An electronic component mounting device including a component holding device to hold and mount on a board an electronic component supplied by a component supply device; a motor to drive the component holding device; a motor control device to control the motor; a load measurement device to measure a load applied from the component holding device upon being pressed by the component holding device while the component holding device performs the same operation as when mounting an electronic component on a board, by replacing the board with the load measurement device; a motor information acquisition section to obtain motor information corresponding to the force with which the motor drives the component holding device in the pressing direction against the load measurement device while the motor control device performs the same operation as when mounting an electronic component on the board, by replacing the board with the load measurement device.

A device for estimating a cause of a mounting error includes a first determination section configured to perform a process of determining whether the error occurrence status is biased under a condition that an individual as the first factor is specified according to a difference in the second factor, on each of multiple individuals as the first factor, a second determination section configured to perform a process of determining whether the error occurrence status is biased under a condition that an individual as the second factor is specified according to a difference in the first factor, on each of multiple individuals as the second factor, and a cause estimation section configured to estimate a causative individual causing the mounting error based on determination results in the first determination section and the second determination section.

The apparatus according to various embodiments includes one or more processors, and one or more memories operatively connected to the one or more processors. The one or more memories may store instructions that, when executed, cause the one or more processors to acquire a plurality of first position offsets of a plurality of first components respectively mounted on a plurality of first substrates with respect to a plurality of pads of the plurality of first substrates corresponding to the plurality of first components from the optical measurement device, set a range of a normal state for a component position offset based on the plurality of first position offsets, generate a control signal for adjusting at least one control parameter of the component mounting device associated with a component mounting position based on the range of the normal state, and transmit the control signal to the component mounting device.

The present disclosure provides an apparatus for determining mounting information. The apparatus according to the present disclosure may be configured to acquire solder measurement information indicating a state of a solder printed on a first substrate, determine whether or not the state of the solder is changed from states of solders printed on second substrates, which are measured prior to measurement of the first substrate, based on the solder measurement information, upon the determination that the state of the solder is not changed, determine mounting information indicating a mounting condition for mounting a first component on the first substrate using one or more models, and deliver the mounting information to a mounter. The one or more models may be configured to output the mounting information based on a correlation between states of a second component before and after a reflow process for each of the second substrates.

The present disclosure provides an apparatus for determining mounting information. The apparatus according to the present disclosure may be configured to acquire solder measurement information indicating a state of a solder printed on a first substrate, determine whether or not the state of the solder is changed from states of solders printed on second substrates, which are measured prior to measurement of the first substrate, based on the solder measurement information, upon the determination that the state of the solder is not changed, determine mounting information indicating a mounting condition for mounting a first component on the first substrate using one or more models, and deliver the mounting information to a mounter. The one or more models may be configured to output the mounting information based on a correlation between states of a second component before and after a reflow process for each of the second substrates.

A component mounting system includes a plurality of component mounters, a characteristic inspection device, and a management device. Each of the component mounters transmits inspection area component information including identification information of the corresponding component mounter, information of a conveyed-in board, and identification information of an inspection-required component installed in an inspection area, to the management device. The characteristic inspection device determines whether or not the inspection-required component installed in the inspection area is an error component, and transmits the information on the determined inspection-required component to the management device as error information. The management device specifies the component mounter in which the inspection-required component determined to be an error component is installed in the inspection area as an error component mounter, based on the transmitted error information, and stops an operation of the identified component mounter.

A support plate, which is configured to support a component supply tape, is provided on a bottom face section of a tape passage, through which the component supply tape passes, of a tape feeder. A computer acquires information on a type of the support plate provided in the tape feeder and also acquires information on a type of components of the component supply tape. Further, the computer determines the appropriateness of a combination of the type of the support plate and the type of the components of the component supply tape so acquired by referring to a database accumulating therein data on appropriate combinations of types of support plates and types of components of component supply tapes and outputs a message corresponding to a determination result of the appropriateness of the combination to at least one of a display device, an audio device, and a mobile terminal.

A tracing device includes an appropriateness determination section configured to determine whether an image processing, which is executed in a production process of a board product by a board work machine, satisfies an appropriateness condition indicating reliability of a result of the image processing when the result of the image processing stays within a permissible range in which the result of the image processing is determined normal and an information management section configured to record image data used in the image processing as traceability information according to the result of the determination made by the appropriateness condition determination section.

A correction amount calculation device includes a first acquisition section and a correction amount calculation section. The first acquisition section is configured to acquire a first positional deviation amount, which is a positional deviation amount of a printing position detected by a printing inspection machine with respect to a pad position, and a second positional deviation amount, which is a positional deviation amount of a mounting position detected by a appearance inspection machine with respect to the pad position. The correction amount calculation section is configured to, based on the first positional deviation amount and the second positional deviation amount, calculate a correction amount, which is used in the mounting process of a board product to be produced later, regarding a third positional deviation amount, which is a positional deviation amount of the mounting position with respect to the printing position.

A component mounter includes a pickup member configured to pick up a component, and a control device. When a predetermined error occurs after a pickup operation that picks up the component is performed by the pickup member, the control device stops production in a state where the component, which is a target of an error, is held by the pickup member, in a case where a number of boards produced from a start of production is within a predetermined number of the boards, performs a retry operation that discards the component picked up by the pickup member and picks up a new component, in a case where the number of the boards produced from the start of production exceeds the predetermined number of the boards, and stops production when the error is not resolved even if the retry operation is performed.