A stamp tool holding device capable of holding a stamp tool while keeping a stamp surface of the stamp tool clean, a stamp tool positioning device that easily positions a stamp tool with respect to a transport head, a multi-element transfer device for efficiently transferring a transport object element such as an element using a stamp tool, and a method of manufacturing an element array using the same, wherein the stamp tool holding device has an installation stage on which a stamp tool is detachably installed. The installation stage has an installation surface on which a housing recess for accommodating a stamp layer of the stamp tool is formed, and a suction hole capable of detachably adsorbing a part of the stamp tool located around the stamp layer is formed on the installation surface.

A component mounting machine includes a board conveyance device, a component supply device, a component transfer device which includes a mounting head and a head driving mechanism, and a mounting order control device. The component mounting machine partitions a long printed circuit board of a length exceeding a mounting station into a plurality of mounting areas, sequentially positions each mounting area in the mounting station, and mounts the electronic components. The mounting order control device performs control to change the mounting order of the electronic components.

[Object] Provided are a stamp tool whose transport head can be easily shared, a transport device capable of allowing the stamp tool to easily pick up an transport object element disposed on a surface of a substrate from the substrate and transporting the element without being left on the substrate side, and an element array manufacturing method using the same.

[Solution] A stamp tool 10 includes a stamp layer 12 allowing an element 32r as an transport object element to detachably adhere thereto, a support plate 14 to which the stamp layer 12 is fixed, and an adapter plate 16 having a mounting surface 16a, the support plate 14 being replaceably attached thereto, and a transport head 22 being allowed to be detachably attached thereon.

An inserting device includes a feeding mechanism, a positioning mechanism, and an assembling mechanism. The feeding mechanism includes a first supporting plate, a second supporting plate, a lifting assembly and a single-axis sliding table. The second supporting plate includes a first place position and an adjacent second place position. The second supporting plate and the first supporting plate can form a receiving space. The lifting assembly lifts trays located on the first place position and the second place position. The single-axis sliding table is received in the receiving space. The single-axis sliding table includes a sliding block. The sliding block receives the tray dropped from the first placing position and further carries the tray away from the first placing position. The positioning mechanism includes a clamping jaw. The clamping jaw clamps a workpiece from the tray and positions the workpiece again. The assembling mechanism assemblies the workpiece on a product.

An electronic circuit component mounting head which mounts electronic circuit components to a circuit substrate is provided. The mounting head includes a rotating/raising/lowering axis held on a head main body as to be capable of rotation and of being raised/lowered, a suction nozzle held on the rotating/raising/lowering axis as to be capable of being raised/lowered and not capable of being rotated relatively, and the rotating/raising/lowering axis and suction nozzle can be rotated as necessary by an electric motor. A raising/lowering driving member is held on head main body as to be capable of being raised/lowered, and is raised/lowered by a first linear motor. A first engaging section of the raising/lowering driving member is engaged with the rotating/raising/lowering axis, and a second engaging section of a second linear motor is held on the raising/lowering driving member engaged with suction nozzle.

Populating printed circuit boards with components on a pick-and-place variant set-up is provided. Each set-up includes a number of components, stocks of which are brought to setting-up tables on the pick-and-place line, and a set-up family is associated with each set-up, the family system, a fixed set-up and multiple printed circuit board types which can be populated using the set-up. The fixed set-up is optimized with respect to a weighted parameter, before determining, by means of a simulation, how well variant set-ups, with which the remaining components of predefined pick-and-place orders are associated, can be implemented on the setting-up tables and brought to the pick-and-place line. The quality of each different weighting is determined in order to determine an optimized weighting.

An object of the present disclosure is to provide a component crimping device and a component crimping method that make it possible to improve accuracy of attaching a component onto a substrate by preventing the component from being excessively elongated due to rapid thermal expansion when the component is pressed against the substrate. A lower surface side of a substrate-side terminal part of a substrate held by a substrate holding table is supported by a support, a component placed on a placing table is picked up by a crimping head while heating the component, the component is compressed against a compressing table so as to be elongated, and then the component is pressed against the substrate-side terminal part.

An automatic assembling system, comprising: a robot performing an operation of inserting a first member into a second member; a force sensor for detecting an insertion force exerted on the first member by the robot; and a controller for controlling the insertion force with a closed-loop feedback control according to a difference between the insertion force detected by the force sensor and a predetermined insertion force, so that the insertion force is less than the predetermined insertion force to protect the first member and/or the second member from damage due to an overlarge insertion force. The present invention also is directed to a method for automatically assembling a product.

A component mounting method for using a component mounting tool which includes a plurality of claw sections that pinch and pick up a component at a component supply position, and release the component on a board to mount the component onto a predetermined position of the board, and which is mounted to be capable of moving between the component supply position and the board, includes determining pinching locations of the component to be pinched by the plurality of claw sections such that positions and a release operation of the plurality of claw sections do not interfere with mounted components which are already mounted on the board when the plurality of claw sections release the component.

A board work device includes a housing device, a holding device, a moving device, a first lane and a second lane, a corresponding relationship acquisition device, a priority order acquisition device, and a control device. The holding device exchangeably holds a board work tool that performs a board work on a board. The corresponding relationship acquisition device acquires a corresponding relationship between the types of the board work tool and each of the multiple board works for each of the boards. The control device controls the holding device and the moving device such that, when performing the board work based on the acquired corresponding relationship, in a predetermined case, the board work that is capable of being performed in the other lane is performed without exchanging the board work tool currently being held