Cooling apparatus cooling for an electrical or electronic device, comprising an at least partially hollow body containing a refrigerant and having a plurality of electrically conductive sections Each electrically conductive section has a respective coupling portion suitable to be operatively associated with a corresponding electrically conductive part of the electrical or electronic device, wherein the at least partially hollow body further comprises one or more electrically insulating sections. Each electrically insulating section is positioned between and electrically insulates from each other two adjacent electrically conductive sections.

A liquid-cooling heat dissipation device and a power module are provided. The liquid-cooling heat dissipation device includes a housing and a flow passage arranged inside the housing. A device mounting position for mounting a heating device is provided in the housing, the device mounting position includes a first mounting position and a second mounting position, the first mounting position is arranged on a first wall surface of the flow passage, and the second mounting position is arranged on a second wall surface of the flow passage.

Conductive cooled gimbaled inertial measurement units are disclosed herein. An example apparatus includes an inertial measurement unit, a gimbal assembly in which the inertial measurement unit is disposed, the gimbal assembly having gaps between each gimbal of the gimbal assembly, the gaps including a gas to conduct heat from the gimbal assembly, and an isothermal dome at least partially surrounding the gimbal assembly, the isothermal dome having a cooling tube disposed on an external surface of the isothermal dome to transfer heat from the gimbal assembly via conduction.

A cooler includes: a narrow flow path that has a narrow cross-sectional area; a wide flow path that is connected to a downstream side of the narrow flow path, is in thermal contact with a heating body, and has a wide cross-sectional area; and at least one rectifying piece that is provided in an upstream portion of the wide flow path that is an upstream side from a position being in thermal contact with the heating body. A fluid refrigerant flows through the narrow flow path and the wide flow path, and heat generated by the heating body is radiated. The rectifying piece includes: a single first angle portion that protrudes toward the upstream side; and a first surface and a second surface that join at an acute angle to form the first angle portion.

An optical measurement stability control system includes a case, a circulating flow field, an optical measurement system and a heat dissipation flow field. The case has an airtight space. The circulating flow field is located in the airtight space and adapted to generate an airflow flowing in the airtight space. The optical measurement system is located in the airtight space and located on a flow path of the airflow. The heat dissipation flow field is connected to the case and located at an end of the flow path. The heat dissipation flow field discharges heat out of the airtight space by heat conduction and forced convection.

An inner fin is a wave fin having board portions extending in a pipe longitudinal direction and a top portion connecting the board portions located adjacent with each other. The wave fin has a wave-shaped cross-section perpendicularly intersecting a pipe longitudinal direction, and the board portion is bent into a waveform extending in the pipe longitudinal direction when seen from a pipe layering direction. A wave pitch WP [mm], a wave depth WD [mm], and a passage width H [mm] are set to satisfy relationships of 2.2≤WP/WD≤4.28 and 0.5≤WD/H≤1.8.

One embodiment provides rotating shaft, including: a spindle comprising an internal first channel; a wheel casing operatively coupled to the spindle, wherein the wheel casing comprises an internal second channel; and a bearing housing the spindle, comprising a third channel located between the bearing and the spindle; wherein the first channel, the second channel, and the third channel are located to form an enclosed annular channel configured to hold a substance. Other aspects are described and claimed.

A computer cabinet includes at least one rackable server cooled by a cooling circuit; a cooling circuit supply device including: two cooling modules, each cooling module including: a primary hydraulic circuit; a secondary hydraulic circuit; a heat exchanger; a pump; a controller to control the pump; a central control unit connected to the controller of each of the cooling modules;
the central control unit being capable of activating one of the cooling modules while the other cooling module is inactive.

A space-saving, high-density modular data pod and a method of cooling a plurality of computer racks are disclosed. The modular data pod includes an enclosure including wall members contiguously joined to one another along at least one edge of each wall member in the shape of a polygon and a data pod covering member. Computer racks arranged within the enclosure form a first volume between the inner surface of the wall members and first sides of the computer racks. A second volume is formed of second sides of the computer racks. A computer rack covering member encloses the second volume and the data pod covering member form a third volume coupling the first volume to the second volume. An air circulator continuously circulates air through the first, second, and third volumes. The method includes circulating air between the first and second volumes via the third volume and the computer racks.

Methods of fabricating cooling apparatuses with coolant filters are provided which facilitate heat transfer from an electronic component(s). The method includes providing a cooling apparatus which includes a liquid-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a region of reduced cross-sectional coolant flow area. The heat sink includes a coolant inlet and outlet in fluid communication with the compartment, and the region of reduced cross-sectional coolant flow area provides an increased effective heat transfer coefficient between a main heat transfer surface of the conductive structure and the coolant. A coolant loop is also provided coupled to the coolant inlet and outlet to facilitate flow of coolant through the coolant-carrying compartment, and a coolant filter positioned to filter contaminants from the coolant passing through the heat sink. The coolant filter has a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area.