An illustrative example embodiment of an antenna device includes a substrate, a plurality of antenna elements supported on the substrate, an integrated circuit supported on one side of the substrate, and a metallic waveguide antenna situated against the substrate. The metallic waveguide antenna includes a heat dissipation portion in a thermally conductive relationship with the integrated circuit. The heat dissipation portion is configured to reduce a temperature of the integrated circuit.

A heat dissipation structure includes a heat dissipation member and a fixed member. The fixed member has a first surface and a second surface oppositely. The heat dissipation member is disposed on the first surface, and one part of the second surface corresponds to one side of at least one heat generating source and is disposed adjacent to the one side of the heat generating source. The first surface has a first zone surrounded by a second zone. The heat dissipation member is disposed on the first zone corresponding to the heat generating source. The second zone has at least one groove arranged around one part of the first zone. A distance between one side of the groove adjacent to the first zone and the first zone is less than 1.0 mm, and a volume ratio of the groove to the heat dissipation member is 0.9 to 1.6.

A modular data center and a method of building a modular data center. The modular data center includes a site microgrid including at least one power converter connected to a direct current (DC) bus and a digital power system. The digital power system includes at least one digital power transmitter, a set of transmission lines, and at least one digital power receiver. The modular data center design uses an adiabatic cooling system to cool the modular data center.

The present disclosure provides minimum-boiling, homogeneous azeotropic and azeotrope-like compositions of 1,2,2-trifluoro-1-trifluoromethylcyclobutane (“TFMCB”) with each of ethanol, n-pentane, cyclopentane, trans-1,2-dichloroethylene, and perfluoro(2-methyl-3-pentanone).

A vapor chamber and a manufacturing method thereof are disclosed. The vapor chamber includes a first housing, multiple supporting columns, a capillary structure, a second housing, a bonding layer, and a working fluid. The first housing includes an inner surface. Each supporting column is disposed on the inner surface of the first housing and includes an end surface. The capillary structure is disposed on the inner surface of the first housing. The second housing is sealed with the first housing correspondingly to jointly define a chamber. The bonding layer is formed between the inner surface of the first housing and the end surfaces of the supporting columns. The working fluid is arranged inside the chamber. Accordingly, it is able to swiftly changing the positions of the supporting columns according to the actual cooling needs, thereby significantly reducing the manufacturing time required.

A cooling plate module includes a first cooling plate layer having a single phase area within and a second cooling plate layer having a phase change area within. The first cooling plate layer includes a first liquid inlet port to receive a first cooling liquid into the single phase area and a first liquid outlet port to expel the first cooling liquid from the single phase area. The second cooling plate layer includes a second liquid inlet port to receive a second cooling liquid into the phase change and a vapor outlet port to expel the second cooling liquid in a vapor state from the phase change area, where the first cooling plate layer is in thermal contact with the second cooling plate layer, and the first cooling plate layer is in thermal contact with IT components to be cooled.

A thermal management unit includes a heat sink, which includes a base portion having a first side and a second side opposite the first side. The heat sink also includes a first protrusion structure and a second protrusion structure. The first protrusion structure protrudes from the first side of the base portion, and the first protrusion structure includes a plurality of fins. The second protrusion structure protrudes from the second side of the base portion, and the second protrusion structure includes a plurality of ribs.

A cooling system includes a dual plate structure having a porous material disposed between the plates such that the porous material is sealed from ambient at a pressure less than ambient. A cooling device is thermally coupled to a mobile device supported by the structure and actively removes heat from the mobile device.

Examples of a chassis component are described herein. In an example, the chassis component can have a recess having a mesh structure and a working fluid disposed therein. A conductive cover can seal the recess with the mesh structure and the working fluid therein.

Described herein are cooling hardware and methods for cooling a heterogeneous computing architecture. In one embodiment, a system for cooling a heterogeneous computing architecture includes a base stiffener; a top stiffener including a mounting channel; a printed circuit board (PCB) including multiple electronics and chips, the PCB that is attached to the base stiffener; and a cooling device mounted on top of the top stiffener. One or more heat transfer plates (HTP) are inserted into the top stiffener via the mounting channel to transfer heat generated by the hardware modules to the cooling device, while resistance channels inside the top stiffener are designed for ensuring proper loading pressure on the entire assembly.