The present disclosure relates to a feeder arm for a surface mount technology (SMT) machine. In an embodiment, the feeder arm includes a support body that is fastened to an SMT machine. The feeder arm includes a reel loading body that supports a reel of electrical components to allow the reel to be prepared for installation on the SMT machine. The feeder arm includes preparation circuitry configured to electrically connect the reel to allow the reel to be prepared. The feeder arm includes an articulating joint between the reel loading body and the support body. The articulating joint may articulate the second body between a first position and a second position.

A multi-display device is adapted to be dockable or otherwise associatable with an additional device. In accordance with one exemplary embodiment, the multi-display device is dockable with a smartpad. The exemplary smartpad can include a screen, a touch sensitive display, a configurable area, a gesture capture region(s) and a camera. The smartpad can also include a port adapted to receive the device. The exemplary smartpad is able to cooperate with the device such that information displayable on the device is also displayable on the smartpad. Furthermore, any one or more of the functions on the device are extendable to the smartpad, with the smartpad capable of acting as an input/output interface or extension of the smartpad. Therefore, for example, information from one or more of the displays on the multi-screen device is displayable on the smartpad.

A method for replacing an element of a display device includes: forming a structure with a first liquid layer between a first micro device and a conductive pad of a substrate in which the first micro device is gripped by a capillary force produced by the first liquid layer; evaporating the first liquid layer such that the first micro device is bound to the substrate; determining if the first micro device is malfunctioned or misplaced; removing the first micro device when the first micro device is malfunctioned or misplaced; forming an another structure with a second liquid layer between a second micro device and the conductive pad of the substrate in which the second micro device is gripped by a capillary force produced by the second liquid layer; and evaporating the second liquid layer such that the second micro device is bound to the substrate.

A method for manufacturing an array device includes a placing step of providing a plurality of elements in an array on a first surface of a substrate, an element separating step of separating a plurality of element chips from one another so that each element chip includes one or more elements, an inspecting step of inspecting the plurality of elements, a removing step of removing any element chip of the plurality of element chips from the surface of the substrate on the basis of a result of the inspecting step, and a mounting step of, after the removing step, mounting an element of at least the elements other than an element of the element chip thus removed onto a mounting substrate by transfer from the substrate, the mounting substrate being different from the substrate.

This invention relates to integrating pixelated micro-devices into a system substrate. Defined are methods of transferring a plurality of micro-devices into a receiver substrate where a plurality of micro-devices is arranged in one or more cartridges that are aligned and bonded to a template. Further, defining the transfer process, the micro-devices may be selected, identified as defective and a transfer adjustment made based on defective micro-devices.

An method for operating an object printing system printer prints electrical circuits on non-planar areas of objects and accurately places electronic components within the printed circuits. The method includes operation of a direct-to-object printer to form an electrical circuit on an object secured within the direct-to-object printer and operation of an electronic component placement system to retrieve an electronic component and install the electronic component in the electrical circuit on the object secured within the direct-to-object printer in response to a generation of a signal by the direct-to-object printer for the electronic component placement system that indicates the electronic component is to be installed in the circuit on the object secured within the direct-to-object printer.

Methods and devices for minimizing and maximizing displayed output associated with applications are provided. More particularly, an application presented across two or more screens of a device in a landscape mode can be minimized to present portion of the application in one of the screens. With respect to a maximization operation received with respect to a page of an application results in the expansion of the displayed portion of the application to multiple screens of the device. Input to effect minimization and maximization operations can be entered in one or more gesture capture regions associated with the screens.

Methods and devices for selecting a card from an application stack, wherein the card represents a corresponding application that a user would like to make active or bring focus to. The selecting includes one or more of a dragging and a tapping action, with these actions being triggers for transitioning the device to an optional drag state or tapped state, respectively. Transitioning through this state executes the activating of a corresponding application or other action on the device to facilitate window/application/desktop management. The selecting further allows a user to specify which a touch screen (or portion hereof) on which a particular application should be launched.

A mounting head includes a pickup nozzle, a shaft member, a drive unit, and a position retainer. The shaft member has a cylindrical shape and moves in an axial direction to switch a pressure applied to the pickup nozzle between negative and positive pressures. First and second movement ends in the axial direction are negative and positive pressure application positions, respectively, where negative and positive pressure, respectively, is applied to the pickup nozzle. The drive unit includes a drive source that moves a movable portion in the axial direction. The movable portion contacts the shaft member when moved in the axial direction, to move the shaft member between the negative and positive pressure application positions. During a power-off period of the drive source, the position retainer holds the movable portion in a predetermined position away from the shaft member located at the negative or positive pressure application positions.

An object printing system printer enables printing of electrical circuits on non-planar areas of objects and the accurate placement of electronic components within the printed circuits. The system includes a direct-to-object printer and an electronic component placement system. The direct-to-object printer is configured to form an electrical circuit on an object secured within the direct-to-object printer. The electronic component placement system is configured to retrieve an electronic component and install the electronic component in the electrical circuit on the object secured within the direct-to-object printer in response to the direct-to-object printer generating a signal for the electronic component placement system that indicates the electronic component is to be installed in the circuit on the object secured within the direct-to-object printer.