A reactor unit includes reactors; and a cooler. The reactors are disposed in at least one line on a reactor cooling surface that is one of outer surfaces of the cooler. The cooler has a cooling medium flow passage that is in contact with an inner surface on a reverse side of the reactor cooling surface. The cooling medium flows linearly from an inlet portion to an outlet portion of the cooling medium flow passage. A direction in which the cooling medium flows inside the cooling medium flow passage is same as a direction in which the reactors are disposed in the at least one line. Cooling fins are provided on the inner surface on the reverse side of the reactor cooling surface. A longitudinal direction of each cooling fin is same as the direction in which the cooling medium flows inside the cooling medium flow passage.

A control box includes a housing defining an interior, the housing including a cover and a stiffener, the stiffener removably connected in contact with the cover, the stiffener including an outer frame and at least one cross-member. The control box further includes a heat sink removably connected in contact with the stiffener. The control box further includes a first circuit board disposed within the interior, the first circuit board positioned between the stiffener and the heat sink, and a second circuit board disposed within the interior, the second circuit board positioned between the cover and the stiffener. The cover, stiffener, and heat sink are stacked along a transverse direction.

A SOM circuit board includes a main body having a first face surface, an opposing second face surface, a first side surface, an opposing second side surface, a first end surface, and an opposing second end surface. The first and second side surfaces have maximum lengths along a longitudinal direction which are greater than maximum lengths of the first and second end surfaces along a lateral direction. The SOM circuit board further includes a plurality of computing components, each of the plurality of computing components mounted on one of the first face surface or the second face surface. The SOM circuit board further includes an input/output connector mounted on the second face surface. The SOM circuit board further includes a plurality of mounting holes extending along the transverse direction through and between the first face surface and the second face surface.

A wireless device charger is configured to produce an alternating magnetic field, thereby inducing an alternating electrical current within a capture coil of a personal electronic device proximate to the wireless device charger. The wireless device charger includes a source coil having a ferrite element configured to generate the alternating magnetic field, a housing formed of a thermally conductive material in thermal communication with the ferrite element, and an air movement device configured to produce a turbulent air flow across a surface of the housing flowing from an air inlet to an air outlet, thereby reducing a housing temperature.

Example embodiments relate to an air cooling system for an electronic spinning assembly. An example embodiment includes a plurality of vanes coupled to a static base. A vane cover is rotatably coupled to the static base. The vane cover includes at least one air inlet, at least one air duct extending from the vane cover, and at least one choke point disposed in the cover. The at least one choke point is configured to increase a pressure of the airflow.

A propulsion system having an axial direction relating to a principal direction of propulsion, and a height direction perpendicular to the axial direction. The propulsion system includes a duct configured to convey a flow of fluid along the axial direction, and a heat exchanger disposed within the duct. The heat exchanger is defined between an inlet face and an outlet face and is configured to convey the flow of fluid from the inlet face to the outlet face. A heat exchanger length is defined as a minimum distance between the inlet face and the outlet face and wherein the heat exchanger length varies along the height direction such that a resistance to the flow of fluid through the heat exchanger varies along the height direction.

A battery system for a vehicle includes multiple battery cells each configured to store charge for powering an electric vehicle, a high voltage bus electrically coupled with the multiple battery cells to provide power to an electric motor, and multiple cell monitoring modules each coupled with a corresponding one of the multiple battery cells, each cell monitoring module including a controller configured to monitor operation parameters of the corresponding one of the multiple battery cells. The system includes multiple DC-DC converters in a converter housing, each DC-DC converter electrically coupled with a corresponding one of the multiple battery cells outside of the converter housing, and a low voltage bus electrically connected between the multiple DC-DC converters in the converter housing and at least one vehicle electrical component outside of the converter housing. The low voltage bus is configured to provide low voltage power to at least one vehicle electrical component.

The present disclosure relates to electronic devices and configurations. In one embodiment, an electronic device includes a plurality of circuit boards and a plurality of chassis enclosures. Each of the plurality of circuit boards is separately housed by a chassis enclosure. Each chassis enclosure includes a front housing and a back housing, the front housing and back housing configured to retain a circuit board, and at least one heat dissipation element. The plurality of chassis enclosures are mounted to provide an air gap for heat dissipation between each chassis enclosures. Each chassis enclosure electrically shields a retained circuit board.

The present disclosure relates to electronic devices and configurations. In one embodiment, an electronic device includes a plurality of circuit boards and a plurality of chassis enclosures. Each of the plurality of circuit boards is separately housed by a chassis enclosure. Each chassis enclosure includes a front housing and a back housing, the front housing and back housing configured to retain a circuit board, and at least one heat dissipation element. The plurality of chassis enclosures are mounted to provide an air gap for heat dissipation between each chassis enclosures. Each chassis enclosure electrically shields a retained circuit board.

The invention relates to an electrical assembly, in particular for a vehicle, comprising a casing (13), at least one electrical module (11) having at least one electrical component to be cooled, a cooling module (12) comprising at least two fluid orifices (122), at least one cooling duct provided in said cooling module (12), configured to form a portion of a cooling circuit and to provide a fluidic connection between said fluid orifices (122), said at least one electrical module (11) being connected to said cooling module (12) in order for the electrical module (11) to be cooled, said casing (13) being connected to said cooling module (12) so as to define a free volume, said free volume accommodating said at least one electrical module (11) so as to form an independent module configured to be connected to a frame of an item of electrical equipment.