A control device, that based on number one and number two component presence signals, respectively calculates number one and number two cutting points of number one and number two tapes from predetermined pitch of number one and number two cavities, and number one and number two distances between number one and number two detection positions and number one and number two cutting positions. By this, cutting points can be specified even when tapes have different pitches between cavities, and the tapes can be spliced reliably.

A mounting device includes: an application part applying paste on a substrate to form an application body; a bonding part forming a mounted body by mounting a chip component on the substrate via the application body; a first imaging part imaging the application body after application processing and before mounting processing to acquire first image information; a second imaging part imaging the mounted body after the mounting processing to acquire second image information; and a control part controlling the application part, the bonding part, and the first and second imaging parts, and obtains a 3D application body shape (first shape) from the first image information as a first shape and calculates a 3D mounted body shape (second shape) from the second image information. The control part evaluates the application processing or the mounting processing based on the first and the second shapes.

Heights of components or parts thereof are measured within a printing machine by measuring their relative rather than absolute heights. A virtual surface may be constructed from the measured heights, with a tolerance level employed based on the virtual surface. The invention is particularly suited to measurement of tooling components within a printing machine, such as tooling pins.

A component mounting device includes a mounting head that mounts a component at a mounting position on a substrate, and a control unit that determines a mounting state of another component mounted in advance around the mounting position based on height information of a region around the mounting position.

A printed circuit board inspection apparatus can inspect the mounting state of a component by generating depth information on the component mounted on a printed circuit board by using a pattern of light reflected from the component and received by an image sensor, inputting the generated depth information into a machine-learning-based model, obtaining depth information with reduced noise from the machine-learning-based model, and using depth information with reduced noise.

In some examples, a system receives a first image of a circuit board produced by a first production stage, and compares the first image to a second image of the circuit board acquired at a second production stage for the circuit board. The system indicates an anomaly with the circuit board based on the comparing.

A component mounting machine including a head unit that has a head main body configured to hold multiple pickup members each capable of picking up a component at a predetermined interval along a predetermined circumference and to be capable of rotating forward and reverse directions; a moving device configured to move the head unit; a lifting and lowering device configured to lift and lower a pickup member; a component supply device configured to be capable of supplying the component to the pickup member; and a control device configured to control those described above. The control device performs a control such that the pickup members pick up the components supplied by the component supply device, and each component is mounted on a board after a completion of the pickup, while performing an operation of rotating the head main body and an operation of moving the head unit together.

A work machine comprising a work head configured to hold an electrical component having multiple lead terminals; a moving device configured to move the work head in the up-down direction; an imaging device configured to image the electrical component held with work head while being illuminated from the side; and a control device configured to control the operation of the work head and the moving device; wherein the control device calculates the inclination of an electrical component held by the work head based on imaging data of lead terminals of the electrical component imaged by the imaging device while the work head is moved in the up-down direction by the moving device, so that the mounting work of the electrical component is performed by taking the calculated inclination into account.

A control device that controls a control target apparatus including a moving part and an imaging device that changes its position relative to a target as the moving part moves and that acquires a captured image of the target, includes a drive unit that drives the moving part, based on a drive command signal to move the moving part to a target position, a relative position estimation unit that calculates an estimated value of a relative position between the target and the imaging device, based on the drive command signal, a template image correction unit that corrects a preregistered template image, based on a time-series signal of the estimated value of the relative position within an imaging time of the imaging device, and a target position correction unit that corrects the target position using the corrected template image.

A method for processing substrates, in particular wafers, masks or flat panel displays, with a semi-conductor industry machine, wherein a computer-supported process is used to determine the presence and/or position and/or orientation of the substrate. Further, a system designed to execute the method. The computer-supported process includes an artificial neural network.