A thermal management unit includes a heat sink, which includes a base portion having a first side and a second side opposite the first side. The heat sink also includes a first protrusion structure and a second protrusion structure. The first protrusion structure protrudes from the first side of the base portion, and the first protrusion structure includes a plurality of fins. The second protrusion structure protrudes from the second side of the base portion, and the second protrusion structure includes a plurality of ribs.

A heat sink assembly for use with at least one heat-emitting component where the heat sink assembly includes a first phase change material conductively coupled to the at least one heat-emitting component and changing phase at a first temperature and a second phase change material conductively coupled to the first phase change material and changing phase at a second temperature, which is greater than the first temperature.

A projector having a cooling target includes a light source configured to emit light, a light modulator configured to modulate the light emitted from the light source, a projection optical device configured to project the light modulated by the light modulator, and a cooloer configured to cool the cooling target based on transformation of a refrigerant into a gas. The cooloer includes a refrigerant generator configured to generate the refrigerant from air, a refrigerant sender configured to transmit the refrigerant generated toward the cooling target, and a first duct configured to guide air including the refrigerant changed to a gas in the cooling target toward the refrigerant generator.

Cryogenic analytical systems are provided that can include: a cryogenic fluid source; one or more analysis components; at least one cryogenic thermal conduit operably coupled between the cryogenic fluid source and the one or more analysis components; and a pressure control component operably engaged with the cryofluid source. Methods for performing cryogenic analysis are provided. The methods can include adjusting the pressure of cryofluid within a cryogenic fluid source to configure one or more analysis components with a cryogenic temperature. Methods for configuring a cryogenic analytical system to perform cryogenic analysis are also provided. The methods can include: increasing the pressure within a cryogenic fluid source to rapidly cool one or more analysis components to a first temperature; and decreasing the pressure within the cryogenic fluid source to reduce the first temperature of the one or more analysis components.

A cooling device includes an evaporator configured to evaporate working fluid in a liquid phase due to a heat transferred from a cooling target, a condenser configured to condense the working fluid in the vapor phase, a vapor pipe through which the working fluid changed to the vapor phase in the evaporator flow into the condenser, and a liquid pipe through which the working fluid changed to the liquid phase in the condenser flow into the evaporator. The condenser has a phase change flow channel into which the working fluid in the vapor phase inflows via the vapor pipe, and through which the working fluid changed in phase from the vapor phase to the liquid phase flow out to the liquid pipe. The phase change flow channel has a reduced diameter part having a flow channel cross-sectional area decreasing in a direction from upstream toward downstream of the working fluid.

A liquid flow path portion of a vapor chamber according to the present invention includes a plurality of main flow grooves which each extend in the first direction and through which working fluid in liquid form passes. A convex array which includes a plurality of liquid flow path convex portions arranged in the first direction via a communicating groove, is provided between a pair of the main flow grooves adjacent to each other. Each of the communicating grooves allows communication between the corresponding pair of the main flow grooves. The width of the communicating groove is larger than the width of the main flow groove.

The present invention relates to a capsule type heat conduction column and a method for manufacturing the same. The method comprises the steps of mixing a thermally conductive base material thoroughly, stuffing and compacting the thermally conductive base material into a capsule formed by a first pipe and a second pipe, and sealing the capsule by a plurality of thermal interface materials. Each of the first pipe and the second pipe has a first opening and a second opening at two terminals thereof, and the second opening of the first pipe is assembled to the first opening of the second pipe.

An electrical-circuit assembly includes an electrical-device and a heat-sink. The heat-sink has a base having a first-surface and a second-surface. The first-surface is in thermal communication with the electrical-device. The heat sink also has a lid having a third-surface and a fourth-surface. The third-surface faces toward the second-surface. The heat sink also has side-walls disposed between the base and the lid extending from the second-surface to the third-surface. The base, the lid, and the side-walls define a cavity. The heat sink also has a porous-structure extending from the second-surface toward the third-surface terminating a portion of the distance between the second-surface and the third-surface thereby defining a void between the porous-structure and the third-surface. The base, the side-walls, and the porous-structure are integrally formed of a common material. The porous-structure is characterized as having a contiguous-porosity network. The heat sink also has a heat-transfer-fluid disposed within the cavity.

The present invention relates to a capsule type heat conduction column and a method for manufacturing the same. The method comprises the steps of mixing a thermally conductive base material thoroughly, stuffing and compacting the thermally conductive base material into a capsule formed by a first pipe and a second pipe, and sealing the capsule by a plurality of thermal interface materials. Each of the first pipe and the second pipe has a first opening and a second opening at two terminals thereof, and the second opening of the first pipe is assembled to the first opening of the second pipe.

Examples of a thermal management unit and an electronic apparatus utilizing the thermal management unit are described. In one aspect, the thermal management unit includes a heat sink. The heat sink includes a base portion, a first protrusion structure and a second protrusion structure. The base portion has a first side and a second side opposite the first side. The first protrusion structure protrudes from the first side of the base portion, and includes multiple fins. The second protrusion structure protrudes from the second side of the base portion, and includes multiple ribs. The heat sink may be made of silicon.