A method, a device, and a composition are disclosed. The method includes providing a polyol blend that includes a polyol resin and an electromagnetic (EMA) additive, providing an isocyanate resin selected such that blending the isocyanate resin with the polyol blend results in an EMA spray foam. The device includes a first compartment containing an isocyanate resin and a second compartment containing a polyol blend, which includes a polyol resin and an EMA additive. The composition includes a polyurethane spray foam and an EMA additive blended into the polyurethane spray foam.

A system and method for controlling an EMC protection apparatus in a removable component. The removable component is inserted into an end product. As a result of the insertion power is applied to the EMC protection apparatus. A determination is made as to whether a power good signal is detected within the removable component. In response to a power good signal, an EMC protection device is rotated from a retracted state to an engaged state such that the EMC protection device is placed over an enclosure opening in the removable component forming an EMC seal. Full functionality of the removable component can be delayed until such time as the rotation is completed.

A system and a method of providing electromagnetic compatibility (EMC) protection. A removable component is inserted into an end product. The removable component includes a retractable EMC protection apparatus. In response to the insertion of the removable component a shape memory alloy on the EMC protection apparatus is heated to a temperature above the activation temperature of the shape memory alloy. The shape memory alloy then changes from a first shape to a second shape in response to the heating. In response to the change in the shape of the shape memory alloy an EMC protection component of the EMC protection apparatus is inserted into an enclosure opening of the removable component.

A shield assembly includes a closing structure configured to be disposed over an opening of an enclosure. The closing structure includes an inner surface configured to face an inside of the enclosure when the closing structure is closed and a finger bracket structure mounted on the inner surface, the finger bracket structure having a bracket and one or more finger gaskets coupled to the bracket. An electromagnetic interference (EMI) shielded gasket disposed along a portion of the opening of the enclosure shields an edge of the opening of the enclosure or a radio frequency (RF) fence bracket coupled to a frame disposed around the opening of the enclosure creates a narrow path between the frame and the closing structure, the narrow path attenuating RF signals passing through the narrow path and shielding an edge of the opening of the enclosure.

A grounding elastic contact and an electronic device including the same. The grounding elastic contact includes an elastic core, and a double-sided polyethylene terephthalate (PET) tape, a polyimide (PI) film, and a conductive layer, where the PI film is laminated and bonded on an outer side of the double-sided PET tape; a middle region of the double-sided PET tape is attached to an upper surface of the elastic core; after passing through left and right sides of the elastic core respectively, two ends of the double-sided PET tape are laminated on a lower surface of the elastic core; the conductive layer includes one end bonded on the upper surface of the elastic core, and the other end passing through the left side of the elastic core; the double-sided PET tape includes a PET backing and an adhesive coated on two sides of the PET backing.

A portable server data center and server rack system, includes a carrying case sized to allow the carrying case to be carried onboard an aircraft. A server tray rack rail apparatus is disposed within the carrying case to accommodate a plurality of server trays that are slidable along the rack rail apparatus. Each of the server trays are capable of accommodating a motherboard section and its components, a power supply section and its components, and a cooling apparatus for the motherboard and power supply sections.

A sealed component assembly within an aircraft, comprising first 10 and second 12 components each facing surfaces, and a sealing member 20 extending between the facing surfaces. The sealing member includes a conductive portion 22 sandwiched between first 24 and second 26 sealing portions. The sealing portions extend between and in contact with the facing surfaces, and are made of a sealing material. The conductive portion is in contact with conductive regions of the facing surfaces and defines an electrical connection therebetween. The conductive portion is more conductive than the sealing portions. In a particular embodiment, the components are a floor panel and a floor beam. A sealing member 20 for a connection between two aircraft components is also discussed.

Technologies are described for shielding electronic components. In one embodiment, a conductive gasket includes a gasket body. A conductive shield has a plurality of projections extending therefrom sufficient to deform the gasket body to couple the conductive shield and the conductive gasket together. The projections can be pointed teeth designed for penetrating the conductive gasket so as to electrically and mechanically couple the conductive shield to the conductive gasket. The conductive gasket can be stacked onto the conductive shield to form a sidewall, which can be mounted on a PCB. A conductive cover can then be placed on the conductive gasket to create a cavity in which electronic components can be positioned.

A vertically oriented, electrically conductive enclosure includes at least three shield members. A first member has a first floor and a first sidewall that extends away from the first floor around a periphery of the first shield floor. A second member is electrically coupled to the first member and has a second floor and a second sidewall. A first portion of the second sidewall extends away from the second floor in a first direction. A second portion of the second sidewall extends away from the second floor in a second direction opposite to the first direction and engages the first sidewall. A third member is electrically coupled to the second member and has a shield cover and a third sidewall. The third sidewall extends away from the shield cover about a periphery of the shield cover and engages the first portion of the second sidewall.

A split enclosure apparatus for fan-less cooling may be provided. The apparatus may comprise a device and a housing. The device may comprise a plurality of components. The housing may enclose the device and may comprise a first external surface, a second external surface, and a joint between the first external surface and the second external surface. The first external surface may be dedicated to cooling a first one of the plurality of components. The second external surface may be dedicated to cooling a second one of the plurality of components. The joint between the first external surface and the second external surface may be electrically conductive and thermally resistive.