Patent classifications
H05K7/20845
ELECTRONIC ASSEMBLY
The present invention relates to an electronic assembly (1) comprising: a base plate (2); an electronic component (3) having a plurality of pins (30) which each extend parallel to a press-in axis (4); a printed circuit board (5) which is pressed onto the pins (30) along the press-in axis (4); a cooling region (6) which is formed between the electronic component (3) and the base plate (2); and a sealing arrangement (7) which is located between the base plate (2) and the electronic component (3) and is designed to seal the cooling region (6), wherein the sealing arrangement (7) has a seal support (71) and at least one seal (72), the seal support (71) has a plurality of press-in domes (75) projecting parallel to the press-in axis (4), and the electronic component (3) is supported by means of the press-in domes (75) of the seal support (71) in order to absorb a press-on force (40) when the printed circuit board (5) is pressed onto the pins (30).
COOLING SYSTEM
A cooling system includes a cooling path through which a heat medium flows in an order of the first unit and the second unit, a temperature sensor detecting a temperature of the heat medium flowing into the first unit, and a control device controlling operations of the first unit and the second unit. The control device is configured to execute a temperature estimation process for estimating a temperature of the heat medium flowing into the second unit. The temperature estimation process includes a process of acquiring the temperature detected by the temperature sensor, a process of calculating a temperature increase amount of the heat medium in the first unit, and a process of determining an estimated value of the temperature of the heat medium flowing into the second unit by adding the calculated temperature increase amount to the temperature detected by the temperature sensor.
ELECTRONIC HOUSING ELEMENT COMPRISING A RADIATOR, AND ASSOCIATED ADJUSTMENT METHOD
An electronic housing element intended to be fastened to a circuit board having a component to be cooled, including: a frame made of plastics material having a rigid surround and an upper wall, and a radiator intended to cool the component, having: a gripping portion protruding from the upper wall of the frame and designed so as to engage with gripping claws of a gripping device, and a holding portion engaging with the upper wall of the frame. The upper wall of the frame is formed from a material that has a deflection temperature under load and is designed to deform in order to allow the orientation of the radiator to be adjusted when the upper wall reaches the deflection temperature under load.
Multi-tier cooling system without load perception
The disclosed embodiments provide a cooling system with an auxiliary system that extends a main system. The auxiliary system includes a vapor container that receives vapor from the IT load, an auxiliary condenser that receives vapor from the vapor container via a compressor or a vapor valve, and condenses the vapor into liquid to be stored in a liquid container. The auxiliary system further includes a fluid pump on a cooling loop for cooling the auxiliary condenser, and a cooling controller that includes a machine learning model for regulating operations of the vapor valve, the fluid pump, and the first compressor based on a pre-created profile of the IT load and real-time information from at least one of many sources, including the vapor container and the liquid container. The auxiliary system includes multiple cooling tiers that can be partially trigger or completely trigger based on several indicators collected multiple sensors in the auxiliary system.
Vehicle Computing System Cooling Systems
Systems and methods for cooling a vehicle computing system are provided. A computing system can include a first cooling baseplate including a first planar cooling surface and a second cooling baseplate including a second planar cooling surface. The computing system can further include one or more computing devices including a processor blade positioned on the first planar cooling surface, a coprocessor blade positioned on the second planar cooling surface, and a flexible connector coupled between the processor blade and the coprocessor blade. The flexible connector can be configured to transfer at least one of data or electric power between the processor blade and the coprocessor blade. The first planar cooling surface can be configured to transfer heat from the processor blade to a cooling fluid via conduction. The second planar cooling surface can be configured to transfer heat from the coprocessor blade to the cooling fluid via conduction.
Modular packaging for rugged electronics enclosures
A cabinet enclosure for mounting to a vehicle and providing an inner cavity isolated from a surrounding environment. The cabinet enclosure includes a removable module including a frame and a plurality of mounts on the frame for receiving an electrical component. A housing defines the inner cavity and includes a plurality of predefined mounting locations within the inner cavity configured to receive the removable module. The housing is configured to protect the inner cavity from exposure to moisture, heat, vibration and/or electromagnetic forces. An interface element secures the housing to a vehicle.
Electric power device
An electric power device includes a power control unit that is fixed to an upper portion of an automatic transmission case, with a gap interposed between the power control unit and the automatic transmission case, and a battery that is connected to the power control unit by a first wire extending rearward in a vehicle front-rear direction from the power control unit.
MODULAR ELECTRICAL ASSEMBLY COMPRISING AN INTEGRATED COOLING SYSTEM
The invention relates to an electrical assembly, in particular for a vehicle, comprising a casing (13), at least one electrical module (11) having at least one electrical component to be cooled, a cooling module (12) comprising at least two fluid orifices (122), at least one cooling duct provided in said cooling module (12), configured to form a portion of a cooling circuit and to provide a fluidic connection between said fluid orifices (122), said at least one electrical module (11) being connected to said cooling module (12) in order for the electrical module (11) to be cooled, said casing (13) being connected to said cooling module (12) so as to define a free volume, said free volume accommodating said at least one electrical module (11) so as to form an independent module configured to be connected to a frame of an item of electrical equipment.
ELECTRONIC DEVICE
An electronic device according to an embodiment includes a substrate, a first electric part, a second electric part, a chassis, and heat radiating fins. The first electric part is mounted on the substrate. The second electric part is mounted on the substrate, the second electric part having a height that is smaller than a height of the first electric part. The chassis houses therein the substrate, the first electric part, and the second electric part. Heat radiating fins protruding from an outer surface of the chassis. The heat radiating fins continuously extend from a side of the second electric part to a side of the first electric part. A portion of the outer surface of the chassis between the first electric part and the second electric part is formed in a slope.
ELECTRONIC CONTROL UNIT
An electronic control unit for a vehicle. The electronic control unit is defined by a housing comprising a cover, a base, a circuit board, a connector and a backup power supply, and means for mounting the cover to the base. A carrier is provided for supporting the backup power supply. The carrier is arranged inside the housing and mounted directly to the base.