An electronic module that comprises a housing; a cover that is disposed over the housing to define an interior; and one or more electronic components positioned within the interior is provided. At least a portion of the housing, cover, or both contain a polymer composition that exhibits an in-plane thermal conductivity of about 1 W/m-K or more as determined in accordance with ASTM E 1461-13 and an electromagnetic shielding effectiveness of about 20 dB or more as determined at a frequency of 1 GHz in accordance with EM 2107A.

A connector assembly includes a receptacle connector, a shielding cage and a partitioning element. The shielding cage has a receiving cavity. The partitioning element is provided to the receiving cavity and partitions the receiving cavity into a first module passageway and a second module passageway, the partitioning element includes a compartment frame and a grounding gasket assembled to a front end of the compartment frame, the compartment frame has a first partitioning wall and a second partitioning wall which respectively correspond to the first module passageway and the second module passageway, the grounding gasket integrally has a front plate, a first panel and a second panel, the first panel and the second panel together clamp the first partitioning wall and the second partitioning wall, the first panel and the second panel and the front plate are integrally connected by bulging portions at certain corners.

An electronic device includes a plurality of sub-electronic modules arranged side by side. Each of the sub-electronic modules includes a housing having a top wall, a bottom wall, and a pair of side walls, and a light guide pipe mounted on one of the side walls. The light guide pipe has an incident end, an emergent end located at a front portion of the housing, and a main body located between the incident end and the emergent end and extending in a length direction of the housing. The incident ends of the light guide pipes located between at least a pair of adjacent housings are staggered by a predetermined distance in the length direction.

An electronic device includes a camera module and an external structure. The camera module includes an image sensor and a shielding structure that shields components of the camera module from electromagnetic interference (EMI). The external structure two-dimensionally surrounds the camera module, and a portion of the external structure is conductive. The shielding structure includes an accommodating portion that accommodates the image sensor, and a protruding portion that protrudes from the accommodating portion to contact the external structure.

Exemplary embodiments are disclosed of EMI shields including electrically-conductive foam (broadly, electrically-conductive resiliently compressible porous material). An exemplary embodiment includes an electromagnetic interference (EMI) shield for an optical transceiver including transmitter and receiver optical sub-assemblies. The EMI shield includes a portion having openings configured for receiving the transmitter and receiver optical sub-assemblies therethrough to thereby allow the EMI shield to be fit over the transmitter and receiver optical sub-assemblies for installation along a portion of the optical transceiver. The EMI shield also includes sidewalls depending from the portion that includes the openings. Electrically-conductive resiliently compressible porous material (e.g., electrically-conductive foam, etc.) is along at least a portion of an outer perimeter defined by the sidewalls.

A shield cage assembly of the present disclosure comprises a metal shield shell and a heat dissipating module. The metal shield shell comprises a plurality of walls and an accommodating space defined by the plurality of walls, and the accommodating space has a front end port. The heat dissipating module is assembled to one of the walls of the metal shield shell, and the metal shield shell further includes side walls respectively positioned at two sides of the wall to which the heat dissipating module is assembled. The heat dissipating module further includes a frame and a first heat dissipating member, the frame having a frame body formed at a central portion of the frame to receive the first heat dissipating member and two side plates which extend from two side edges of the frame and which are parallel to the side walls.

An optoelectronic device comprises a substrate, an optoelectronic element mounted on the substrate, a shielding cap providing electromagnetic shielding, at least one optical element attached to the shielding cap, and a detection element configured to detect if the shielding cap is mounted on the substrate.

The present invention provides an optical transceiver including a first housing, a second housing, a printed circuit board, a handle member and an elastic body. The first housing and the second housing are assembled with each other as a main body, and form an accommodation space, a first handle-guiding groove and a second handle-guiding groove. The first handle-guiding groove and the second handle-guiding groove are respectively located on two opposite sides of the main body. The printed circuit board is accommodated within the accommodation space. The handle member has a first arm and a second arm respectively received in the first handle-guiding groove and the second handle-guiding groove. The elastic body is received in an elastic-body-receiving slot of the first housing. None side of the elastic-body-receiving slot is formed by the second housing, or the elastic-body-receiving slot is a non-linear slot.

A shield cage assembly of the present disclosure comprises a metal shield shell and a heat dissipating module. The metal shield shell comprises a plurality of walls and an accommodating space defined by the plurality of walls, and the accommodating space has a front end port. The heat dissipating module is assembled to one of the walls of the metal shield shell, and the heat dissipating module comprises a heat dissipating base member, a first heat dissipating member provided to the heat dissipating base member and at least one clip sandwiched between the heat dissipating base member and the first heat dissipating member, and the clip engages with the metal shield shell, a bottom of the heat dissipating base member covers the wall of the metal shield shell to which the heat dissipating module is assembled.

In one embodiment, an optical module cage includes a first opening for slidably receiving an optical module, a second opening positioned adjacent to the first opening for slidably receiving a riding heatsink separate from the optical module or an integrated heatsink connected to the optical module, and a guide rail interposed between the first opening and the second opening, wherein the guide rail is configured to support the riding heatsink and not interfere with insertion of the integrated heatsink.