Patent classifications
H05K13/084
Production management device for mounting components on multiple board types
A production management device includes data management section having multiple correspondence data in which component types are linked to each product type of board product with reference codes, and process setting section for selecting, when circuit board is carried into component mounting machine in a family production, a product type for each of multiple unit boards based on identification information and sets the type of mounting process to be executed for each of multiple unit boards by selecting correspondence data for the selected product type.
COMPONENT MOUNTING SYSTEM, COMPONENT MOUNTING DEVICE, AND COMPONENT MOUNTING METHOD
A component mounting system includes a component mounting device including a component mounting unit configured to mount a component on a substrate, and a controller, and a server configured to be communicable with the controller. The controller is configured or programmed to acquire a plurality of types of operating state changes that are likely to cause a quality defect, and to transmit, to the server, information according to the types of the operating state changes. The server is configured to provide information indicating an inspection type for the substrate based on the information according to the types of the operating state changes.
COMPONENT PLACING DEVICE AND COMPONENT PLACING METHOD
A component placing device to place a component on a board, including: a shaft having a lower portion and an upper portion; a component holder that is attached to the lower portion of the shaft in a state of being vertically displaceable and has a suction hole for holding the component by a negative pressure; an elastic body that biases the component holder downward with respect to the shaft; a servo motor that raises and lowers the shaft; and a controller that sets a thrust limit value for limiting a thrust of the servo motor and limits the thrust of the servo motor to be equal to or lower than the thrust limit value when the component holder is lowered toward the board. The thrust limit value is set within a range in which a load is smaller than a force by which the elastic body biases the component holder.
ELECTRONIC COMPONENT SET, CAPACITOR, ELECTRONIC-COMPONENT-SET MANUFACTURING METHOD, READING METHOD, AND READER
An electronic component set includes a plurality of electronic components and a holding member that holds the plurality of electronic components. Each of the plurality of electronic components includes an identification unit. The plurality of electronic components are held by the holding member to allow an optical reader to read the identification unit of the each of the plurality of electronic components.
TRACING DEVICE
A tracing device includes an appropriateness determination section configured to determine whether an image processing, which is executed in a production process of a board product by a board work machine, satisfies an appropriateness condition indicating reliability of a result of the image processing when the result of the image processing stays within a permissible range in which the result of the image processing is determined normal and an information management section configured to record image data used in the image processing as traceability information according to the result of the determination made by the appropriateness condition determination section.
Production line safety system
In a component-mounted-board production line in which an automatic exchanging device moves along a row of multiple component mounters, each component mounter is provided with a power supplying section that supplies power wirelessly. The automatic exchanging device is provided with a power receiving section that receives electric power supplied wirelessly from the power supplying section of the component mounter that the automatic exchanging device is facing, a monitoring section that monitors whether a person or object has entered a monitoring area around the automatic exchanging device, and a safety circuit section that turns off the power supply to a motor that is the driving source of the automatic exchanging device but continues supplying power to the monitoring section and the like when the monitoring section detects that a person or object has entered the monitoring area.
Component mounting line
A component mounting line configured to move an automatic exchanging device that performs setting and removing of feeders of multiple component mounters, including a position detecting device that detects the position of the automatic exchanging device is configured from a timing belt with an end and provided to extend in a straight line along the moving lane on the front side of the component mounting line, a timing pulley that moves together with the automatic exchanging device while maintaining a state in which the teeth of the timing pulley are engaged with the teeth of the timing belt, and a rotary encoder that outputs a rotation angle of the timing pulley, and the pulse output of the rotary encoder is counted to detect the position of the automatic exchanging device.
Component placing method
A component placing device to place a component on a board, including: a shaft having a lower portion and an upper portion; a component holder that is attached to the lower portion of the shaft in a state of being vertically displaceable and has a suction hole for holding the component by a negative pressure; an elastic body that biases the component holder downward with respect to the shaft; a servo motor that raises and lowers the shaft; and a controller that sets a thrust limit value for limiting a thrust of the servo motor and limits the thrust of the servo motor to be equal to or lower than the thrust limit value when the component holder is lowered toward the board. The thrust limit value is set within a range in which a load is smaller than a force by which the elastic body biases the component holder.
Die component supply device
A die component supply device includes a wafer holding section; a suction nozzle configured to pick up the die components one by one from the component holding sheet; an imaging camera configured to image the die component, which is a pickup target of the suction nozzle, together with the surrounding condition, before being picked up to obtain component image data; a driving section configured to move the suction nozzle and the imaging camera with respect to the wafer holding section; and a data processing memory section configured to collectively store multiple pieces of component image data obtained for each multiple die component or multiple pieces of component characteristic data obtained by performing image processing on the multiple pieces of component image data in wafer characteristic data.
PRODUCTION SYSTEM AND PRODUCTION METHOD
A production system includes: a substrate counter configured to count the number of substrates existing in a production line including a mounting device; a mark pattern acquisition unit configured to acquire a mark pattern indicating a pattern of a mark that is provided to each of the plurality of substrates counted by the substrate counter; a determination unit configured to determine whether the respective mark patterns of the plurality of substrates acquired by the mark pattern acquisition unit are the same as each other; and a detection controller configured to control a detection process of the mark pattern by the mounting device based upon a determination result of the determination unit.