A component mounting machine which deals with a component remaining on a nozzle of a mounting head includes a board conveyance device conveying a board to a predetermined position, a component supply device accommodating multiple components therein, a component mounting device on which a mounting head which picks up and holds a component by vacuum pumping of a suction nozzle is installed and which mounts a component which is taken out from the component supply device onto a board which is conveyed by the board conveyance device, and a control device controlling each of the devices. The component mounting device performs lowering of the component, releasing the component with respect to the suction nozzle of the mounting head, a first lifting of the component to a middle height, a component pickup performed at the height of the first lifting, and a second lifting after the component pickup.

An electronic component mounting device including a component holding device to hold and mount on a board an electronic component supplied by a component supply device; a motor to drive the component holding device; a motor control device to control the motor; a load measurement device to measure a load applied from the component holding device upon being pressed by the component holding device while the component holding device performs the same operation as when mounting an electronic component on a board, by replacing the board with the load measurement device; a motor information acquisition section to obtain motor information corresponding to the force with which the motor drives the component holding device in the pressing direction against the load measurement device while the motor control device performs the same operation as when mounting an electronic component on the board, by replacing the board with the load measurement device.

A component transfer device includes a detector configured to detect a rotation angle of a driving motor that moves a pair of gripping sections, or a position of the gripping sections, and a motor control section configured to perform position feedback control of the driving motor based on a detection signal of the detector and a position command signal from the transfer control device. A transfer control device is provided with a torque monitoring section configured to monitor a value of a command torque applied to the driving motor from the motor control section, and a gripping state determining section configured to determine that there was a change in a gripping state of the component when, with the pair of gripping sections in a state gripping the component, the command torque monitored by the torque monitoring section drops to a value smaller than a first threshold value.

A system for transferring a substrate may adjust a suction force to a suitable level. The system may include a work table, a picker, and a pressure measuring unit. The work table may include a work area for supporting the substrate. The picker may be disposed above the work table and may include a suction unit for providing the suction force. The pressure measuring unit may overlap the suction unit and may include a pressure-sensitive element for facilitating adjustment of the suction force.

A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck supporting the first substrate, a second bonding chuck disposed above the first bonding chuck and supporting the second substrate, a resonant frequency detector detecting a resonant frequency of a bonded structure with the first substrate and the second substrate which are at least partially bonded to each other, and a controller controlling a distance between the first bonding chuck and the second bonding chuck according to the detected resonant frequency of the bonded structure.

A component placing device to place a component on a board, including: a shaft having a lower portion and an upper portion; a component holder that is attached to the lower portion of the shaft in a state of being vertically displaceable and has a suction hole for holding the component by a negative pressure; an elastic body that biases the component holder downward with respect to the shaft; a servo motor that raises and lowers the shaft; and a controller that sets a thrust limit value for limiting a thrust of the servo motor and limits the thrust of the servo motor to be equal to or lower than the thrust limit value when the component holder is lowered toward the board. The thrust limit value is set within a range in which a load is smaller than a force by which the elastic body biases the component holder.

Systems, apparatus, methods, and techniques of assembly of discrete modules of a control panel are disclosed. The modules can be independently wired, tested, and installed into a control panel. Module definitions are defined specifying components to perform the electrical function, a mechanical arrangement of the components, electrical connections, and logical interactions of the module. A bill of materials can be generated based on a designation of a set of modules for a control panel and the module definitions. Modularly assembled control panels are disclosed. An assembly frame is described herein for temporarily mounting components of a module for independent assembly of a control module and for eventual removal and installation into a control panel frame. The assembly frame may include a faceplate frame and side frames and temporary mounting features.

There is described an electronic device testing system for testing an electronic device having a substrate on which is printed a metamaterial structure using an ink. The electronic device testing system generally has: a terahertz radiation emitter configured to emit an incident terahertz radiation beam to be incident on the metamaterial structure of the substrate, the incident terahertz radiation beam having power at least at the terahertz resonance frequency of the metamaterial structure; a terahertz radiation receiver configured to receive an outgoing terahertz radiation beam outgoing from the metamaterial structure and to measure an amplitude of an electric field of the outgoing terahertz radiation beam at least at the terahertz resonance frequency; and a controller configured to determine a conductivity value indicative of a conductivity of the ink based on said amplitude of the electric field of the outgoing terahertz radiation beam.

A multiple lens-based smart mechanical arm, wherein it comprises a multi joint multi-functional mechanical arm, a CCD camera for collecting PCB board images to be assembled, a bio-contact device, and a computer; the CCD camera is mounted on the multi joint multi-functional mechanical arm, the bio-contact device is mounted on the fingertip of the multi joint multi-functional mechanical arm, and the CCD camera, and the bio-contact device and the multi joint multi-functional mechanical arm are connected to the computer. The invention adds a biological tactile device on the basis of the binocular positioning to accurately locate the assembly target area and improve the accuracy of the assembly of the irregular parts. The conversion relationship between the pressure and electric output of the sensitive material in the bio-contact device and the mathematical model of pressure and position is applied. The present invention realizes high-precision and real-time assembly of irregular parts and improves the production efficiency of the electronic assembly industry.

A method for manufacturing an array device includes a placing step of providing a plurality of elements in an array on a first surface of a substrate, an element separating step of separating a plurality of element chips from one another so that each element chip includes one or more elements, an inspecting step of inspecting the plurality of elements, a removing step of removing any element chip of the plurality of element chips from the surface of the substrate on the basis of a result of the inspecting step, and a mounting step of, after the removing step, mounting an element of at least the elements other than an element of the element chip thus removed onto a mounting substrate by transfer from the substrate, the mounting substrate being different from the substrate.