An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

The present invention is directed at electromagnetic shielding that is particularly suitable for applications in electric vehicles. The electromagnetic shielding is relatively lightweight and can be integrated into a carpet or textile type construction.

An electromagnetic wave absorbing particle has a composition, which is represented by Formula 1 of Sr.sub.1-xR.sub.xFe.sub.y-2zM.sub.2zO.sub.a and contains M-type hexaferrite as a main phase. In Formula 1, R is one or more substances selected from among Ba, Ca, and La, M is one or more substances selected from among Co, Ti, and Zr, 0<x≤0.8, 8≤y≤14, 0<z≤1.5, and a is equal to 19.

A method of molding a metalized composite part. The method comprises: introducing particles comprising at least one metal into a gas stream; directing the gas stream toward a surface of a thermoplastic composite part, thereby depositing a metal layer on the composite part to form a metallized composite part; and molding the metallized composite part to introduce a bend without delamination of the metal layer from the metallized composite part.

The present disclosure relates to new types of low oil bleeding thermal interface materials, such as thermal gap pad materials, which may be in the form of a thermally conductive gasket. In exemplary embodiments, a thermal interface material comprises a matrix material and a thermally conductive filler. The thermally conductive filler has particles which are approximately spherical in shape when observed using a scanning electron microscope, an average particle diameter (D50) of 2-120 μm, and an average degree of sphericity of 70-90%. According to the present disclosure, by using a quasi-spherical thermally conductive filler having a specific sphericity, oil bleeding can be prevented, mitigated, or reduced while achieving high thermal conductivity compared to the case of using a perfectly spherical or irregularly shaped thermally conductive filler.

The present invention relates to a 2-dimensional MXene particle surface-modified with a functional group comprising a saturated or unsaturated hydrocarbon, a preparation method thereof, and a use thereof (e.g., a conductive film).

An object of the present invention is to provide ferrite particles having a high magnetic permeability in a frequency band of 1 MHz to 1 GHz. Another object is to provide a resin composition containing the ferrite particles and an electromagnetic wave shielding material composed of the resin composition. The ferrite particles are composed of a single crystalline body having an average particle size of 1 to 2000 nm and has a spherical particle shape, wherein the ferrite particles contain substantially no Zn, 3 to 25 wt % of Mn, and 43 to 65 wt % of Fe, and a real part μ′ of a complex magnetic permeability measured using a molding composed of the ferrite particles and a binder resin has a maximal value in a frequency band of 100 MHz to 1 GHz.

An electromagnetic wave absorber includes an electromagnetic wave-absorbing layer (10) and an adhesive layer (20). The adhesive layer (20) is disposed on at least one surface of the electromagnetic wave-absorbing layer (10). The electromagnetic wave absorber is capable of being adhered to a surface having a step in such a manner that the adhesive layer (20) is in contact with the surface. The adhesive layer (20) has a thickness equal to or greater than a reference height determined by subtracting 0.1 mm from the height of the step. In the electromagnetic wave absorber, a return loss ΔR defined by ΔR=Rt−Rr is 15 dB or more. Rt is a reflection amount of a 76-GHz electromagnetic wave and is measured for a reference specimen. Rr is a reflection amount of a 76-GHz electromagnetic wave and is measured for a specimen obtained by adhering the electromagnetic wave absorber.

A power module of a medium-high-voltage isolated converter is disclosed. The power module includes a first circuit, a second circuit, a transformer and a shielding structure. A potential of the first circuit is greater than a potential of the second circuit. The transformer includes a first leading wire electrically connected to the first circuit, and a second leading wire electrically connected to the second circuit. The shielding structure is disposed between the transformer and the second circuit. The second leading wire is electrically connected between the transformer and the second circuit through the shielding structure, and the shielding structure is maintained at a constant potential.

In some embodiments, a computer system chassis comprises a chassis side having an antenna portion and a fan portion. The antenna portion is located closer to an antenna located on an external surface of the chassis side than the fan portion. The antenna and fan portions comprise ventilation holes that provide for the venting of heated air from the chassis interior to the surrounding environment. In some embodiments, the ventilation holes in the antenna portion are thicker than the ventilation holes in the fan portion. The thicker ventilation holes provide an adequate level of EMI shielding for the antenna from platform noise generated by components (CPUs, GPUs, memories, etc.) located in the chassis interior. In other embodiments, the antenna portion comprises alternating positive and negative cross pattern ventilation holes and provides an adequate level of EMI shielding with the antenna portion ventilation holes having the same thickness as the fan portion ventilation holes.