A coating device includes a container, a driving device, and a control section. The container accommodates a liquid coating agent to be applied to multiple mounting portions of a board on which a component is to be mounted. The driving device horizontally moves and lifts and lowers a pin member between the container and the positioned board. The control section drives and controls the driving device to dip the pin member in the coating agent to apply the coating agent to each of the multiple mounting portions using the coating agent held by a distal end portion of the pin member.

A method and device for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond.

Embodiments herein address these and other issues by providing a display assembly system with a pick-up tool having 6 degrees of freedom (6DOF) coupled with a pick-up head having an at least partially transparent adhesive element to which light-emitting structures may be adhered for picking and placement during the display manufacture process. Embodiments further include a touchdown sensor coupled with the pick-up tool and pick-up head that allow sensing of a force applied to the pick-up head in an upward direction.

The present invention comprises an arrangement and process for the fluxless manufacture of an integrated circuit component, comprising the steps of loading a solder ball and chip arrangement, solder ball side up or down, onto a first or a second donor chuck respectively; monitoring the solder ball and chip arrangement by a computer-controlled camera; removing the solder ball and chip arrangement from the donor chuck by a computer-controlled gripper mechanism; moving the solder ball and chip arrangement via the gripper mechanism onto a computer-controlled gang carrier, the monitored by a second computer controlled camera; flipping the gang carrier about a horizontal axis so as to arrange the solder ball and chip arrangement into an inverted, solder ball side down orientation over a receiver chuck substrate, monitored and positionally controlled by a third computer-controlled camera; and compressing the solder ball side down solder ball and chip arrangement onto the receiver chuck substrate by a computer-controlled compression rod so as to bond the solder ball side down solder ball and chip arrangement onto the receiver chuck substrate so as to form an integrated circuit assembly.

An apparatus, system and method of providing a tray suitable for holding an optoelectronic device during printed circuit board manufacturing processes. The apparatus, system and method includes a tray body having an inset for receiving the optoelectronic device; a plurality of positioners for the optoelectronic device within the inset; and a guide channel about a perimeter of the tray body suitable for receiving optical fibers of the optoelectronic device when the optoelectronic device is received in the inset, the guide channel comprising at least one retainer for retaining received ones of the optical fibers therewithin.

A manufacturing system according to the present disclosure includes one or more manufacturing apparatuses, a carrier, and a control system. Each of the one or more manufacturing apparatuses performs predetermined work on a board. The carrier carries a burden. The control system controls carrying work by the carrier. The burden includes a plurality of functional modules. Each of the plurality of functional modules provides a predetermined function for the one or more manufacturing apparatuses. The carrier includes a coupling portion to be coupled to any of the plurality of functional modules. The control system has at least one functional module, selected from the plurality of functional modules and coupled to the coupling portion, carried by the carrier.

An apparatus includes a first substrate including a first adhesive layer, a second substrate including a second adhesive layer, a first drum that is rotatable, and a third adhesive layer located on the first drum. The first drum moves to a first location to separate device chips from the first adhesive layer of the first substrate and adheres the device chips to the third adhesive layer by rotating the first drum, and moves to a second location to separate the device chips from the third adhesive layer by rotating the first drum. The adhesive force of the first adhesive layer is less than the adhesive force of the third adhesive layer, and the adhesive force of the third adhesive layer is less than the adhesive force of the second adhesive layer.

The present invention provides a component mounting machine -comprising a picking tool for picking electronic components from a source of electronic components and placing them onto a workpiece, a verification unit for measuring an electrical property of an electronic component picked and held by the picking tool. The verification unit comprises a board, a plurality of test electrodes arranged on a surface of said board and a system for measuring an output signal from the test electrodes upon contact between a picked electronic component and at least two of said test electrodes. Further, at least one test electrode arranged on a flexible portion of the board that is configured to flex upon engagement between a picked electronic component and said at least two test electrodes.

A pick arm for a pick and place apparatus for electronic devices has a main body having a proximal end whereat the pick arm is mountable onto a pick arm support, and a distal end at which a collet is mounted for holding an electronic device. A first rigid body is located adjacent to the proximal end of the pick arm and a second rigid body is located adjacent to the distal end of the pick arm. The first and second flexures connect the first rigid body to the second rigid body. Moreover, the first flexure is spaced from the second flexure, and the first and second flexures have opposing faces that are arranged substantially parallel to each other. An actuator is operative to apply a biasing force onto the second rigid body so as to bend the first and second flexures relative to the first rigid body for biasing the collet of the pick arm to move.

A component supply device includes: a picker base on which a component is to be loaded; a supplier that picks up the component loaded on the picker base and supplies the component to a predetermined position; a detector that detects the component loaded on the picker base; and a hardware processor that determines a state of the component loaded on the picker base, on a basis of information detected by the detector, wherein the hardware processor determines whether the component is a component that is pickable or a component that is unpickable by the supplier on a basis of the state of the component, and calculates an operation amount for adjusting the component that is unpickable to a pickable state and adjusts only a state of the component that is unpickable by an adjuster on a basis of the calculated operation amount.