A vehicle includes a vehicle body, a vehicle seat, an inverter and an inverter cover. The vehicle body defines a vehicle interior. The vehicle seat is disposed on a floor of the vehicle interior. The inverter has a housing fixed to the floor of the vehicle interior at a location underneath the vehicle seat. The inverter cover is detachably attached to the inverter housing.

This description provides a system for recovering energy released by a computing unit. The system comprises a first computing unit that generates heat energy as the first computing processes information, an energy recovery unit configured to recover the heat energy generated by the first computing unit, and a second computing unit coupled to the energy the energy recovery unit. The energy recovery unit further comprise a pump configured to transport a working fluid to absorb the heat energy generated by the first computing device and a conversion device configured to convert the absorbed heat energy into electrical energy. The electrical energy is passed to the second computing unit to supply power for the second computing unit to process information.

MRI system cabinet having a cabinet body with electronics and a water cooler with a water cooling loop. The water cooling loop divides the cabinet body into first and second cabinet spaces, and the electronics are along the first and second cabinet spaces. An air cooler is along the central axis of the water cooler and has a fan. A cooling cycle is formed where, on a first side, the fan generates a first air flow, which is sent to the first cabinet space through a first air path, and a second air flow, which is sent to the second cabinet space through a second air path. After flowing through the first and second cabinet spaces, the first and second air flows are guided into the water cooling loop for heat exchange under the suction action of the fan on a second side, and then directed into the air cooler.

An electronic device includes a system board, a power module and a conductive part. The system board includes a first surface and a second surface opposite to each other. The power module is disposed on the second surface and provides power to the semiconductor device through the system board. The conductive part is disposed on a first side of the power module adjacent to the second surface, wherein the conductive part is electrically connected with the and the system board, wherein the power is transmitted between the and the semiconductor device through the conductive part. The power module includes at least one switch circuit and a magnetic core assembly. The at least one switch circuit disposed on a second side of the power module away from the conductive part. The magnetic core assembly is arranged between the switch circuit and the conductive part.

A power electronics assembly includes one or more power electronics devices, and a heat exchanger to which the one or more power electronics devices are mounted. The heat exchanger includes an inlet manifold and an outlet manifold, and one or more fluid pathways extending connecting the inlet manifold and the outlet manifold, the heat exchanger configured to transfer thermal energy from the one or more power electronics devices into a flow of fluid passing through the one or more fluid pathways. Thee one or more fluid pathways include one or more internal enhancements and channel configurations to enhance thermal energy transfer by promoting boiling of the flow of fluid and to reduce the pressure drop in the pathways under a two-phase flow condition. The flow of fluid is a flow of liquid refrigerant diverted from a condenser of a heating, ventilation, and air conditioning (HVAC) system.

An integrated power control assembly configured as an inverter for a motor is mounted directly on an axial end of the motor. The integrated power control assembly includes one or more power plates, one or more cooling plates coaxially disposed on and thermally connected to the one or more power plates, and one or more circuit boards circumferentially disposed around the one or more power plates. An individual power plate has a power card having one or more switching semiconductor devices corresponding to individual phases of the motor. The individual power card is electrically coupled to the motor through one or more busbars. An individual circuit board is electrically coupled to an individual power card corresponding to an individual phase of the motor. The individual circuit board has a first surface electrically coupled to the one or more power plates and a second surface opposite to the first surface.

According to an aspect of the present disclosure, provided is a DC converter, including a main housing having an accommodation space formed therein; a cooling module which is coupled to the main housing to partition the accommodation space into a plurality of spaces and to discharge heat generated in the accommodation space to the outside; an inductor module which is accommodated in any one space of the spaces partitioned into a plurality and located adjacent to the cooling module; and a capacitor module which is accommodated in the other one space of the spaces partitioned into a plurality and located adjacent to the cooling module.

A power module comprises a first circuit board assembly and a magnetic core assembly. The first circuit board assembly comprises a first printed circuit board and at least two switch circuits disposed on the first printed circuit board. The magnetic core assembly is disposed near the first printed circuit board and comprises a magnetic core portion and at least one pair of first electrical conductors. The magnetic core portion comprises at least one core unit, the core unit comprises a pair of holes and a second magnetic overlapping region, and the pair of holes are separated by the second magnetic overlapping region. Each pair of the first electrical conductors is penetrated through the corresponding pair of holes of the magnetic core portion to define two output inductors. Each of the switch circuits is electrically connected with the corresponding output inductor to define a phase circuit of the power module.

An inverter unit includes a switching element unit, a control board, a cooler, and an inverter case. The inverter case is integrally fixed to a rotating electrical machine case. The cooler is disposed so as to be in contact with the switching element unit on an opposite side to a rotating electrical machine side. The control board is disposed on the rotating electrical machine side of the switching element unit.

No consideration is given to heat transferred from a semiconductor module to a capacitor via a bus bar module. The heat generated by a semiconductor module (1) is transferred to a bus bar module (3) via a DC terminal (1A) of the semiconductor module (1). As illustrated in FIG. 4(B), the heat transferred to the bus bar module 3 is then transferred to the pressing member 5 via the annular conductor 8 and the bolt 5A. Since the pressing member 5 is in close contact with the second cooler 2B, the heat transferred to the pressing member 5 is cooled by the second cooler 2B. On the other hand, the heat transferred to the convex portion 6A of the housing 6 is transferred to the first cooler 2A via the housing 6 and cooled. As a result, in the configuration in which a capacitor (4) is connected to the semiconductor module (1) via the bus bar module (3), the heat transferred from the semiconductor module (1) to the capacitor (4) can be suppressed.