A nozzle holding mechanism of the invention is capable of holding multiple types of nozzles to a head of a component mounting device and includes: a magnet provided in a holding section of the head; and a magnetic material, attracted to the magnet, provided in a held section of the nozzle on the side held by the holding section of the head, at a position facing the magnet. The magnetic material is provided so as to have a gap between the magnetic material and the magnet while the nozzle is held by the head. The gap is adjusted to be larger or smaller in accordance with the type of the nozzle held by the head.

A component mounting device mounts electronic components fed at component feeding positions arranged in one line onto printed circuit boards, and includes a rotary head and a head transfer mechanism. The rotary head includes a rotary body, an N-axis servomotor that rotates the rotary body, pickup nozzles attached to the rotary body in a movable manner along a rotation axis, and two Z-axis drive units. The pickup nozzles are arranged on an imaginary circle centered at the rotation axis, and hold and release the electronic components. The Z-axis drive units move one of the pickup nozzles located at a predetermined driving position on the imaginary circle along the rotation axis. The N-axis drive units are arranged with the rotary body therebetween in a direction in which the component feeding positions are arranged. The head transfer mechanism moves the rotary head in a direction perpendicular to the rotation axis.

A gripping system includes a gripping device and a pitch adjustment device. The gripping device has a row of grippers arranged in a first direction and adapted to grip a row of contacts and a support frame on which at least two adjacent grippers of the row of grippers are slidably attached. The pitch adjustment device is adapted to drive the at least two adjacent grippers to slide in the first direction to adjust a pitch between the two adjacent grippers.

Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.

An object attachment handler comprising a configurable gripper, configured to define an open and closed position, based on a software definition of an object to be attached, and a fastening tool, automatically configured to apply a defined force curve at defined positions, to complete attachment of the object, based on the software definition of the object.

A picking apparatus is configured to pick up a plurality of micro elements. The picking apparatus includes a main body and a plurality of picking portions. The picking portions connect with and protrude from the main body. Each of the picking portions has a first surface. The first surfaces are away from the main body and configured to pick up the micro elements. The main body has a second surface at least partially located between the picking portions. Each of the first surfaces has a first viscosity. The second surface has a second viscosity. The second viscosity is less than the first viscosity.

A CPU of a management computer sets an nth component in a mounting operation order of the current sequence as a target component, calculates nearby state data of the target component, sets the required accuracy of the target component based on the nearby state data and memorizes the required accuracy of HDD. Because the required accuracy is automatically set based on the nearby state data in this manner, the set required accuracy matches actual circumstances better compared to than with conventional technology. Therefore, it is possible to automatically set appropriate required accuracy of a target component.

A dedicated correction value related to the mounting position of an upper surface recognition component with a characteristic section on an upper surface thereof is memorized in correction value folder 43a of an HDD, and when performing mounting work of mounting the upper surface recognition component on a board, a position deviation amount of the characteristic section is acquired based on an image of the upper surface of the upper surface recognition component captured by a mark camera, and the component is mounted at the mounting position based on the acquired position deviation amount and the dedicated correction value. Accordingly, it is possible to mount the specific component at a corrected mounting position such that the position of the characteristic section is appropriate, thereby improving mounting accuracy for the upper surface recognition component.

A management device for a board work machine includes a storage device storing version information in which a current version of software executed by a constitutive device of a board work machine in a production process is associated individually with the multiple constitutive devices and a version designation section configured to designate a version of the software which is to be applied to the production process based on a type of the production process and the version information.

A component transfer device including: a component mounting tool mounted on a movable mounting head, the component mounting tool being configured to collect a component from a component supply device and mount the component on a board; a side imaging section configured to image the component held by the component mounting tool from the side; a cleaning nozzle having an emission port on a side surface only of the cleaning nozzle that opens toward the side imaging section; and a positive pressure air supply section configured to supply positive pressure air to the cleaning nozzle and blow out the positive pressure air from the emission port toward the side imaging section.