The present disclosure provides methods and systems for heat exchange, such as cooling a heat source. A cooling system of the present disclosure may comprise a first channel that is configured to direct a liquid coolant, a second channel that is configured to direct a vapor coolant generated from the liquid coolant, and a condenser that is configured to permit the vapor coolant to undergo phase transition to the liquid coolant. The cooling system may further comprise at least one cooling interface in fluid communication with the first channel and the second channel. The cooling interface may be configured to facilitate heat exchange between the liquid coolant and a heat source.

A cooled electronic circuit board (10) comprising: a support circuit board (11) equipped with sockets (12a, 12b, 12c) mutually alongside each other for DIMM storage modules (13); DIMM storage modules (13) each equipped with a plug (14) which can be coupled with one of the sockets (12a, 12b, 12c); two supports (15, 16) for storage modules (13), having respective channels (17) for the passage of a cooling liquid; thermal conduits (18) connected to the channels (17), each located between two adjacent sockets (12a, 12b, 12c) of the support circuit board (11); heat diffusers (19) each equipped with two walls (20, 21) each covering a side of one of the storage modules (13).
The heat diffusers (19) are designed in such a way that, in use, two of the adjacent heat diffusers are in mutual thermal contact and in thermal contact with the thermal conduits (18) and with the supports (15, 16).

A heat dissipating module includes a heat dissipating assembly, a centrifugal fan, an airflow guiding hood and an auxiliary fan. The heat dissipating assembly includes a heat dissipating board and fins disposed thereon. Heat dissipating channels are formed between the fins. The centrifugal fan is disposed at a side of the heat dissipating channels. The airflow guiding hood covers the heat dissipating assembly and the centrifugal fan and is provided with a first airflow opening over the centrifugal fan, a second airflow opening over the fins and a third airflow opening at another side of the heat dissipating channels. The auxiliary fan is disposed between the fins and the second airflow opening.

A heat dissipating module includes a heat dissipating assembly, a centrifugal fan, an airflow guiding hood and an auxiliary fan. The heat dissipating assembly includes a heat dissipating board and fins disposed thereon. Heat dissipating channels are formed between the fins. The centrifugal fan is disposed at a side of the heat dissipating channels. The airflow guiding hood covers the heat dissipating assembly and the centrifugal fan and is provided with a first airflow opening over the centrifugal fan, a second airflow opening over the fins and a third airflow opening at another side of the heat dissipating channels. The auxiliary fan is disposed between the fins and the second airflow opening.

Heat dissipation system, a power converter using such a heat dissipation system, and an associated method of thermal management of the power converter are disclosed. The heat dissipation system includes a condenser, a first cooling loop, and a second cooling loop. The first cooling loop is coupled to the condenser and includes a first two-phase heat transfer device. The second cooling loop is coupled to the condenser and includes a second two-phase heat transfer device. The condenser is disposed above the first and second two-phase heat transfer devices.

The present disclosure relates to a power electronic device for a vehicle. The power electronic device includes at least one intermediate unit having at least one fluid duct system fluidically connected to a fluid inlet and a fluid outlet, at least one power electronic unit arranged at least at a surface of the at least one intermediate unit, and at least one heating device arranged at least at a surface of the at least one intermediate unit.

A server rack thermosiphon system includes a plurality of evaporators, each evaporator including a thermal interface for one or more heat-generating server rack devices; at least one condenser mounted to an external structure of a server rack, the condenser including a fluid-cooled heat transfer module; a liquid conduit that fluidly couples each of the evaporators to the condenser to deliver a liquid phase of a working fluid from the condenser to the evaporators; and a vapor conduit that fluidly couples each of the evaporators to the condenser to deliver a mixed phase of the working fluid from the evaporators to the condenser.

A cooling device includes: a case equipped with a supply port for a coolant and a discharge port for the coolant and a laminated core disposed in the case, the laminated core comprising a plurality of punched plates, each with the same shape, and each punched plate including: a plurality of linear portions that extend in waveform shapes in a flow direction of the coolant and that are spaced apart in an amplitude direction of the waveforms, and linking portions that are spaced apart in an extension direction of the linear portions and that link the linear portions to one another in the amplitude direction, the punched plates being alternately disposed front-to-back and the linear portions being superposed over one another, and the linking portions of the superposed punched plates being disposed spaced apart in the extension direction.

A pluggable electronic device includes a base, a heat source module and an upper cover. The base is made of a metal material. The heat source is disposed at the base. The upper cover covers the heat source module, is connected to the base, and includes an enclosed cavity and an operating fluid cyclically performing evaporation and condensation in the enclosed cavity.

A power module assembly is disclosed. A power module assembly according to an embodiment includes a module housing part having a power module, and an upper cover part and a lower cover part disposed to cover upper and lower sides of the module housing part, respectively, and defining a flow path part, through which cooling water flows, in spaces apart from the module housing part. The module housing part exposes a part of the power module on the flow path part. With the configuration, the cooling water can flow in direct contact with the power module, thereby more improving heat dissipation performance of the power module assembly.