A thermal management unit includes a heat sink, which includes a base portion having a first side and a second side opposite the first side. The heat sink also includes a first protrusion structure and a second protrusion structure. The first protrusion structure protrudes from the first side of the base portion, and the first protrusion structure includes a plurality of fins. The second protrusion structure protrudes from the second side of the base portion, and the second protrusion structure includes a plurality of ribs.

A method for manufacturing the ultrathin heat dissipation structure includes providing a copper clad sheet, the copper clad sheet comprising an insulation layer and a copper clad layer; stamping the copper clad sheet to form a plurality of containing grooves and a plurality of ribs around each of the plurality of containing grooves, the cooper clad layer is used as an inner surface of the containing groove and the insulation layer is then an outer surface of the containing groove; providing bond blocks on each of the plurality of ribs; infilling phase-change material into the containing grooves of the copper clad sheet; providing a cover, pressing the cover to the bond blocks, the cover is fixed with the copper clad sheet by the bond blocks, the cover seals the containing grooves, and the phase-change material is received in the containing grooves; and solidifying the bond blocks.

A portable information handling system transfers thermal energy associated with operation of a CPU to a location distal the CPU with a vapor chamber thermally interfaced with the CPU. A pressure adapter interfaced with the vapor chamber selectively changes the pressure within the vapor chamber to adjust the saturation point of a liquid in the vapor chamber that manages thermal transfer efficiency. For example, a controller interfaced with the pressure adapter modifies thermal transfer characteristics of the vapor chamber to control thermal conditions at the information handling system, such as in response to a temperature sensed at a housing surface, a battery, a display or at other locations of the information handling system.

Embodiments herein relate generally to a system to efficiently remove heat generated by equipment/server racks of data center, wherein a chamber is provided to contain, channel, and diffuse the heat or heated air to a heat removal cabinet, thereby a cooling can take place, furthermore the amount of cooling is configurable by altering angle of diffusion.

A thin-profile composite heat dissipating structure for a heat-generating electronic device includes a heat sink and a heat pipe, the heat sink includes a first housing, a first heat dissipation liquid, and a gas. The first housing is sealed to form a first cavity, the first heat dissipation liquid and the gas are received in the first cavity. The heat pipe is connected to the first housing and a wick structure to allow the return of the condensed heat dissipation liquid by capillary action is disposed elsewhere. An electronic device using the structure is also provided.

A method for manufacturing a device temperature controller includes filling an inside of a circuit with working fluid by connecting a filling port of the circuit to a container that stores gas phase working fluid. The circuit constitutes a thermosiphon heat pipe and allows the working fluid to circulate in the circuit. In the filling, the working fluid inside the circuit is cooled by a cooling source. An inside temperature of the circuit is decreased to be lower than an inside temperature of the container, and thereby an inside pressure of the circuit is decreased to be lower than an inside pressure of the container.

The present disclosure provides a cooling system. The cooling system includes: a first set of fans mounted on an inward-facing side of an air inlet on an outer shell of a case; a second set of fans mounted on an inward-facing side of an air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans, a high-pressure airflow from the air inlet to the air outlet; a first heat sink connected to heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to a second heat sink; and the second heat sink mounted on an inward-facing side of the second set of fans and cooled by the high-pressure airflow.

The present invention comprises: a base receiving heat from a heat source; a hollow cylinder-shaped fixed cylinder fixedly receiving the heat from the base, an opening thereof being closed by the base; fixed fins fixedly provided at the fixed cylinder to receive the heat from the fixed cylinder; a piston slidably blocking the inside of the fixed cylinder forming an accommodation chamber for a phase change material; and an elastic member for applying force toward the base with respect to the piston, wherein at low temperature heat, the phase change material changes a phase in a volume reducing direction, and the piston is returned to a backward position at the side of the base, and at high temperature heat, the phase change material changes the phase in a volume increasing direction, and the piston is operated to move from the backward position to a forward position.

A server heat dissipation structure, configured to dissipate the heat of a host casing of a dense type server. The server heat dissipation structure includes a thermosiphon heat sink and a fan assembly. The thermosiphon heat sink includes a heat absorbing end and a heat dissipation end that are connected via a connection tube. The fan assembly is disposed on a side of the heat dissipation end so as to help the heat dissipation of the heat dissipation end.

An illustrative example embodiment of an antenna device includes a substrate, a plurality of antenna elements supported on the substrate, an integrated circuit supported on one side of the substrate, and a metallic waveguide antenna situated against the substrate. The metallic waveguide antenna includes a heat dissipation portion in a thermally conductive relationship with the integrated circuit. The heat dissipation portion is configured to reduce a temperature of the integrated circuit.