A mechanical assembly includes a power semiconductor device located inside of a mechanical enclosure, and a magnetic component located outside of the mechanical enclosure and operably connected to the power semiconductor device. The power semiconductor device and the magnetic component are cooled via a common air pathway outside of the mechanical enclosure. A power converter includes a powered semiconductor device located inside of a mechanical enclosure, the power semiconductor device configured to convert DC input power to AC output power, and an inductor located outside of the mechanical enclosure and operably connected to the power semiconductor device. The power semiconductor device and the magnetic component are cooled via a common air pathway outside of the mechanical enclosure.

An energy storage system may include a battery pack having a plurality of battery cells, a power converter, a pump which supplies a fluid to the battery pack or the power converter, a radiator which heat-exchanges the fluid flowing by the pump with air, a first valve which sends a fluid discharged from the pump to the power converter or the battery pack, and a second valve which sends the fluid discharged from the power converter to the battery pack or the radiator.

In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.

In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.

Carrier module (1) for at least one semiconductor element (3) having a passively and/or actively cooled carrier (4) which has a positive carrier contact (5) and a negative carrier contact (6), with a device (2) for bridging the at least one semiconductor element (3) arranged on the carrier (4), comprising at least one first printed circuit board (7) with at least one bridging element (8), wherein at least one positive contact (9) which is electrically conductively connected to the positive carrier contact (5) and at least one negative contact (11) which is electrically conductively connected to the negative carrier contact (6) are provided on a first printed circuit board (7) and the bridging element (8) is electrically conductively connected to the positive contact (9) and to the negative contact (11) of the first printed circuit board (7), wherein the first printed circuit board (7) is thermally conductively and releasably connected to the carrier (4).

A current shaping phase leg bus bar for power electronics systems includes a first terminal connector, a second terminal connector, insulated from the first terminal connector, and a third terminal connector, insulated from the first and second terminal connectors. At least one of the terminal connectors is a current shaping terminal connector that includes one or more layers having a plurality of pre-defined locations for electrical connections, said plurality of pre-defined locations including one or more first locations and a plurality of second locations, and includes one or more gaps within or among its one or more layers, to provide substantially balanced conductive pathways among its one or more first locations and its plurality of second locations.

The invention is based on a motor apparatus, in particular on an EC motor apparatus, comprising at least one stator (12a; 12b; 12c) which has at least twelve coils (14a, 14a′, 16a, 16a′, 18a, 18a′, 20a, 20d, 22a, 22b′, 24a, 24a′; 14b, 14b′, 16b, 6b′, 18b, 18b′, 20b, 20b′, 22b, 22b′, 24b, 24b′; 14c, 16c, 18c, 20c, 22c, 24c, 142c, 44c, 146c, 148c, 150c, 152c), and comprising at least one power supply unit (26a; 26b; 26c). It is proposed that coils (14a, 14a′, 16a, 16a′, 18a, 18a′, 20a, 20a′, 22a, 22a′, 24a, 24a′; 14b, 4b′, 16b, 16b′, 18b, 18W, 20b, 20b′, 22b, 22b′, 24b, 24b′; 14c, 16c, 18c, 20c, 22c, 24c, 42c, 144c, 146c, 148c, 150c, 152c), which directly follow one another in the circumferential direction (36a; 36b; 36c), of the at least one stator (12a; 12b; 12c) are connected to differing phases of the power supply unit (26a; 26b; 26c) in at least one operating state.

It is an object of the present invention to further lower the temperature of a bus bar penetrating through a current sensor. A power conversion device according to the present invention includes: a bus bar for transferring current; a current sensor having a core part for forming a throughhole for penetrating the bus bar therein; a base part arranged inside the throughhole of the core part to oppose the bus bar; and a heat transfer member, wherein the base part has an extended part protruding from the throughhole, and the extended part is extended to the heat transfer member and thermally contacts with the heat transfer member.

A vehicle power module assembly includes a modular manifold, an upper frame, and a plurality of power stages. The modular manifold includes a first base unit defining an inlet chamber, a second base unit defining an outlet chamber, a mid-unit defining one or more ports open to the chambers, and an upper unit defining a first set of slots and a second set of slots in fluid communication with the chambers via the ports. The plurality of power stages is housed within the frame and each of the power stages are spaced from one another to define inner channels therebetween. The chambers, channels, and ports are arranged with one another such that coolant flowing through the inner channels is in thermal communication with the power stages. The mid-unit may further include flow guides each sized to partially extend into one of the inner channels.

A power inverter includes a plurality of power modules each having a power stage encased in a frame that defines an opening. The power modules are stacked in an array with the power stages being spaced apart to define coolant chambers interleaved with the power stages. The openings cooperate to form a manifold cavity extending along a length of the stack and in fluid communication with the chambers. A manifold insert is disposed in the cavity and extends through the openings.