A knockdown water-cooling unit latch device structure includes a latch device assembly having multiple latch members. The latch members are correspondingly assembled with each other around a water-cooling unit. The latch members are connected with each other via at least one connection member. Alternatively, the latch members are directly assembled with each other by means of engagement or lap joint. The latch members of the latch device assembly are assembled with the water-cooling unit so that when the latch device assembly is assembled with the water-cooling unit, the latch members will not interfere with the water-cooling unit.

A liquid cooling apparatus includes a heat exchange module and a cooling module. The heat exchange module includes a liquid outlet and a liquid outlet. The cooling module includes a first body, a second body, a first cooling component and a cooling duct. The first body is connected to the liquid outlet. The second body is connected to the liquid outlet, and the first body is disposed above the second body. The first cooling component is disposed between the first body and the second body. The cooling duct is connected to the first body and the second body, and the cooling duct is in thermal contact with the first cooling component.

A cooling apparatus for an electronic or computing device includes a base for thermal coupling to a surface of the electronic or computing device and a cover spaced from the base. A nozzle plate is disposed between the base and the cover to partially define an inlet volume and an outlet volume. Cooling fluid enters the inlet volume and passes through the nozzle plate to the outlet volume and out of the apparatus. The nozzle plate includes a plurality of flow paths through which the cooling fluid passes from the inlet volume to the outlet volume. The flow paths cause the fluid to exit the nozzle plate as transversely expanding fluid jets.

A sensor abnormality determining apparatus is applied to an inverter that includes: a power element; a cooling water circulation path for cooling the power element; a temperature sensor that detects a temperature of the power element; and a water temperature sensor that detects a temperature of the cooling water circulating in the cooling water circulation path. The sensor abnormality determining apparatus includes: an abnormality determining section and a determination temperature setting section. The abnormality determining section determines the temperature sensor is abnormal when a temperature difference between the detected power element temperature and the detected water temperature is larger than a prescribed determination temperature difference. The determination temperature setting section sets the prescribed determination temperature difference to a lower value when the detected power element temperature is lower than the detected water temperature as compared to when the detected power element temperature is higher than the detected water temperature.

A compute device includes a printed circuit board, at least three compute subassemblies disposed on the printed circuit board, and a liquid loop. The compute subassemblies disposed on the printed circuit board and each of the three compute subassemblies includes a thermal control plate defining a respective internal conduit therethrough. A temperature controlled liquid circuit circulates through the liquid loop through to control the temperature of each of compute subassemblies in series during operation, the liquid loop including each of the internal conduits in each of the thermal control plates in each of the compute subassemblies.

A thermal control system includes an enclosure configured to contain a thermal mass. A baffle plate is disposed in the enclosure. A heat exchanger is coextensive with and cooperates with the baffle plate to divide the enclosure into a first chamber and a second chamber. An air circulation element cooperates with the baffle plate and the heat exchanger to define an air circulation path and to cause air to flow through the air circulation path. The heat exchanger exchanges thermal energy with the air flowing through the air circulation path.

An information technology (IT) enclosure may have a hybrid architecture. Such an enclosure may include an immersion tank that holds a single-phase coolant fluid. One or more servers may be immersed in the tank. The server chassis may have electronics that are thermally coupled to a two-phase fluid via a thermosiphon loop. The server chassis includes a condensing unit forming the thermosiphon loop and the condensing unit is submerged in the single phase fluid.

Disclosed are an apparatus for cooling a server cabinet, a server cabinet apparatus, and an Internet data center. The apparatus includes: a bracket and a cooling device; where the bracket is positioned below one or a plurality of server cabinets, and the cooling device is positioned in the bracket, and cools the server cabinet on the bracket. The apparatus for cooling a server is positioned below one or a plurality of server cabinets, such that all the server cabinets in a large-scale Internet data center are effectively cooled, and in addition, resources are saved.

A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device, wherein a cooling section of a capacitor connection device is in thermally conducting contact with a cooling surface of the cooling device.

Devices, methods, and systems for two-phase thermal management are provided in accordance with various embodiments. For example, a two-phase thermal management device is provided that may include two or more containment layers and/or one or more porous layers positioned between at least a portion of each of the two or more containment layers. The portion of each of the two or more containment layers and the one or more porous layers may be bonded with each other. The two or more containment layers and one or more porous layers may be bonded with each other to form an uninterrupted stack of material layers utilizing diffusion bonding. Some embodiments include a method of forming a two-phase thermal management device including arranging multiple materials layers including one or more porous layers positioned with respect to one or more containment layers; and/or bonding the multiple material layers with each other.