A pipe connector for connecting with an additional pipe connector includes a first leak-proof pipe, a first sleeve, at least one clamping element and a restricting structure. The first sleeve covers the first leak-proof pipe and allows the first leak-proof pipe to relatively slide therein. The clamping element and the restricting structure are disposed on the first sleeve. The restricting structure is capable of driving the clamping element to clamp or release the additional pipe connector at different positions.

A connector assembly includes cages arranged as an upper cage and a lower cage in an up-down direction, a receptacle connector, a first liquid cooling tray and a second liquid cooling tray. Each cage includes a frame and a plurality of partitioning walls provided to the frame, and the frame and the plurality of partitioning walls together define a plurality of insertion space arranged transversely. The first liquid cooling tray is provided to a top portion of the upper cage and constitutes an upper wall surface of each of the plurality of insertion space of the upper cage. The second liquid cooling tray is provided between the upper cage and the lower cage, constitutes a lower wall surface of each of the plurality of insertion spaces of the upper cage, and constitutes an upper wall surface of each of the plurality of insertion space of the lower cage. A pressuring spring corresponding to each insertion space of the upper cage is provided on the upper surface of the second liquid cooling tray, and a pressuring spring corresponding to each insertion space of the lower cage is provided on the bottom plate.

Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method that can provide more efficient cooling. An orifice plate includes an array of small diameter holes that correspond to high velocity jet locations and large diameter holes for the insertion of tubes to connect to lower pressure cavities.

The present disclosure relates to the field of printed circuit board technologies. A printed circuit board with good heat dissipation performance is provided and includes a substrate serving as a board body of the printed circuit board, a heating component embedded in the substrate, and a cooling liquid channel disposed in the substrate. The cooling liquid channel is disposed in the printed circuit board, and passes around the heating component to exchange heat with the heating component, so that a heat dissipation path is shortened and heat dissipation efficiency is improved, thereby quickening heat dissipation of the printed circuit board, and prolonging a service life of the printed circuit board.

A compute device includes a printed circuit board, at least three compute subassemblies disposed on the printed circuit board, and a liquid loop. The compute subassemblies disposed on the printed circuit board and each of the three compute subassemblies includes a thermal control plate defining a respective internal conduit therethrough. A temperature controlled liquid circuit circulates through the liquid loop through to control the temperature of each of compute subassemblies in series during operation, the liquid loop including each of the internal conduits in each of the thermal control plates in each of the compute subassemblies.

A choke structure with water cooling includes a water-cooled device, a choke assembly mounted on the water-cooled device, a ceramic heat spreader with high thermal conductivity set between the choke assembly and the water-cooled device, a metal housing having upper and lower openings installed on the water-cooled device to surround the choke assembly and the ceramic heat spreader with high thermal conductivity, and a printed circuit board is arranged on the upper opening of the metal housing, wherein the generated heat while operating the choke assembly is transmitted through a first heat conduction path formed by the ceramic heat spreader with high thermal conductivity in contact with the choke assembly and the water-cooled device for dissipating heat.

The present application provides a novel water cooling radiator with a detachable water pump and a built-in fan, which enables outside air to enter a cooling housing from air inlet holes in an upper end of the cooling housing and be discharged from air outlet holes in a lower end of the cooling housing, so that the air discharged from the air outlet holes can dissipate heat from and cool down various electronic components such as MOS tubes and memory chips around the motherboard and CPU, thereby improving the heat dissipation efficiency and prolonging the service life of the motherboard. A pump is connected externally to the radiator, which makes the installation and connection more convenient and the performance better.

An electronic device includes a circuit board, a package on package structure, a heat-conducting cover, and a heat-conducting fluid. The circuit board has a first surface and a second surface opposite to each other. The package on package structure is disposed on the first surface. The package on package structure has at least one heat generating element. The heat-conducting cover is disposed on the second surface and is in thermal contact with the circuit board. The heat-conducting cover and the second surface form an enclosed space. The heat-conducting fluid is filled in the enclosed space.

A knockdown water-cooling unit latch device structure includes a latch device assembly having multiple latch members. The latch members are correspondingly assembled with each other around a water-cooling unit. The latch members are connected with each other via at least one connection member. Alternatively, the latch members are directly assembled with each other by means of engagement or lap joint. The latch members of the latch device assembly are assembled with the water-cooling unit so that when the latch device assembly is assembled with the water-cooling unit, the latch members will not interfere with the water-cooling unit.

A knockdown water-cooling module latch device structure is assembled and connected with a water-cooling module. The knockdown water-cooling module latch device structure includes a latch device assembly having multiple latch members. The multiple latch members are correspondingly assembled and connected with each other around the water-cooling module to form the knockdown water-cooling module latch device structure, whereby the water-cooling module is framed in the latch device assembly. The knockdown water-cooling module latch device structure can be conveniently assembled and has high assembling freeness and better structural strength.