A production line monitoring device that identifies a cause of a production defect, reduces the amount of analysis data and computation, and performs real-time processing, is provided. The production line monitoring device includes a defect indication detection unit that detects an indication of a production defect of a production line, and a defect cause identification unit that identifies a cause of the production defect. The defect indication detection unit collects measurement information measured by an inspection apparatus for each reference that identifies a position on products, and detects an indication of the production defect from the change with time of the measurement information at the references. The defect cause identification unit performs stratified analysis based on production information related to the reference when the defect indication detection unit detects an indication of a production defect, and identifies a cause of a production defect from a result of the analysis.

A mounting device includes: an application part applying paste on a substrate to form an application body; a bonding part forming a mounted body by mounting a chip component on the substrate via the application body; a first imaging part imaging the application body after application processing and before mounting processing to acquire first image information; a second imaging part imaging the mounted body after the mounting processing to acquire second image information; and a control part controlling the application part, the bonding part, and the first and second imaging parts, and obtains a 3D application body shape (first shape) from the first image information as a first shape and calculates a 3D mounted body shape (second shape) from the second image information. The control part evaluates the application processing or the mounting processing based on the first and the second shapes.

An electronic apparatus including a display and one or more processor is disclosed. The one or more processor is configured to: divide a first error value of each of a plurality of first components with respect to a mounting position acquired through inspection of a plurality of substrates of a first type, into a plurality of error values, generate a graph of a tree structure including a plurality of nodes corresponding to the plurality of first components, component types of each of the plurality of first components and a plurality of components included in a mounter, adjust attributes of each of the plurality of nodes using the plurality of error values divided from the first error value of each of the plurality of first components, and display the graph in which the attributes of each of the plurality of nodes are adjusted, on the display.

An apparatus that communicates with a screen printer and a solder inspection device is disclosed. The apparatus according to the present disclosure may include a process that is configured to: obtain first information associated with each of a plurality of pads on the substrate; obtain second information associated with each piece of the solder paste applied to each of the plurality of pads from the solder inspection device; determine a position correction value for the stencil mask with respect to the substrate based on the first information and the second information; and deliver the position correction value to the screen printer.

A component mounter images suction states of components picked up by a suction nozzle, processes images of the suction states of the components to recognize the suction state of the component, and stores the images in a storage device with linking production information related to the components. An inspection machine images a mounted state of each component on a board, processes an image of mounted state of each component to recognize the mounted state of each component, and inspects whether a mounting error occurred for each component based on the recognition result. The inspection machine determines that a mounting error occurred for any of the components the image of the mounted state of the component for which a mounting error was determined to have occurred and a searched image of the suction state of the component are displayed on the display monitor in a comparative manner.

A mounted board manufacturing system that manufactures a mounted board, which is a board mounted with a component. The mounted board manufacturing system includes: at least one component loading device that executes a component loading operation for loading the component on a board; a rule base with which at least one machine parameter for executing the component loading operation performed by the at least one component loading device can be calculated; an operation information aggregator that aggregates, for each component data, results of processing executed by the at least one component loading device, together with operation information; and a calculation processor that selects, as actual training data, component data corresponding to an operation result that exceeds a predetermined reference, from the operation information aggregator, and estimates at least one machine parameter of a new component, using the actual training data, the rule base, and basic information of the new component.

A correction amount calculation device includes a first acquisition section and a correction amount calculation section. The first acquisition section is configured to acquire a first positional deviation amount, which is a positional deviation amount of a printing position detected by a printing inspection machine with respect to a pad position, and a second positional deviation amount, which is a positional deviation amount of a mounting position detected by a appearance inspection machine with respect to the pad position. The correction amount calculation section is configured to, based on the first positional deviation amount and the second positional deviation amount, calculate a correction amount, which is used in the mounting process of a board product to be produced later, regarding a third positional deviation amount, which is a positional deviation amount of the mounting position with respect to the printing position.

Each of multiple component mounting machines constituting a component mounting line is configured to switch between a production mode in which a component is mounted on a circuit board that has been conveyed in and then conveyed out, a mounting accuracy measurement mode in which a mounting accuracy measurement component is mounted at a predetermined position on a mounting accuracy measurement board and the mounting accuracy is measured, and a pass mode in which a component is conveyed out without being mounted on the board conveyed in. When the control mode of two or more component mounters among the multiple component mounting machines is the mounting accuracy measurement mode, the mounting accuracy is measured by conveying the mounting accuracy measurement board along the board conveyance path, and the two or more component mounting machines sequentially use the mounting accuracy measurement board to measure the mounting accuracy.

A correction amount calculation device includes a selection section and a correction amount calculation section. The selection section is configured to select a target component in which a movement amount of the component on a board before and after being conveyed to a reflow furnace is equal to or less than a predetermined allowable value. The correction amount calculation section is configured to calculate a correction amount, which is used in a mounting process of a board product to be produced later, regarding a positional deviation amount of the mounting position of the target component selected by the selection section with respect to a target mounting position.

A method of inspecting a printed circuit board (PCB) assembly includes acquiring an image of the PCB assembly and analyzing the image, wherein the analysis includes an object-based analysis of the image for recognizing at least one component placed on the PCB, wherein the object-based analysis is performed based on an object-based analysis program, and wherein the object-based analysis program includes a trained machine learning model. The method further includes: determining whether the at least one component is placed on the PCB based on a comparison between a finding of the object-based analysis and stored assembly information for the PCB; outputting an error when one or more components are missing or wrongly placed; inputting a result of a visual inspection of the PCB assembly that indicates a pseudo-error of the object-detection analysis; and writing one or more settings for soldering the PCB assembly by a soldering device.