Power semiconductor switching devices in an integrated motor drive are mounted directly to a circuit board substrate via a “pick and place” assembly process. The circuit board substrate is then mounted within the housing for the integrated motor drive and, preferably, in a generally central orientation within the housing. A potting material is provided within the housing of the integrated motor drive and around the circuit board. The potting material substantially encloses the circuit board and fills the volume within the integrated motor drive. The potting material is selected to provide good thermal conductivity between the circuit board and the housing of the integrated motor drive. The potting material is also selected to provide flexibility such that expansion and contraction of the potting material due to heating and cooling of the material does not damage the circuit board or the electronic components mounted to the circuit board.

An inductor for a boost converter in a hybrid vehicle includes a core, a coil winding, and an end cap. The coil winding is disposed about the core. The end cap is disposed over a first end of the inductor, overhangs the coil winding, defines a channel that is configured to receive fluid from a pump, defines at least one nozzle that is configured to direct fluid from an overhanging portion of the end cap and onto the coil, and defines a fluid reservoir that is in fluid communication with the channel and the at least one nozzle.

A power converter for a power system includes an input ceramic layer, an output ceramic layer, an input stage coupled to the input ceramic layer, an output stage coupled to the output ceramic layer, and a planar transformer coupled between said input stage and said output stage. The input receives a power input and the output stage generates a power output at least partially as a function of the power input. The planar transformer includes an input winding coupled to the input stage and an output winding coupled to the output stage. The input winding has a plurality of input turns and the output winding has a plurality of output turns. The input turns interleave the output turns.

A voltage regulator module includes a first circuit board assembly and a magnetic core assembly. The first circuit board assembly includes a first printed circuit board, a plurality of switch elements and a first molding compound layer. The switch elements are mounted on a first surface of the first printed circuit board. The first molding compound layer is formed on the first surface of the first printed circuit board to encapsulate the switch elements. The magnetic core assembly is arranged beside a second surface of the first printed circuit board, and includes a magnetic core portion and at least one first U-shaped copper structure. The magnetic core portion includes a plurality of openings. Each first U-shaped copper structure is penetrated through two corresponding openings to define two inductors. A first terminal of each inductor and the corresponding switch element are connected in series to define a phase circuit.

The invention relates to a method for producing a power module (1) and a power module (1), in particular for a medium or high voltage converter (2), comprising at least one power semiconductor module (3), at least one energy storage module (5), at least one cooling device (7), at least two busbars (10), wherein the cooling device (7) is configured to be electrically conductive and is connected to a protective housing (19) shielding at least the power semiconductor module (3) from the environment, which protective housing (19) has at least one insertion opening (20) for inserting and fastening a connecting element (15), and an electrically conductive connecting element (15) is arranged at a predefinable connection position (16) between at least the cooling device (7) and one of the busbars (10) for forming a defined charge-reversal path (17).

[Problem] An object of the present invention is to provide an electronic part mounting heat-dissipating substrate which enables a circuit for which a power semiconductor in which a large current flows is used to reduce the wiring resistances of a large power operation and improve the heat dissipation.

[Means for Solving] The present invention is an electronic part mounting heat-dissipating substrate which comprises lead frames of wiring pattern shapes formed by conductor plate and an insulating member 130 which is provided between the lead frames 110, wherein a plate surface of a part arrangement surface of said conductor plate and a top surface of said insulating member at a side of said part arrangement surface form one continuous surface, the lead frames have different thicknesses, the thick lead frame 110H is used for a large current signal and the thin lead frame 110L is used for a small current signal, a plate surface of a back surface of the part arrangement surface and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane.

An uninterruptible power supply apparatus includes a converter (5) configured to convert AC power into DC power, and an inverter (10) configured to convert DC power into AC power and supply the converted power to a load (24). The load (24) is configured to receive an AC voltage within a range of allowable input voltage to consume constant AC power. The uninterruptible power supply apparatus has maximum efficiency η when a ratio of load capacity to rated capacity of the uninterruptible power supply apparatus is a predetermined value α. The uninterruptible power supply apparatus further includes a control device (18) configured to control an output voltage of the inverter (10) within the range of allowable input voltage so as to increase the efficiency η, when the ratio of the load capacity to the rated capacity is different from the predetermined value α.

An electrical power distribution system for a mobile platform, and a method for making such, includes a forming a substrate having a first panel connected to a second panel. The first panel resides in a first plane that differs from a second plan in which the second panel resides. One or more bus bars are arranged on the first panel, with one or more power electronic devices arranged on the first panel and connected to the one or more bus bars. One or more connectors are arranged on the second panel and electrically connected to the one or more bus bars. Finally, one or more thermal relief devices are arranged in contact with the substrate.

A power supply device supplies power to a substrate holder having a plurality of electrodes. The device includes a first fixed conductive member, a second fixed conductive member, a fixed insulating member fixed to an insulating housing portion and configured to insulate the first fixed conductive member from the second fixed conductive member, a first rotation conductive member, a second rotation conductive member, a rotation insulating member fixed to an insulating column portion and configured to insulate the first rotation conductive member from the second rotation conductive member, a first power supply member configured to supply a first voltage to the substrate holder via the first rotation conductive member and the first fixed conductive member, and a second power supply member configured to supply a second voltage to the substrate holder via the second rotation conductive member and the second fixed conductive member.

A fluid connector for coolant includes a chamfered lip and a fir tree circumferentially aligned with at least one O-ring on an outer body of the fluid connector. The fluid connector is configured to receive an end piece. The end piece has a standard SAEJ2044 end form. The fluid connector utilizes a housing to form a ribbing and support a seal. An integrated inverter assembly includes a main cover and an opposing back cover; a coolant channel disposed between a coolant channel cover and a coolant channel separating body; wherein power electronics of the integrated inverter assembly are thermally coupled to the coolant channel; wherein at least one of a coolant inlet or a coolant outlet of the coolant channel comprises a fluid connector; and wherein the fluid connector comprises a chamfered lip on an end of the fluid connector.