What is provided is a shield housing for shielding interconnect structures and/or components disposed on a circuit board, wherein at least two antenna radiators can be disposed on the shield housing, and wherein the shield housing is configured in such a manner that it can cover the interconnect structures and/or components disposed on the circuit board, at least in part, can be connected with a ground surface of the circuit board, and has a region between the antenna radiators, which region is configured in such a manner that it provides electrical decoupling of the feed of the antenna radiators from one another.

What is provided is an adapter plate for HF structures, which is set up for being disposed between a back of a circuit board and a reflector, wherein the adapter plate is electrically conductive, and the adapter plate has an opening or a cavity at every location where an element is passed through the circuit board to the side of the adapter plate, wherein at least one element is passed through the circuit board exclusively for ground contacting.

Provided is a wireless power transmission device. A wireless power transmission device includes: at least one antenna for wireless power transmission disposed on one side of a magnetic shielding sheet; a support plate having at least one receiving groove formed therein for receiving the antenna for wireless power transmission; and an antenna for wireless communication disposed along a side portion of the support plate.

Radio frequency subscriber drop units include a housing having an input port and an output port and a printed circuit board mounted in an interior of the housing. The printed circuit board includes a dielectric layer, a wiring layer that includes conductive wirings that comprise at least part of a communications path between the input port and the output port that is on a first face of the dielectric layer, and a ground plane layer that includes a conductive ground plane that is on a second face of the dielectric layer.

The disclosure discloses a device for terminal heat dissipation and a mobile terminal, including: a heat source chip, a heat pipe, and a shield, wherein the shield is located between the heat source chip and the heat pipe, and is connected with the heat source chip and with the heat pipe via the same type of flexible thermal conductive solid; and a microporous array is arranged at a connection position between the flexible thermal conductive solids, which are in contact with the shield. By means of the disclosure, the problem in the related art that heat cannot be quickly conducted to the h at pipe due to the back and forth conversion of the conductive medium in the thermal conductive path is solved, and h at can therefore be quickly conducted to the heat pipe, speeding up an effect of heat dissipation.

On a circuit board configured to transmit a signal, a pulse transformer is provided on a path used for transmitting the signal of the circuit board. A shield member is provided on the circuit board to prevent noise, which is generated due to noise current flowing in a noise line pattern, from entering the pulse transformer. The shield member covers a part of a surface of at least one pulse transformer, the part intersecting concentric circles (which represent a magnetic field generated by the noise current) whose central axis extends along the direction in which the noise current flows.

According to various embodiments of the present invention, an electronic device comprises: a connector comprising a conductive shell and at least one terminal arranged inside the conductive shell; a capacitor; and a circuit board comprising a first board layer at least partially facing the connector, a second board layer formed beneath the first board layer, and at least one third board layer formed between the first board layer and the second board layer. The circuit substrate comprises: a ground area made of a conductor formed at least one of the first board layer, the second board layer, or the at least one third board layer and electrically connected to the conductive shell through the capacitor while being connected to a ground portion of the electronic device; a first conductive area which is a partial area of the first board layer facing the connector, the first conductive area being made of a conductor having a first size and electrically connected to the conductive shell; and a second conductive area which is an area of the second board layer at least partially facing the first conductive area with the at least one third substrate layer interposed therebetween, the second conductive area being made of a conductor having a second size wider than the first size and electrically connected to the first conductive area. At least one of the first conductive area and the second conductive area may be arranged adjacent to the ground area such that the first conductive area and the second conductive area are electrically separated from the ground area.

Methods, systems, and apparatus for EM isolation structures. One of the apparatus includes a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; and one or more metallic blocking structures configured to at least partially encircle a corresponding one of the plurality of integrated circuit packages, wherein each metallic blocking structure is configured to reduce signal leakage from the corresponding integrated circuit package.

Methods and systems capable of launching signal-carrying transverse electromagnetic waves onto a transmission line in the higher voltage region of the transmission distribution network. Such methods and systems may include a surface wave launcher located in the higher voltage region, a network unit located in a lower voltage region, and an arrester separating the surface wave launcher and the network unit, the arrester preventing voltage from arcing over from the higher voltage region to the lower voltage region where the arrester provides the signal to the surface wave launcher.

An information handling system to wirelessly transmit and receive data may include a base chassis including a metal C-cover and metal D-cover to house a processor, a memory, and a wireless adapter, the metal C-cover to house a speaker grill, the speaker grill covering a speaker to emit audio waves; the speaker grill formed within the C-cover to emit a target radio frequency (RF) including a slot formed around a portion of the speaker grill forming a peninsula on the speaker grill that is physically separated from the C-cover; an antenna element placed behind the speaker grill and operatively coupled to the wireless adapter; an electromagnetic interference (EMI) shield forming a cavity enclosing the speaker and the antenna element, including a plurality of metallic shielding walls extending from the C-cover to a D-cover of the information handling system; and a conductive rubber gasket placed between the plurality of conductive walls and the D-cover to shield the cavity from EMI sources.