A data storage enclosure for storing data on digital storage media has a lid that secures to a base. The enclosure has an upper insulating block that is located adjacent the lid and a lower insulating block that is located in the base. Each insulating block has a corresponding cover that overlays and protects its respective block. A storage unit has outer thermal management layers and a center layer located therebetween. The thermal management layers each contain a corresponding heat absorber that absorbs energy and changes from solid to liquid as the temperature of the storage unit begins to rise to excessive temperatures. The center layer contains a digital storage drive that is connected to a flexible cable that is connected to a sacrificial connector. When assembled, the insulating blocks and covers constrain and hold the storage unit and flexible cable.

An illustrative example embodiment of an antenna device includes a substrate, a plurality of antenna elements supported on the substrate, an integrated circuit supported on one side of the substrate, and a metallic waveguide antenna situated against the substrate. The metallic waveguide antenna includes a heat dissipation portion in a thermally conductive relationship with the integrated circuit. The heat dissipation portion is configured to reduce a temperature of the integrated circuit.

An evaporator includes: a first surface which conducts heat; a heat medium in the evaporator, which vaporizes as a result of the heat absorbed; a condenser which liquefies the heat medium in a vaporized state; a vapour pipe which guides the heat medium in the vaporized state from the evaporator to the condenser; and a liquid pipe which guides the heat medium in a liquefied state from the condenser to the evaporator. A first opening of the vapour pipe and a second opening of the liquid pipe are disposed in different positions from each other in a first direction, and are disposed so as to open into a heat medium accommodation space inside the evaporator at different positions from each other in a second direction, and which is different to the first direction, and also at different positions from each other in a third direction which intersects the first surface.

A projector having a cooling target includes a light source configured to emit light, a light modulator configured to modulate the light emitted from the light source, a projection optical device configured to project the light modulated by the light modulator, and a cooloer configured to cool the cooling target based on transformation of a refrigerant into a gas. The cooloer includes a refrigerant generator configured to generate the refrigerant from air, a refrigerant sender configured to transmit the refrigerant generated toward the cooling target, and a first duct configured to guide air including the refrigerant changed to a gas in the cooling target toward the refrigerant generator.

The present disclosure provides a cooling system. The cooling system includes: a first set of fans mounted on an inward-facing side of an air inlet on an outer shell of a case; a second set of fans mounted on an inward-facing side of an air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans, a high-pressure airflow from the air inlet to the air outlet; a first heat sink connected to heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to a second heat sink; and the second heat sink mounted on an inward-facing side of the second set of fans and cooled by the high-pressure airflow.

Systems and methods for cooling electrical components disposed in a jet engine. An example system includes an evaporation chamber configured to contain the electrical components in contact with a coolant liquid. The coolant vapor formed during the heat transfer from the electrical components to the coolant liquid flows to a condenser assembly having a fuel-cooled condenser and an air-cooled condenser. The air-cooled condenser cools the coolant vapor to condensation using either fan stream air or engine bleed air from the intermediate pressure compressor or the high pressure compressor. An air cycle machine cools the engine bleed air. A controller may be used to select a coolant source for condensing the coolant vapor based on operating conditions of the aircraft. Spent air from the air-cooled condenser may be recycled back to the engine for engine cooling, added thrust, oil sump buffering, oil or fuel cooling, or blade tip clearance control.

The present disclosure provides a thermal superconductive finned heat sink and an electrical equipment cabinet. The thermal superconductive finned heat sink includes: a base plate; a plurality of thermal superconductive fins inserted into the surface of the base plate; the thermal superconductive fin has a composite plate structure, a thermal superconductive channel line is formed in the thermal superconductive fin, the thermal superconductive channel line is a closed channel line, and is filled with heat-transfer working medium; the thermal superconductive fin has a U-shaped plate structure, including a flat plate main body and sides which bend relative to the flat plate main body; the projection area of the plurality of thermal superconductive fins, onto the plane where the base plate is located, is greater than the area of the base plate.

A data storage device includes a heat source including a memory, and an enclosure within which the heat source is installed. The data storage device also includes a heat spreader within the enclosure and surrounding the heat source. The data storage device further includes a thermal interface material within the enclosure. The thermal interface material is coupled to the heat source and to the heat spreader, thereby providing a first low thermal resistance path between the heat source and the heat spreader. A phase change material is coupled to the thermal interface material such that the thermal interface material provides a second low thermal resistance path between the heat source and the phase change material.

This application provides a method for manufacturing a heat dissipation structure of an electronic element, a heat dissipation structure, and an electronic device. The method includes: placing a substrate having an electronic element in an environment that meets a preset temperature condition; and in the environment that meets the preset temperature condition, covering a periphery of the electronic element with a heat dissipation cover, fixedly connecting the heat dissipation cover to the substrate, and placing a solid-state phase-change thermally conductive material in an accommodation cavity surrounded by the substrate and the heat dissipation cover.

A heat-transfer component defines a thermal-interface surface and has a metallic thermal-interface material bonded to the thermal-interface surface. The metallic thermal-interface material has a solid-to-liquid phase-change temperature between about 60 C. and about 90 C. With a thermal-interface material bonded to the thermal-interface surface, the thermal-contact resistance between the thermal-interface material and the heat-transfer component can be reduced or substantially eliminated compared to conventional thermal-interface materials, including conventional metallic thermal-interface materials. Also disclosed are electrical devices having a heat generating component cooled by such a heat-transfer component.