooling assembly. For example, an adaptive cooling assembly includes a removable shelf installed in the adaptive cooling assembly, an adaptive cooling bay located in a slot formed by the removable shelf, and a removable thermal bus bar installed in the adaptive cooling bay and connected to a pair of connectors. The adaptive cooling bay includes the pair of connectors and the removable thermal bus bar provides liquid cooling to an electronic device.

A chassis device and its cover structure and lifting mechanism, the chassis structure includes a chassis, a cover and a lifting mechanism further including a first magnetic member fixed to the cover, a second magnetic member fixed to the chassis; a movable sleeve sheathed on the second magnetic member and capable of sliding with respect to the second magnetic member, an elastic element installed between the chassis and the movable sleeve and pushing the movable sleeve away from the chassis to resume its original position, and a third magnetic member fixed to the movable sleeve, and the third magnetic member has a side attracted or repelled with respect to the first magnetic member and the other side attracted or repelled with respect to the second magnetic member. The second and third magnetic members have a magnetic attraction force greater than an elastic restoring force of the elastic element.

An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).

A power supply device supplies power to a substrate holder having a plurality of electrodes. The device includes a first fixed conductive member, a second fixed conductive member, a fixed insulating member fixed to an insulating housing portion and configured to insulate the first fixed conductive member from the second fixed conductive member, a first rotation conductive member, a second rotation conductive member, a rotation insulating member fixed to an insulating column portion and configured to insulate the first rotation conductive member from the second rotation conductive member, a first power supply member configured to supply a first voltage to the substrate holder via the first rotation conductive member and the first fixed conductive member, and a second power supply member configured to supply a second voltage to the substrate holder via the second rotation conductive member and the second fixed conductive member.

The present invention provides an electrostatic chuck device capable of increasing the electrostatic adsorptive force for a focus ring and uniformly cooling the focus ring. In an electrostatic chuck device (10) of the present invention, a mounting table (11) has a holder (15) being provided in the periphery of a placing surface (24a) along the circumferential direction of a focus ring (12) and electrostatically adsorbing the focus ring (12), the holder (15) has a pair of banks (16) being provided in the circumferential direction and being for placing the focus ring (12) thereon, and an annular groove (17) formed between these banks, and, in at least a bank (16A) on an outer circumferential position of the focus ring (12) among the pair of the banks (16), a micro-protruding part including a plurality of micro-protrusions is formed on a surface facing the focus ring (12), or convex parts (18) are provided on a bottom (17a) of the groove (17). The convex parts (18) do not come into contact with the focus ring, and the pair of the banks (16) or the plurality of the micro-protrusions comes into contact with the focus ring (12) and electrostatically adsorbs the focus ring (12) in coordination with the convex parts (18).

Disclosed is a base plate (1) and the protective case of a printed circuit. The plate includes a ventilation filter (4) and at least one rivet blank (5) projecting from the plate and intended to penetrate the printed circuit and to be deformed for rigidly connecting the printed circuit to the base plate by projecting from a face (1a) of the plate, the filter including at least one ventilation opening (6). The rivet blank is borne by the filter and includes an internal tube (7) passing right through the rivet blank in the projecting direction thereof, the internal tube opening, on one side, onto an end of the rivet blank that projects furthest from the plate while forming the ventilation opening and, on the other side, into the ventilation filter.

A cold plate for cooling heat-generating components, includes two plates extending parallel to each other. A core is sandwiched between the two plates to form a sandwich structure, the core including a set of passages for passing a cooling fluid from a first edge to an opposite second edge of the sandwich structure. First and second fluid-tight joining members are disposed respectively on the first and second opposite edges of the sandwich structure, the first fluid-tight joining member including at least one inlet connector and the second fluid-tight joining member including at least one outlet connector for the passage of the cooling fluid. A method for use of the cold plate in particular as a structural part of an avionics equipment item is also provided.

A piezoelectric cooling chamber and method for providing the cooling system are described. The cooling chamber includes a piezoelectric cooling element, an array of orifices and a valve. A vibrational motion of the piezoelectric cooling element causes an increase or decrease in a chamber volume as the piezoelectric cooling element is deformed. The array of orifices is distributed on at least one surface of the chamber. The orifices allow escape of fluid from within the chamber during the decrease in the chamber volume in response to the vibration of the piezoelectric element. The valve is configured to admit fluid into the chamber when the chamber volume increases and to substantially prevent fluid from exiting the chamber through the valve when the chamber volume decreases.

The present invention is an electronic device unit including an electronic device that has air inlets formed on a bottom surface of a main housing body having electronic components housed therein, and that introduces air to an inner part of the main housing body through the air inlets to cool the inner part of the main housing body, and a battery pack that is attached to the main housing body in a state where a battery case covers a part of a portion being an extensional region of the air inlets, wherein a surrounding wall part is provided on the bottom surface of the main housing body to surround a ventilation region in which the air inlets are provided and to be open at a portion facing the ventilation region, and the battery case is attached to the main housing body via protruding ends of the surrounding wall part.