The substrate processing management system for a substrate processing line including a defect tallying section to calculate a defect rate representing a rate of occurrence of substrates or electronic components determined to be defective with the substrate inspection machine, or obtain a number of defective products having substrates or electronic components determined to be defective; an attribute change recognition section to recognize when an attribute, among the attributes of the electronic component, having a possibility of affecting the inspection, has changed in the component mounting machine; a fault point estimation section to estimate, when the defect rate or the number of defective products exceeds a predetermined value, which of the component mounting machine or the substrate inspection machine is a fault point depending on whether an attribute has changed; and a countermeasure calling section configured to call for a defect countermeasure to the estimated fault point.

A service system and a server capable of increasing an operation rate of a production base are provided. The server acquires operation information of a component mounter in a mounting work from a host computer in the production base. The server generates analyzed result data obtained by analyzing the operation information based on the types of the manufacturers (component manufacturer and the package manufacturer) of electronic component and the package. The server transmits the generated analyzed result data to host computers in the other production bases.

A method for factory analysis and/or maintenance, preferably including receiving factory information and/or associating defects with factory components, and optionally including acting based on defect associations and/or operating factory machines. The method is preferably associated with one or more manufacturing systems and/or elements thereof.

A board management system includes an extraction means and a generation means. The extraction means extracts a feature amount that depends on position deviation, for each of a plurality of specific components determined in advance based on a degree of variation in the component mounting position, among a plurality of components in a board image in which a board is captured. The generation means generates individual identification information to be used for identifying a board, from the extracted feature amount.

A method for factory analysis and/or maintenance, preferably including receiving factory information and/or associating defects with factory components, and optionally including acting based on defect associations and/or operating factory machines. The method is preferably associated with one or more manufacturing systems and/or elements thereof.

A trace assistance device includes a memory section, an acquisition section, and an output section. The memory section stores a manipulation log and an operation log. When a predetermined trigger event occurs during the board work, the acquisition section acquires at least one target manipulation history related to the trigger event, a target operation history associated with the target manipulation history, a comparison manipulation history that is the same as or similar to the target manipulation history, and a comparison operation history associated with the comparison manipulation history from the manipulation log and the operation log stored in the memory device. The output section is configured to output an operation of the board production line recorded in the target operation history and an operation of the board production line recorded in the comparison operation history, which are acquired by the acquisition section, in a comparable manner.

A substrate work machine for repeatedly performing substrate work, the substrate work machine including a data storing section configured to store component data used in the substrate work, the component data including shape data related to a shape of an electronic component to be mounted on a substrate, a reference value and a tolerance; a data determining section configured to determine whether a difference between measurement data acquired by measuring the electronic component during the substrate work and the reference value of the component data is within a range of the tolerance; a quality information acquiring section configured to acquire work quality information related to a performance condition of a second substrate work machine; and a data correcting section configured to correct at least one of the reference value and the tolerance in accordance with the work quality information.

An allowance setting system, a substrate inspection device, an allowance setting method, and a substrate inspection method that can set an appropriate inspection allowance are provided in which a normal mounting position of electronic component on a component mounting surface of substrate is defined as normal position. A deviation of an actual mounting position of electronic component in a surface direction of the component mounting surface with respect to the normal position is defined as surface direction deviation. A deviation of the actual mounting position of electronic component in a rotation direction within the component mounting surface with respect to normal position is defined as angular deviation. Allowance setting system sets multiple surface direction inspection allowances according to angular deviation for evaluating surface direction deviation in a substrate inspection before reflow.

Systems and methods for detecting an incorrectly attached heat sink component on an electronic device. The system includes one or more temperature sensors secured to the electronic device and a controller unit comprising one or more processors and one or more computer-readable media, the computer-readable media having stored thereon executable instructions that are executable by the one or more processors to perform a method for detecting incorrectly attached heat sink components. The method includes receiving temperature data, calculating a thermal ramp rate, comparing the thermal ramp rate to a predetermined threshold ramp rate, and transmitting a fault signal when the calculated thermal ramp rate exceeds the predetermined threshold ramp rate.

A component mounting machine includes a base material device to convey a circuit base material, a component mounting device to mount an electronic component, an imaging device to capture a predetermined region including the circuit base material, a first detection section to detect at least one device mark provided on the base material device and at least one base material mark provided on the circuit base material, a calculation section to calculate a position on the circuit base material where the electronic component is to be mounted, based on the device mark and the base material mark detected by the first detection section, and a feedback section configured to feed back, as a correction value for correcting a position on the circuit base material to be calculated next by the calculation section, a part of the deviation amount detected by a second detection section.