A component mounting machine automatically arranges backup pins at positions designated in a production job. A control device configured to control an operation of each of the component mounting machines determines whether a backup pins exists at a position where the backup pin cannot be automatically arranged in the arrangement of the backup pins designated in the production job, and when the backup pin exist at a position where the backup pin cannot be automatically arranged, excludes the backup pins at the position from the arrangement of the backup pins designated in the production job not to be automatically arranged, and automatically arranges only the other backup pins at the positions designated in the production job.

A component mounting device includes a head unit including a mounting head configured to mount a component on a substrate, and an imaging unit provided on the head unit and configured to image at least one of a suction position of the component to be suctioned by the mounting head and a mounting position of the component mounted by the mounting head from a plurality of directions, such that the imaging unit is configured to capture a first image and a second image. The component mounting device is configured to expand or contract the first image captured by the imaging unit in accordance with an imaging direction of the second image, and acquire a height position of an imaged location based on the first image that has been expanded or contracted and the second image.

A component mounting device includes a control device configured to execute a recognition data creation process and a pickup process. In the recognition data creation process, the control device creates the recognition data by obtaining the angle information of the component, causing the imaging device to operate so as to image the component, and rotating the captured image so obtained to the reference angle based on the angle information. In the pickup process, the control device causes the head to operate so as to pick up the component after the supply state of the component is determined based on the captured image obtained by causing the imaging device to operate so as to image the component, the recognition data created in the recognition data creation process, and the angle information.

A component mounting machine, includes a mounting base provided in a component mounting machine main body and movable at least in the horizontal direction; a mounting/demounting tool, detachably mounted on the mounting base and movable in the up-down direction while holding a component; a tool moving mechanism configured to move the mounting/demounting tool in the up-down direction; a mounting base moving mechanism configured to move the mounting base at least in the horizontal direction; and a control device configured to perform a seating improvement process for applying a force in a predetermined direction, including the horizontal direction, to the mounting base on which the mounting/demounting tool is mounted after the mounting/demounting tool is mounted on the mounting base and before the mounting/demounting tool holds the component, by a moving operation different from a moving operation for holding the component on the mounting/demounting tool in the mounting base moving mechanism.

A component mounting system has a supply reel accommodating a component, a plurality of mounting lines each having a mounting apparatus and a line management apparatus, and a central network that provides direct communication between the line management apparatuses of each mounting line. A remaining number of components on the supply reel is determined based on cross line communication between the line management apparatuses and comparison of data at different times stored on the line management apparatuses. Such architecture does not require the use of a central server. Rather, the system is a material information exchange system without a single point of failure, where no one computer failure can cause an entire factory shutdown.

A control device of an electronic mounting machine that controls an operation of a mounting head when an electronic component is mounted on a printed circuit board including multiple divided boards by using the mounting head having multiple suction nozzles; sets some of the multiple divided boards within the printed circuit board as one group based on positions of the multiple suction nozzles and positions of the multiple divided boards within the printed circuit board; and controls the multiple suction nozzles to mount the electronic components on the some of the divided boards within the one group at a same time.

During mounting of an upper component on a lower component, after mounting the lower component on a board, the Z-axis position of a suction nozzle tip is detected during mounting of the lower component on the board and memorized as a lower component height, and when mounting the upper component PU, the suction nozzle is lowered at relatively high speed until reaching a specified position that is a distance above the lower component height, and the suction nozzle is lowered at a speed that is slower than the speed after arriving at the specified position until contact with the lower component.

A component mounting device includes a mounting portion that mounts a component on a bonding material disposed on a substrate, and a measurement unit that measures a state of the bonding material at least after an operation of mounting the component performed by the mounting portion. The component mounting device further includes a control unit that verifies the state of the bonding material based on a measurement result obtained by the measurement unit when defective mounting of the component has occurred.

The mounting system includes a mounting device having a holding member, a moving work device for collecting or loading a holding member, and a moving work management device. The moving work management device comprises a management control section configured to create exchange order information including a collection order for collecting the holding member that the moving work device operates and/or a replenishment order for replenishing the holding member based on arrangement state information including the usage state of the holding member currently loaded to the mounting device and mounting condition information according to which the mounting device performs the mounting process.

A plurality of nozzles are arranged at intervals of a center-to-center distance along a circumferential orbit around the predetermined rotation axis integrally. The nozzle that is positioned at the working position is changed by rotating the plurality of nozzles around the predetermined rotation axis. At that time, regardless of the manner in which the nozzle positioned at the working position is changed, the nozzle approaching the working position, and the nozzle moving away from the working position, move within an imaging target range having a width smaller than twice the center-to-center distance with the working position as the center along the circumferential orbit. Then, a camera images the nozzle which is moving within the imaging target range. Thus, it is not necessary to temporarily stop the nozzle for imaging, and as a result, imaging of the nozzles is performed efficiently.