An assembly machine includes a plurality of track modules, each track module including a section of track, the plurality of track modules connectable to form a continuous circuitous track, the continuous circuitous track configured to receive a dispensing head, the dispensing head configured to rotate about the continuous circuitous track and at least partially assemble an unfinished product. The machine includes a first feeder module attached to a first length of the continuous circuitous track configured to feed a component to the dispensing head, and a first placement module attached to a second length of the continuous circuitous track configured to receive the unfinished product. The dispensing head is configured to place the component on the unfinished product. The assembly machine is reconfigurable by attaching or removing one or more of the plurality of track modules, the first feeder module and the first placement module.

A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; and a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool having a contact portion for contacting the die during a transfer from the die supply source to the substrate, the bond head including a spring portion engaged with the bond tool such that the spring portion is configured to compress during pressing of the die against the substrate using the contact portion of the bond tool.

A method of mounting a component includes an approaching step of causing the pair of clamping members to approach each other with the first body of the first component disposed between the paired clamping members, a clamping step of clamping the first component, and a mounting step of moving the pair of clamping members clamping the first component to the substrate and pressing out the first component clamped by the pair of clamping members with the pusher for mounting on the substrate, when the clamping members mount the first component on the substrate.

A component feeding device includes a tape lead-in mechanism that leads a component storage tape into a tape traveling path. A pair of tape holding portions are coupled to an operating lever such that the pair of tape holding portions are allowed to shift in posture between a holding posture in which the pair of tape holding portions are able to hold the component storage tape and a hold releasing posture in which the pair of tape holding portions release their hold on the component storage tape. As a result of turning together with the turned operating lever, the pair of tape holding portions shift in position between a send-off enabling position and a send-off disabling position at which the component storage tape is released from a state of being sent off. At the send-off disabling position, the pair of tape holding portions takes the hold releasing posture.

An assembly machine comprising a continuous circuitous track; a dispensing head system configured to at least partially assemble products, wherein the dispensing head system includes one or more dispensing heads movable around the continuous circuitous track; a product conveyance system extending between a first location of the continuous circuitous track and a second location of the continuous circuitous track and a placement module, the placement module including a first positioning system configured to move along a first axis that intersects with the product conveyance system, wherein the first positioning system is configured to receive a first of the products from the product conveyance system and move the first of the products from the product conveyance system to a first placement location; and a second positioning system configured to move along a second axis that intersects with the product conveyance system, wherein the second positioning system is configured to receive a second of the products from the product conveyance system and move the second of the products from the product conveyance system to a second placement location.

A picking apparatus is configured to pick up a plurality of micro elements. The picking apparatus includes a main body and a plurality of picking portions. The picking portions connect with and protrude from the main body. Each of the picking portions has a first surface. The first surfaces are away from the main body and configured to pick up the micro elements. The main body has a second surface at least partially located between the picking portions. Each of the first surfaces has a first viscosity. The second surface has a second viscosity. The second viscosity is less than the first viscosity.

A component mounting system includes a component mounting device (15) configured to mount a component (E) on a board (S), a component storage (20) configured to store a component containing member (200) configured to contain a plurality of the components to be mounted on the board by the component mounting device, and a controller (22) configured to control an order in which the component containing member is unloaded from the component storage. The controller is configured to control the order in which the component containing member is unloaded based on an unloading priority when a plurality of the component containing members are scheduled to be unloaded.

A mounting head includes a first air passage and a second air passage through which air is capable of flowing; a first valve configured to switch air flowing through the first air passage between positive pressure and negative pressure; a second valve configured to switch air flowing through the second air passage between positive pressure and negative pressure; a common air passage configured to communicate with the tool, through which air to be supplied to the tool is capable of flowing; and a third valve configured to selectively cause the first air passage or the second air passage to communicate with the common air passage.

The object is to provide a substrate processing machine facilitating checking the operation of a device in the interior of a housing from the exterior of the housing. The substrate processing machine includes a base and a module, disposed on the base, and has a device configured to perform a predetermined operation contributing to the production of a substrate. The module can be switched between a fabrication position where the substrate is produced and an offset position that deviates from the production position relative to the base. The device can operate in the production position and the offset position. The operation speed of the device in the offset position is slower than the operation speed of the device to in the production position.

A mounting head maintenance device includes an external flow path to communicate with an internal flow path of a mounting head, the mounting head having a nozzle holding section that detachably holds a suction nozzle, the internal flow path that selectively supplies negative pressure air and positive pressure air to the held suction nozzle, and an internal air sensor that is provided in the internal flow path and detects at least one of a flow rate and pressure of the air, a reference air sensor in the external flow path and configured to detect at least one of the flow rate and the pressure of the air, and a detection result acquiring section to acquire an internal detection result of the internal air sensor and a reference detection result of the reference air sensor which can be compared with the internal detection result in association with each other.