Methods and devices for minimizing and maximizing displayed output associated with applications are provided. More particularly, an application presented across two or more screens of a device in a landscape mode can be minimized to present portion of the application in one of the screens. With respect to a maximization operation received with respect to a page of an application results in the expansion of the displayed portion of the application to multiple screens of the device. Input to effect minimization and maximization operations can be entered in one or more gesture capture regions associated with the screens.

A semiconductor mounting device for mounting chip components on a substrate, wherein the device is reduced in size. A semiconductor mounting device 10 comprises: a temporary placement stage 12 on which are loaded a plurality of chip components 30a, 30b, 30c; a conveyance head 14 that conveys the chip components 30a, 30b, 30c to the temporary placement stage 12, and also loads each of the chip components 30a, 30b, 30c on the temporary placement stage 12 so that the relative positions of the plurality of chip components 30a, 30b, 30c reach predetermined positions; a mounting stage 16 that secures a substrate 36 by suction; and a mounting head 18 that suctions the plurality of chip components 30a, 30b, 30c loaded on the temporary placement stage 12, and pressurizes while keeping the relative positions at prescribed positions on the substrate 36 that is secured by suction to the mounting stage 16.

The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.

A component mounting system includes: a component mounting machine that mounts an electronic component having a predetermined electrode portion on a solder printed on a substrate, the electronic component being fixed to the substrate with a thermosetting adhesive; and an adhesive inspection device. The component mounting machine: sets, with regard to the electronic component to be fixed with the adhesive that cures at a temperature lower than a melting temperature of the solder, a target mounting height along a height direction perpendicular to a face of the substrate on which the adhesive is applied; and mounts the electronic component at the target mounting height. The target mounting height is: an ideal mounting height based on design data; or a height lower than the ideal mounting height by a value that corresponds to a sinking of the electronic component as a result of melting of the solder.

Methods and devices for selecting a card from an application stack, wherein the card represents a corresponding application that a user would like to make active or bring focus to. The selecting includes one or more of a dragging and a tapping action, with these actions being triggers for transitioning the device to an optional drag state or tapped state, respectively. Transitioning through this state executes the activating of a corresponding application or other action on the device to facilitate window/application/desktop management. The selecting further allows a user to specify which a touch screen (or portion hereof) on which a particular application should be launched.

The invention concerns a process for the production of a circuit carrier (1) equipped with at least one surface-mount LED (SMD-LED), wherein the at least one SMD-LED (2) is positioned in oriented relationship to one or more reference points (3) of the circuit carrier (1) on the circuit carrier (1), wherein the position of a light-emitting region (4) of the at least one SMD-LED (2) is optically detected in the SMD-LED (2) and the at least one SMD-LED (2) is mounted to the circuit carrier (1) in dependence on the detected position of the light-emitting region (4) of the at least one SMD-LED (2), and such a circuit carrier (1).

There is provided a component mounter that performs pressure-bonding of a plurality of components placed on the board, to the board, the component mounter including: a board holder that holds the board and lifts and lowers the held board; a plurality of backups that support, from a side below the board, at least one of the plurality of components placed on the held board and are each provided with a suction port which suctions an undersurface of the board; a sucking unit that is connected to the suction port and performs vacuum-sucking of the board placed on the plurality of backups; and at least one pressure-bonding head that performs pressure-bonding of the plurality of components placed on the suctioned board, to the board.

Systems and methods including bonding two or more separately formed circuit layers are provided using, for example, cold welding techniques. Processing techniques may be provided for combining inorganic and/or organic semiconductor devices in apparatus including, for example, microchips, optoelectronic devices, such as solar cells, photodetectors and organic light emitting diodes (OLEDs), and other apparatus with multi-layer circuitry. Methods of bonding preformed circuit layers may include the use of stamping and pressure bonding contacts of two or more circuit layers together. Such methods may find applicability, for example, in bonding circuitry to shaped substrates, including various rounded and irregular shapes, and may be used to combine devices with different structural properties, e.g. from different materials systems.

A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.

The invention relates to an apparatus and a method for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.