A data management device selects acquisition data of a deletion target from a storage device storing multiple acquisition data acquired by a board work machine performing a predetermined board work on a board. The data management device includes an acquisition section and a selection section. The acquisition section divides an evaluation index when evaluating a target object extracted from the acquisition data or the board work using the target object into multiple classes and acquires frequency-related information obtained by calculating a frequency of the acquisition data belonging to each of the classes for the multiple acquisition data of the same type stored in the storage device. The selection section selects the acquisition data having a higher frequency as the acquisition data of the deletion target by using the frequency-related information acquired by the acquisition section.

A method for determining a cause of a mounting failure for a component mounted on a substrate, which is performed by an electronic apparatus, comprises: receiving an inspection result of a mounting failure for each of a plurality of first components determined by inspecting a plurality of substrates of a first type; calculating a mounting failure rate of each of the plurality of first components using the inspection result; determining a plurality of second components in which a mounting failure has occurred based on the mounting failure rate; and determining a cause of the mounting failure for each of the plurality of second components as at least one of a component mounting position setting error, a mounting condition setting error according to a component type and a defect of a nozzle, based on the mounting failure rate of each of the plurality of first components.

An apparatus for showing an arrangement having a plurality of physical blocks which includes a first block having a vertical axis and a second block having a vertical axis. The apparatus includes a grid upon which the plurality of blocks is placed to form an arrangement of blocks with respect to the grid. The apparatus includes a computer in communication with the grid. The computer receiving signals from the grid which reveal a location and an identity of the first block about its vertical axis and the second block about its vertical axis. The signals used by the computer to drive an interactive computer graphic visualization of the arrangement of physical blocks with respect to the grid. The present invention pertains to a method for showing an arrangement.

An electronic component mounting machine includes an image-capturing device and a control device. The image-capturing device captures the images of sub-fiducial marks and main fiducial marks. When the control device can read the main fiducial marks from the images captured by the image-capturing device, the control device determines the mounting positions of the electronic components with respect to a substrate with reference to the main fiducial marks. On the other hand, when the main fiducial marks cannot be read from the images due to a print defect of the main fiducial marks, the control device determines the mounting positions of the electronic components with respect to the substrate with reference to the sub-fiducial marks which are the reference sources of the image-capturing positions of the main fiducial marks.

A component mounting line includes a plurality of component mounting apparatuses, each of which mounts solder and a component other than the solder on a substrate. The component mounting line includes: a time limit management unit configured to manage an elapsed time period of a member; and a usability determiner that determines whether the member is usable based on the elapsed time period of the member. The elapsed time period is a time period that has elapsed after the member is exposed to the air, and the member comprises at least one of a substrate, solder, and a component other than the solder.

A three-dimensional measurement apparatus measures measurement targets placed in a target measurement area on a measurement object. The apparatus includes: a measurement module that: is positioned with respect to the target measurement area, and includes: a first irradiator that irradiates the target measurement area with predetermined light for height measurement; a second irradiator that irradiates the target measurement area with predetermined patterned light for three-dimensional measurement; and an imaging device that takes an image of the target measurement area; and a control device that moves the measurement module in a height direction and successively positions the measurement module at a predetermined height position determined by mapping, and performs, based on image data taken by irradiating the target measurement area with predetermined patterned light, three-dimensional measurement to the measurement targets at the predetermined height position.

An inspection management system having a plurality of processes and managing final inspection performed to inspect a completed product and one or more intermediate inspections performed to inspect an intermediate product manufactured in the processes earlier than a final process includes: an inspection content data acquisition unit that acquires inspection content data including an inspection standard for each inspection item of the product; an inspection content setting unit that sets inspection content based on the inspection content data acquired by the inspection content data acquisition unit; a simulation unit that simulates inspection in accordance with assumed inspection content; an inspection standard calculation unit that calculates an inspection standard more appropriate than a current inspection standard based on the simulation; and an output unit that outputs base information indicating that at least the inspection standard calculated by the inspection standard calculation unit is more appropriate than the current inspection standard.

A pick and place nozzle performance analytics system streams production data from pick and place machines used in electronic assembly to a cloud platform as torrential data streams, and performs analytics on the production data to track, visualize, and predict performance of individual nozzles in terms of rejects or miss-picks. The analytics system generates a performance vector for each nozzle based on the collected production data, the performance vector tracking both the accumulated rejects and the percentage of rejects as respective dimensions of an x-y plane. The system monitors and analyzes the trajectory of this vector in the x-y plane to predict when performance degradation of the nozzle will reach a critical threshold. In response to predicting that nozzle performance degradation will exceed a threshold at a future time, the system can generate and deliver notifications to appropriate client devices.

In order to realize stable quality control, provided is a quality control device (1) having an input device which receives data such as an operation condition of each device (21) to (26) in a production system (20) for producing a product; a calculation unit which assigns a value of the operation condition to a correlation formula calculated in advance and calculates a value derived from the correlation formula; and a determination unit which performs good or bad determination on a quality of a workpiece in each process, on the basis of a result calculated by the calculation unit. Further, when “bad” is determined as a result of the good or bad determination, the quality control device (1) calculates an appropriate value of the operation condition and sets the value to each device (21) to (26).

A component mounting device includes a mounting portion that mounts a component on a bonding material disposed on a substrate, and a measurement unit that measures a state of the bonding material at least after an operation of mounting the component performed by the mounting portion. The component mounting device further includes a control unit that verifies the state of the bonding material based on a measurement result obtained by the measurement unit when defective mounting of the component has occurred.