H05K7/2029

ELECTRONIC EQUIPMENT
20170265336 · 2017-09-14 · ·

An electronic equipment includes a refrigerant tank that contains a refrigerant, an electronic component, a through card electrically coupled to the electronic component, and a pouch of which one end side is in a close contact with the through card so as to seal the electronic component, wherein the electronic component is immersed in the refrigerant of the refrigerant tank in a state of being sealed in the pouch.

Apparatus with diffusion-absorption cycle

The invention relates to an apparatus (1) comprising a generator (5), an evaporator (6), an absorber (8) and a condenser (9) circulating a refrigerant (R), an inert (I) and an absorbent (A) in a diffusion-absorption cycle. The generator (5) and the evaporator (6) are arranged in an electric cabinet (2) to receive a heat load from primary electric components (3) and secondary electric components (4). The absorber (8) and the condenser (9) are arranged outside of the electric cabinet (2) and at a higher level than the evaporator (6) to receive fluid from the generator (5) and the evaporator (6) and for dissipating heat from the received fluid to the surrounding environment. The inert (I) and refrigerant (R) are selected such that the inert (I) is heavier than the refrigerant (R) in order to obtain fluid circulation where the inert (I) exiting the absorber (8) flows downwards to the evaporator (6) and the inert (I) exiting the evaporator (6) flows upwards to the absorber (8).

MISSILE COMPRISING ELECTRONICS AND A JUMPING-DROP VAPOUR CHAMBER

There is disclosed a missile comprising an outer skin, an electronics unit, and a thermal link between the electronics unit and the outer skin. The thermal link comprises a jumping drop vapour chamber arranged such that, when the outer skin is at an elevated temperature relative to the electronics unit, the electronics unit is thermally insulated from the outer skin; and such that, when the outer skin is at a lower temperature relative to the electronics unit, the electronics unit is thermally linked to the outer skin.

Azeotrope or azeotrope-like compositions of 1,2,2-trifluoro-1-trifluoromethylcyclobutane (TFMCB) and applications thereof

The present disclosure provides minimum-boiling, homogeneous azeotropic and azeotrope-like compositions of 1,2,2-trifluoro-1-trifluoromethylcyclobutane (“TFMCB”) with each of ethanol, n-pentane, cyclopentane, trans-1,2-dichloroethylene, and perfluoro(2-methyl-3-pentanone).

TWO-PHASE IMMERSION-TYPE HEAT DISSIPATION STRUCTURE
20230266076 · 2023-08-24 ·

A two-phase immersion heat dissipation structure is provided. The two-phase immersion heat dissipation structure includes an immersion-type heat dissipation substrate, a fin assembly, and a metal reinforcement frame. The immersion-type heat dissipation substrate has an upper surface having the fin assembly arranged vertically thereon and a lower surface used for contacting a heat generating element. The metal reinforcement frame is surroundingly in contact with a peripheral wall of the immersion-type heat dissipation substrate, and the metal reinforcement frame has two reinforcement side walls correspondingly protruding from a surface thereof. The two reinforcement side walls are arranged opposite to each other, and a height of the reinforcement side wall is between 5 mm and 15 mm. Each of the two reinforcement side walls has a plurality of through holes that horizontally pass through the reinforcement side wall and that are used for a replenishment of a two-phase coolant.

Composite heat dissipating structure and electronic device using the same

A thin-profile composite heat dissipating structure for a heat-generating electronic device includes a heat sink and a heat pipe, the heat sink includes a first housing, a first heat dissipation liquid, and a gas. The first housing is sealed to form a first cavity, the first heat dissipation liquid and the gas are received in the first cavity. The heat pipe is connected to the first housing and a wick structure to allow the return of the condensed heat dissipation liquid by capillary action is disposed elsewhere. An electronic device using the structure is also provided.

VAPOR CHAMBER

A vapor chamber is provided that allows space-saving and weight reduction of a device in which the vapor chamber is to be mounted. The vapor chamber has a container in which a cavity portion is formed by one plate-shaped body and another plate-shaped body facing the one plate-shaped body, and a working fluid enclosed in the cavity portion. The container includes a heat transfer portion that transfers heat by a phase change of the working fluid, and an extending portion that extends outwards from the heat transfer portion and has a function other than a heat transfer function.

COOLING SYSTEM
20230247805 · 2023-08-03 ·

The present disclosure provides a cooling system. The cooling system includes: a first set of fans mounted on an inward-facing side of an air inlet on an outer shell of a case; a second set of fans mounted on an inward-facing side of an air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans, a high-pressure airflow from the air inlet to the air outlet; a first heat sink connected to heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to a second heat sink; and the second heat sink mounted on an inward-facing side of the second set of fans and cooled by the high-pressure airflow.

METHOD, APPARATUS, AND COMPUTER PROGRAM PRODUCT FOR MULTIPHASE COOLING OF A MOBILE ELECTRONIC DEVICE

Methods, apparatuses, and computer program products are disclosed for providing a multiphase pumping mechanism configured for multiphase cooling of electrical charging circuitry. In the context of an apparatus, the apparatus includes a thermoelectric cooling device having first and second opposed surfaces and a fluid circulation path having first and second branches in thermal communication with the first and second surfaces, respectively, of the thermoelectric cooling device. The fluid circulation path is configured to control flow of fluid therethrough such that the fluid alternately flows through the first and second branches. The first branch of the fluid circulation path is also configured to be in a thermal communication with at least one first component of a mobile electronic device in order to absorb heat and correspondingly cool the at least one first component of the mobile electronic device.

AZEOTROPE OR AZEOTROPE-LIKE COMPOSITIONS OF 1,2,2-TRIFLUORO-1-TRIFLUOROMETHYLCYCLOBUTANE (TFMCB) AND APPLICATIONS THEREOF
20210348044 · 2021-11-11 ·

The present disclosure provides minimum-boiling, homogeneous azeotropic and azeotrope-like compositions of 1,2,2-trifluoro-1-trifluoromethylcyclobutane (“TFMCB”) with each of ethanol, n-pentane, cyclopentane, trans-1,2-dichloroethylene, and perfluoro(2-methyl-3-pentanone).