Disclosed are exemplary embodiments of thermal management and/or electromagnetic interference (EMI) mitigation materials including coated fillers (e.g., coated thermally-conductive, electrically-conductive, dielectric absorbing, and/or electromagnetic wave absorbing particles, sand particles coated with a binder, other coated functional fillers, combinations thereof, etc.). For example, a thermal management and/or EMI mitigation material may comprise a thermal interface material (TIM) including one or more coated fillers (e.g., coated thermally-conductive particles, sand particles coated with a binder, etc.), whereby the TIM is suitable for providing a thermal management solution for one or more batteries and/or battery packs (e.g., a battery pack for electric vehicle, etc.), or other device(s), etc.

Provided is a housing that effectively serves to block high-frequency electromagnetic waves in addition to low-frequency electromagnetic waves. A housing that houses an electronic or electric device includes at least one of a copper layer serving as a diamagnetic layer and a nickel layer serving as a ferromagnetic layer, stacked on each of front and back sides of an iron base member, and a bright tin layer further stacked thereon as an outermost layer.

A circuit card assembly including a printed circuit board arranged to include one or more electronic circuits and a frame connected to the printed circuit board. The circuit card including at least one connector arranged to detachably engage with a backplane connector of the electronic chassis to establish an electrical connection with a backplane printed wiring board (PWB) of the electronic chassis. The circuit card also including a front panel having at least one input/output connector and an EMI/RFI gasket positioned along a perimeter of the back side of the front panel where the EMI/RFI gasket is arranged to contact a surface of the electronic chassis along a perimeter of the circuit card assembly slot when the circuit card assembly is extended into the circuit card assembly slot.

A circuit module 2 comprises: a wiring structure 4; at least one electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which at least one electronic component 6a, 6b is embedded; and a metal layer 10 provided on the upper surface of the insulating resin layer 8. The surface roughness of the portion 51 directly above each electronic component on the upper surface of the insulating resin layer 8 is expressed as R1. The surface roughness of the portion S2 other than the portion directly above all the electronic components on the upper surface of the insulating resin layer 8 is expressed as R2. At least one R1 satisfies the condition: R1>R2.

An electromagnetic wave shielding sheet according to the present embodiments is an electromagnetic wave shielding sheet for forming an electromagnetic wave shielding layer used for a component-mounting substrate including a substrate, an electronic component and an electromagnetic wave shielding layer, in which the electromagnetic wave shielding sheet includes at least one of a conductive layer before thermal pressing of the electromagnetic wave reflection layer and a conductive layer before thermal pressing of the electromagnetic wave absorption layer, the conductive layer before thermal pressing of the electromagnetic wave reflection layer includes a binder resin and a conductive filler, and the conductive layer before thermal pressing of the electromagnetic wave absorption layer includes a binder resin and an electromagnetic wave absorption filler. The Young's modulus of the conductive layer at 23° C. is set to 10 to 700 MPa.

A circuit module 2 comprises: a wiring structure 4; at least one electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which at least one electronic component 6a, 6b is embedded; and a metal layer 10 provided on the upper surface of the insulating resin layer 8. The surface roughness of the portion S1 directly above each electronic component on the upper surface of the insulating resin layer 8 is expressed as R1. The surface roughness of the portion S2 other than the portion directly above all the electronic components on the upper surface of the insulating resin layer 8 is expressed as R2. At least one R1 satisfies the condition: R1>R2.

Electrical module designs are disclosed for motor vehicles. An exemplary electrical module (e.g., a junction box, etc.) may include a polymer-based housing assembly and an EMC shield that is adapted to influence an electromagnetic compatibility of the polymer-based housing assembly. The EMC shield may include a metallic foil, a metallic filler, a metallic coating, or combinations thereof.

The present invention provides a shield package having a highly distinctive pattern formed on a surface of a shield layer. The shield package of the present invention includes a package in which an electronic component is sealed with a resin layer, and a shield layer covering the package, wherein a surface of the resin layer includes a drawing area drawn with lines and/or dots by aggregation of multiple grooves, and a non-drawing area other than the drawing area, multiple depressions originating from the grooves are formed on a surface of the shield layer on the drawing area, and the depressions are aggregated to draw a pattern with lines and/or dots.

In a described example, a structure includes a substrate having a surface with multiple sides. A sensor is positioned within the substrate and a seed layer is over at least four sides of the surface of the substrate. A magnetic shield layer is over the seed layer for the at least four sides of the surface of the substrate.

An insulation cover fixing structure and a protection device include a first insulation, a first metal shielding cover and an engaging unit. The first insulation cover includes a first bottom plate and a first side plate. The first metal shielding cover is disposed at an outer side of the first insulation cover. The first metal shielding cover includes a second bottom plate and a second side plate. The engaging unit is disposed on at least one of the first insulation cover and the first metal shielding cover. The first metal shielding cover and the first insulation cover are fixed by the engaging unit. The engaging unit includes a first tongue extended with bend from one of the first side plate and the second side plate toward the other and a second tongue extended from the first tongue. The second tongue is pressed against the other of the first side plate and the second side plate.