An electronic apparatus includes: a chassis formed of a conductive member and including an opening; a radiation source arranged in the chassis and radiating noise electric waves; and a conductor formed of a conductive member and arranged on a same side of the radiation source as the opening with at least a part of the conductor overlapping the opening in a plan view of the opening. The conductor has one end electrically connected to the chassis and the other end as an electrically open end.

In order to improve a housing, in particular for an electrotechnical apparatus, comprising at least two housing parts which each have a connecting face, said connecting faces, in a closed state of the housing, facing one another along a connecting section, it is proposed that at least one of the at least two housing parts, along the connecting section, has at least one integrated protective section, in particular for EMC shielding and/or for mechanical protection.

A high-frequency module includes: a chassis which is made of a conductor and which has an internal space; a high-frequency circuit board which is housed in the internal space of the chassis; and a resistive element provided between an inner wall that opposes the high-frequency circuit board among inner walls of the chassis which define the internal space and the high-frequency circuit board.

An Electric and Magnetic Fields (EMF) protection device, includes: a metallic bottom; a metallic side extending from the metallic bottom; and a top opening, wherein the metallic bottom and the metallic side form a cylinder enclosure configured to substantially block a signal passing through the metallic side and the metallic bottom and allow the signal to pass only through the top opening.

A sensor module according to an embodiment of the present technology includes a housing, a sensor board, an external connector, a flexible printed circuit, and a metallic shield case. The flexible printed circuit electrically connects the sensor board and the external connector, the flexible printed circuit including a signal line and a ground line. The shield case includes a bottom portion that is arranged between the flexible printed circuit and the external connector. The external connector includes a first connection pin that is connected to the signal line, a second connection pin that is connected to the ground line, and a third connection pin that is connected to the bottom portion of the shield case. The bottom portion includes a first hole, a second hole, a third hole, and a thermal storage, the first hole being a hole through which the first connection pin passes, the second hole being a hole through which the second connection pin passes, the third hole being a hole through which the third connection pin passes, the thermal storage being provided around the third hole and covered with a solder material used to join the third connection pin to the bottom portion.

The present disclosure relates to a housing assembly for accommodating printed circuit boards (PCBs). The housing assembly comprises a first housing portion configured to accommodate a first PCB, a second housing portion configured to accommodate a second PCB, and a separating portion for separating the first housing portion from the second housing portion. The separating portion comprises a first separating region in which the first housing portion and the second housing portion overlap and a second separating region that extends beyond the second housing portion and covers the first housing portion. The second separating region comprises one or more convection openings.

A shielding structure and a manufacturing method thereof are provided. The shielding structure includes a metal housing, a plastic member, and a conductive trace. The metal housing has an inner surface and an internal space. The plastic member is disposed on the inner surface and in the internal space and has an accommodating space. The conductive trace is disposed on the plastic member and in the accommodating space, wherein the plastic member is between the conductive trace and the metal housing.

An EMP-resistant (electromagnetic pulse-resistant) case for portable electronic devices is provided. The case includes a conductive external housing configured to enclose the electronic device. The housing includes a lower housing having a continuous connection surface. The housing also includes an upper housing having a continuous connection surface. The lower and upper housing are configured to releasably engage at the continuous connection surface. The housing includes a conductive gasket positioned at the continuous connection surface between the upper and lower housing. The case also includes a first insulative layer at least partially covering the inside surface of the upper and lower housing.

An Electric and Magnetic Fields (EMF) protection device, includes: a metallic bottom; a metallic side extending from the metallic bottom; and a top opening, wherein the metallic bottom and the metallic side form a cylinder enclosure configured to substantially block a signal passing through the metallic side and the metallic bottom and allow the signal to pass only through the top opening.

A module comprises: a substrate having a first surface; a first component and a second component mounted on the first surface; a conductive member mounted therebetween; and a resin seal disposed to cover the first surface, the first component and the second component and also seal a portion of the conductive member. The resin seal has a recess that exposes at least a portion of the conductive member, and inside the recess the resin seal and the conductive member have a side surface and a surface, respectively, covered with a first shield film. The first shield film inside the recess is covered with a second shield film smaller in thickness than the first shield film. The resin seal has a surface facing away from the first surface and covered with the second shield film.