An electronic device system that includes electronic devices and a cooling device to cool an object of the electronic devices. The cooling device includes coolers; a water-supply pipe that has branch pipes and supplies a coolant to the coolers, each of the branch pipes being coupled with each of the coolers; a waste pipe that has branch pipes, each of which is coupled with each of the coolers; a circulation pipe that couples an inlet of the water-supply pipe with an outlet of the waste pipe and has a pump to discharge the coolant and a coolant cooler to cool the coolant; and a bypass flow path that is coupled with at least a top edge portion of the water-supply pipe, bypasses the plurality of coolers, and is coupled with the waste pipe. The coolant having passed through the coolers is exhausted to the waste pipe.

An edge seal for a modular thermal isolation barrier for preventing passage of air through a gap in a data processing equipment arrangement includes a seal portion and a base portion. The seal portion is formed of a resilient material capable of deflection by a rigid adjacent structure. The base portion is formed of a rigid material and includes a pair of side channels opening at opposite sides thereof and a panel-receiving end channel. Each of the pair of side channels includes a first distal flange arranged to extend inwardly from one side of the respective channel and a second distal flange arranged to extend inwardly, and toward the first distal flange, from the other side of the respective channel, whereby each side channel is generally C-shaped and includes a channel opening having a width that is narrower than a width of a channel interior. Each of the seal portion and the base portion has a generally uniform cross-sectional shape.

A carrier for different electronic components for installation in an expansion card for a computing device is disclosed. The carrier conforms to M.2 standards such as an M.2 22110 form factor. The carrier has a top heat sink and a bottom heat sink. A circuit board includes the electronic device. The circuit board is seated between the top heat sink and the bottom heat sink. A side clip includes a top panel and a bottom panel. The side clip has an open position and a closed position. When the side clip is in the closed position, the top panel of the side clip contacts the top heat sink, and the bottom panel of the side clip contacts the bottom heat sink, to hold the top heat sink to the bottom heat sink.

Technologies for connecting data cables in a data center are disclosed. In the illustrative embodiment, racks of the data center are grouped into different zones based on the distance from the racks in a given zone to a network switch. All of the racks in a given zone are connected to the network switch using data cables of the same length. In some embodiments, certain physical resources such as storage may be placed in racks that are in zones closer to the network switch and therefore use shorter data cables with lower latency. An orchestrator server may, in some embodiments, schedule workloads or create virtual servers based on the different zones and corresponding latency of different physical resources.

A serving rack cooling device. The device includes a rack; an enclosure provided inside the rack; a module provided inside the enclosure; a main pipe provided in the rack; a branching tube connected to the main pipe; a cooling unit that cools a heat-generating component mounted on the module; a first connection tube that connects the branching tube with the cooling unit; and a plurality of module connection portions that are provided inside the enclosure and to which the module is connected. The enclosure can slide in a state in which the module is connected to the module connection portion, and the cooling unit and the branching tube are connected by the first connection tube.

A data center, an air handling system, and a method for installing equipment in a data center enable internal differential pressure relief within the data center. A volumetric container has mounting location(s) for heat generating information technology (IT) component(s) positioned within the volumetric container. A cold aisle on one side and a hot aisle on another side of the IT component(s) that have air passages for air cooling. A cooling unit is coupled to the volumetric container to pressurize the cold aisle with supply air and draws return air from the hot aisle. An air barrier is attached across an air passage between the cold and the hot aisles. A differential pressure relief mechanism is attached to the air barrier. The differential pressure relief mechanism is configured to open in responses to an air pressure difference across the differential pressure relief mechanism exceeding a pressure threshold.

Embodiments are generally directed apparatuses, methods, techniques and so forth to select two or more processing units of the plurality of processing units to process a workload, and configure a circuit switch to link the two or more processing units to process the workload, the two or more processing units each linked to each other via paths of communication and the circuit switch.

Systems and methods for cooling a vehicle computing system are provided. A computing system can include a first cooling baseplate including a first planar cooling surface and a second cooling baseplate including a second planar cooling surface. The computing system can further include one or more computing devices including a processor blade positioned on the first planar cooling surface, a coprocessor blade positioned on the second planar cooling surface, and a flexible connector coupled between the processor blade and the coprocessor blade. The flexible connector can be configured to transfer at least one of data or electric power between the processor blade and the coprocessor blade. The first planar cooling surface can be configured to transfer heat from the processor blade to a cooling fluid via conduction. The second planar cooling surface can be configured to transfer heat from the coprocessor blade to the cooling fluid via conduction.

A system for passively exhausting air from a structure includes at least one pair of modules arranged on a roof of the structure. Each module has an exhaust face on one side and a sloped surface on the opposite side, and can receive exhaust air that flows upward from inside the structure. The modules can be arranged in pairs facing one another, with one of the sloped surfaces facing a direction of an environmental flow of air, so that the environmental air can flow up the sloped surface of one module and down the sloped surface of the other module without impinging on the exhaust faces of either module. The pairs can also be arranged side-by-side in an array, which can be expanded with additional pairs of modules to exhaust from the structure at a greater rate.

A computing system comprising a portable computer and a reader are disclosed. The portable computer is pocket-sized and comprises flash memory, and optionally a processor and a GPS chip. The reader includes a monitor, a keyboard with docking port and an optional processor and at least one input/output USB connector. A user cannot interact with the portable computer without the reader. The reader is a non-functioning “shell” without the portable computer, however, when they are connected the system becomes a fully functional personal computer. To log on, a user provides security information, for example, a password or biometrics, such as fingerprints. The credit card size and capabilities of the portable computer allows a user to easily carry virtually their entire computer in a pocket for use anywhere there is a reader. In addition, the portable computer provides security against unauthorized use, even if lost or stolen.