Disclosed is a signal conductor formed as a metal oxide varistor (MOV), the MOV having a first MOV and a second MOV separated by an insulator. In some embodiments, the disclosed signal conductor may be used in a system communicably coupled to a power transmission distribution network, the system capable of launching transverse electromagnetic waves onto a transmission line, where the electromagnetic waves propagating a data signal conveyed to the system by the MOV.

Disclosed are one or more preferred geometric configurations for a device communicably coupled to a power transmission line and capable of launching transverse electromagnetic waves onto the transmission line. The waves propagate data received from a data source and may include a reflector and a coupler adjacent to each other through a transverse magnetic wave that propagates longitudinally along the surface of the transmission line.

Disclosed are EMI shielded packages, electronic device packages, and related methods. EMI shielded packages are formed by applying an insulating material to a first side of a substrate strip, separating the substrate strip into segments, adhering the insulating material of the segments to a solid conductor, applying a conductive paste around lateral sides of the segments, curing the conductive paste, and cutting through the conductive paste and the solid conductor to form the EMI packages. An electronic device package includes a substrate including electronic circuitry, an EMI shield, and an insulating material insulating the substrate from the EMI shield. The EMI shield includes a solid conductor adhered to the insulating material, and a cured conductive paste at least partially surrounding a lateral edge of the substrate. The cured conductive paste electrically connects the solid conductor to a conductive terminal in a lateral side of the substrate.

A connector (10), for example, an F-connector, has a barrel (12), which may be threaded, a front flange (14), a frame insert (16), a rear flange (20), a body section (22) between the frame insert (16) and the rear flange, an insulator (60) in the barrel, and a center conductor (24) running through the insulator. The body section forms a slot (18) between the frame insert and the rear flange. The rear flange has two sections (20A, 20B), which mirror each other. A section may be a rectangular block with a curved cutoff; the curved cutouts face each other and, together, provide a passageway for the conductor. The conductor is preferably beryllium-copper with a tin plating. The insulator is preferably a high-temperature thermoplastic, such as a heat-resistant polyamide nylon which can withstand a temperature of 270 C. for 1 minute.

An electronic device includes a signal processor, a substrate, and a conductive housing. The signal processor includes an oscillator that outputs oscillation signal. The substrate has a ground component, the signal processor being disposed on the substrate. The conductive housing is connected to a first site of the ground component and to a second site that is different from the first site. The first site and the second site are disposed at positions where a first area of the housing that is an odd-numbered multiple of wavelength of the oscillation signal away from the first site overlaps at least part of a second area of the housing that is a multiple of wavelength of the oscillation signal away from the second site.

A computer system includes a shielding casing, a movable component, at least one cable, and a shielding apparatus arranged at a first part of the shielding casing configured to accommodate the at least one cable in a first state at least partially, and to be compressed during a movement of the movable component in a second state, whereby the at least one cable is clamped into the shielding apparatus.

Disclosed is an electronic device that includes a housing including a first plate, a second plate, and a side member, a ground layer, a display, a communication circuit, and a processor. The side member includes a first conductive part, a second conductive part, and a non-conductive part in contact with the first conductive part and the second conductive part and interposed between the first conductive part and the second conductive part. The first conductive part may be electrically coupled with the second conductive part. The ground layer may be electrically coupled with a partial section of the first conductive part that is adjacent to the second conductive part. The communication circuit may be electrically connected with the first conductive part and the second conductive part.

Provided is a wireless power transmission device. A wireless power transmission device includes: at least one antenna for wireless power transmission disposed on one side of a magnetic shielding sheet; a support plate having at least one receiving groove formed therein for receiving the antenna for wireless power transmission; and an antenna for wireless communication disposed along a side portion of the support plate.

A display device includes a signal processor, a display component, a substrate, and a conductive housing. The signal processor includes an oscillator that outputs oscillation signal, the signal processor processing signal whose frequency is higher than a specific threshold. The display component displays video. The substrate has a ground component, the signal processor being disposed on the substrate. The conductive housing is connected to a first site of the ground component and to a second site that is different from the first site. The first site and the second site are disposed at positions where a first area of the housing that is an odd-numbered multiple of wavelength of the oscillation signal away from the first site overlaps at least part of a second area of the housing that is a multiple of wavelength of the oscillation signal away from the second site.

What is provided is a shield housing for shielding interconnect structures and/or components disposed on a circuit board, wherein at least two antenna radiators can be disposed on the shield housing, and wherein the shield housing is configured in such a manner that it can cover the interconnect structures and/or components disposed on the circuit board, at least in part, can be connected with a ground surface of the circuit board, and has a region between the antenna radiators, which region is configured in such a manner that it provides electrical decoupling of the feed of the antenna radiators from one another.