A component mounting system and a method for inspecting mounted components are provided. A component mounting system according to an embodiment, comprises a solder inspection apparatus comparing coordinate information of the solder, which is obtained through measurement of a substrate to which solder is applied, with reference coordinate information to generate coordinate correction data; and a first mounting inspection apparatus comparing a first measurement data obtained by measuring mounting state of a component when the component is mounted based on the coordination correction data through a component mounting apparatus, with the coordinate correction data to verify whether a component is mounted on a position corrected based on the coordinate correction data. In this manner, by adding the verification function for the performance function of the component mounting apparatus to the inspection apparatus, it is possible to monitor the operation state of the component mounting apparatus in each process step.

A component mounting system is a system in which a mounting machine and an inspection device are connected to a management device so as to enable data communication therewith. The mounting machine includes a mounting analysis unit that acquires suction position shift data for each component mounting operation of a mounting head. The inspection device includes an inspection analysis unit that acquires mounting position shift data corresponding to each of a plurality of target mounting positions. The management device includes a mark generating unit and a display unit. Based on each suction position shift data and each mounting position shift data, the mark generating unit generates a suction shift mark and a mounting shift mark each of which visualizes the direction and the size of a positional shift. The display unit displays each suction shift mark or each mounting shift mark at each marking position on board graphics.

There is provided technology which is a component mounting machine which mounts electronic components onto a circuit substrate and is capable of displaying a movable region of an inner portion of the component mounting machine within a same image. The component mounting machine is provided with a fixed camera which monitors the inner portion of the component mounting machine and a display section which is capable of displaying a captured image of the fixed camera. The fixed camera is capable of imaging a range from a pickup position at which the suction nozzle picks up the electronic component which is supplied from the component feeder to a mounting position at which the electronic component is mounted onto the circuit substrate within the same image.

In some examples, a system derives a first representation of an assembly of components based on a first source of information, and derives a second representation of the assembly of components based on a second source of information that is of a different type than the first source of information, where the second representation includes any or a combination of an indication of a source of a respective component of the assembly of components, or placement location information of a component in the assembly. The system compares the first representation to the second representation to identify a deviation between the first representation and the second representation, the deviation corresponding to an alteration of the assembly of components.

In a component mounting system, recovery processing is repeated until a recovery count number Nr is larger than or equal to a defined count number Nth in a case where a pickup defect of a component occurs, an elapsed time is measured from error stoppage of a component mounting machine to canceling of the error stoppage in which the component mounting machine is error-stopped when the recovery count number Nr is larger than or equal to the defined count number Nth, the defined count number Nth is increased within a range in which the defined count number does not exceed the upper limit value Nmax in a case where the elapsed time is shorter than a defined time Tth, and the defined count number Nth returns to an initial value in a case where the elapsed time is longer than or equal to the defined time Tth.

In the automatic assembling system, a part mounting cell includes a solder mounting unit that solders an electronic part to a printed circuit board, and a printed-circuit-board information acquisition unit that acquires printed circuit board information including at least one of position information on an alignment mark disposed at a specific position on the printed circuit board, mounting position information on the electronic part on the printed circuit board, and warpage information on the printed circuit board. The manufacturing management device includes a compensation data generation unit that generates, based on the printed circuit board information, compensation data for compensating for a program to be executed in a downstream process cell. The downstream process cell includes a downstream process execution unit that executes a downstream process based on the compensation data generated by the compensation data generation unit.

The production management device is applied to a production line for producing a board product. The production line includes a component mounter configured to mount a component on a circuit board under predetermined mounting conditions and an inspection device configured to inspect the mounting state of the component mounted on the circuit board, downstream from the component mounter. The production management device includes an information management section configured to store statistical information in which a mounting condition when a component, that is an inspection target, is mounted on a circuit board is linked to the results of multiple inspections by the inspection device.

An apparatus that communicates with a screen printer and a solder inspection device is disclosed. The apparatus according to the present disclosure may include a process that is configured to: obtain first information associated with each of a plurality of pads on the substrate; obtain second information associated with each piece of the solder paste applied to each of the plurality of pads from the solder inspection device; determine a position correction value for the stencil mask with respect to the substrate based on the first information and the second information; and deliver the position correction value to the screen printer.

A component mounter is provided with a characteristic value measuring device that measures a characteristic value of first component, and head that mounts each of first component and second component on board. Second component is a digital potentiometer provided with receiver section that receives information from head, variable resistance section for which the resistance is variable, and control section that controls the resistance value of variable resistance section. Head is provided with receiver section that receives information from characteristic value measuring device, sender section that sends information to second component, power source that supplies electric current to variable resistance section, memory section that memorizes the resistance value of second component according to the characteristic value of first component, and control section.

An electronic apparatus including a display and one or more processor is disclosed. The one or more processor is configured to: divide a first error value of each of a plurality of first components with respect to a mounting position acquired through inspection of a plurality of substrates of a first type, into a plurality of error values, generate a graph of a tree structure including a plurality of nodes corresponding to the plurality of first components, component types of each of the plurality of first components and a plurality of components included in a mounter, adjust attributes of each of the plurality of nodes using the plurality of error values divided from the first error value of each of the plurality of first components, and display the graph in which the attributes of each of the plurality of nodes are adjusted, on the display.