A magnetic shield for shielding adjacent coils of an ICPT system. One or more conductors are configured to distribute induced eddy currents from the surface of the shield to below the surface and thus reduce heating due to eddy currents. The magnetic shield may be employed to transfer power over rotary couplings, such as the shaft of a wind turbine.

A radio wave absorber including a radio wave absorbing layer containing a magnetic powder and a binder, in which a metal layer is not provided, a filling rate of the magnetic powder in the radio wave absorbing layer is 35% by volume or less, and in a case where the filling rate of the magnetic powder in the radio wave absorbing layer is denoted by P % by volume and a thickness of the radio wave absorbing layer is denoted by Q mm, the following relationship is satisfied, 0.65≤(P/100)×Q, and the compound.

According to an embodiment, there is provided a leak preventing device of electromagnetic wave, including a metal pipe and a magnetic material part. The metal pipe is arranged to surround a periphery of a first electric power transmission device. The first electric power transmission device wirelessly transmits electric power to a second electric power transmission device via an electromagnetic wave. The second electric power transmission device is opposed to the first electric power transmission device. An opening is formed on the metal pipe along a circumferential direction of the metal pipe. The magnetic material part is arranged within the metal pipe along the circumferential direction the metal pipe.

A cryocooler includes a second-stage cooling stage, a second cylinder which includes the second-stage cooling stage on a terminal of the second-stage cylinder, a second-stage displacer which includes a magnetic regenerator material and is accommodated in the second-stage cylinder so as to be able to reciprocate in the second-stage cylinder, and a tubular magnetic shield which is installed on the second-stage cooling stage and extends along the second-stage cylinder outside the second-stage cylinder. The magnetic shield is formed of a normal conductor and a product of an electrical conductivity in a temperature range of 10 K (Kelvin) or less and a thickness of the tubular magnetic shield is 60 MS (Mega-Siemens) to 1980 MS.

Provided is a magnetic shielding sheet. The magnetic shielding sheet according to an embodiment of the inventive concept may include a magnetic sheet including a magnetic material, a plurality of first metal strips provided on the magnetic sheet in a first direction, and a plurality of second metal strips provided on the magnetic sheet in a second direction different from the first direction. According to the inventive concept, a magnetic field applied from the outside may be efficiently shielded by properly arranging the metal strips on the magnetic sheet.

Provided is a Fe-based soft magnetic alloy. A Fe-based soft magnetic alloy according to an embodiment of the present invention is expressed by the empirical formula Fe.sub.aB.sub.bC.sub.cCu.sub.dNb.sub.e, wherein a, b, c, d, and e represent atomic percents (at %) of corresponding elements and satisfy 78.0≤a≤84.5 and 15.5≤b+c+d+e≤22.0. Hence, the Fe-based soft magnetic alloy has a high saturated magnetic flux density and high permeability characteristics and thus can be utilized for small and lightweight components, and has low coercive force and low magnetic loss characteristics and thus very easily finds applications in high-performance/high-efficiency components. Furthermore, the Fe-based soft magnetic alloy can minimize the effect of heat treatment conditions in the implementation of uniform grains with a small particle diameter after heat treatment, thereby greatly facilitating the design of process conditions, and thus is very suitable in mass production. Therefore, the Fe-based soft magnetic alloy can be widely applied to magnetic components of electric and electronic devices for a high-power laser, a high-frequency power supply, a high-speed pulse generator, SMPS, a high-frequency filter, a low-loss high-frequency transformer, a high-speed switch, wireless power transmission, electromagnetic wave shielding, and the like.

A wireless power receiver is disclosed. The wireless power receiver includes a reception coil for wirelessly receiving AC power, a plurality of shielding members disposed on the reception coil for blocking magnetism, and an adhesive member for adhering the shielding members and the reception coil to each other, wherein the shielding members are made of different materials.

An electronic device may have a housing, electrical components, and other electronic device structures. A display may be mounted in the housing. The display may have a transparent display cover layer and a display layer such as an organic light-emitting diode display layer that is mounted to the underside of the transparent display cover layer. A flexible printed circuit with metal traces may be mounted under the organic light-emitting diode display layer. The metal traces may form coils for a near-field communications inductive loop antenna. A magnetic shielding layer may be interposed between the housing and the flexible printed circuit. The magnetic shielding layer may include a polymer magnetic shielding layer having magnetic material particles embedded in a polymer matrix. The magnetic shielding layer may also have a polymer-binder-free magnetic shielding layer.

A soft magnetic resin composition contains flat soft magnetic particles, and a resin component containing an epoxy resin, a phenol resin, and an acrylic resin. The epoxy resin consists of only an epoxy resin having three or more functional groups, the phenol resin consists of only a phenol resin having three or more functional groups, and the content ratio of the acrylic resin in the resin component is 25 mass % or more.

A hearing device includes: a multi-chip assembly including a plurality of integrated circuit chips, the plurality of integrated circuit chips including one or a combination of a wireless communication chip, a power management chip, and a signal processing chip; wherein the multi-chip assembly comprises: a first layer having a surface, a spacer layer being configured to accommodate one or more of the plurality of integrated circuit chips as one or more embedded chips, and a ground layer below the first layer and the spacer layer, and a first shielding layer between the spacer layer and the first layer.