When a specification setting unit sets a specification of a lot number “k+1” after setting a specification of a lot number “k”, a mounting program selector performs a mounting program corresponding to the lot number “k”, and then selects a mounting program corresponding to the lot number “k+1” according to matching between a mounting number from the mounting program and a planned number of products of the lot number “k”. A printing program selector selects a printing program corresponding to the lot number “k”, and then selects a printing program corresponding to the lot number “k+1” according to matching between a sum of a printing number from the printing program and a defective product number and the planned number of products of the lot number “k”. Consequently, on-demand production of an electronic device can easily be manufactured on a manufacturing line.

A control method includes: determining a first state of a plurality of components in an electronic device; acquiring a first operating state of the electronic device; and determining whether to allow one or more of the plurality of components to be removed based on the first state of the plurality of components and the first operating state of the electronic device.

A representation of the electronic component to be mounted according to a production program is displayed so as to be superimposed on the image of the mounting area on the display device, and the production program is edited so that a mounting orientation of the electronic component matches an orientation of the pad pattern, in a case where the mounting orientation of the electronic component designated in the production program does not match the orientation of the pad pattern in the mounting area when an operator looks at the representation of the electronic component displayed so as to be superimposed on the image of the mounting area on the display device.

A device for estimating a cause of a mounting error includes a first determination section configured to perform a process of determining whether the error occurrence status is biased under a condition that an individual as the first factor is specified according to a difference in the second factor, on each of multiple individuals as the first factor, a second determination section configured to perform a process of determining whether the error occurrence status is biased under a condition that an individual as the second factor is specified according to a difference in the first factor, on each of multiple individuals as the second factor, and a cause estimation section configured to estimate a causative individual causing the mounting error based on determination results in the first determination section and the second determination section.

The present disclosure provides an apparatus for determining mounting information. The apparatus according to the present disclosure may be configured to acquire solder measurement information indicating a state of a solder printed on a first substrate, determine whether or not the state of the solder is changed from states of solders printed on second substrates, which are measured prior to measurement of the first substrate, based on the solder measurement information, upon the determination that the state of the solder is not changed, determine mounting information indicating a mounting condition for mounting a first component on the first substrate using one or more models, and deliver the mounting information to a mounter. The one or more models may be configured to output the mounting information based on a correlation between states of a second component before and after a reflow process for each of the second substrates.

A component type management device includes an association registration section configured to register association data in which individual identification information of a component supply device which is attached to a component mounter and supplies a component is associated with a type of the component held in the component supply device, an association discarding section configured to discard the association data in a case where a predetermined condition is satisfied after the component supply device is detached from the component mounter, a detachment discrimination section configured to discriminate whether the component supply device is detached by an automatic exchanging device; and an association maintaining section configured to invalidate a function of the association discarding section before the predetermined condition is satisfied and maintain the association data in a case of being discriminated that the component supply device is detached by the automatic exchanging device.

A component mounting system includes a component mounter group, a storage container, a loader, a host computer, and a production management computer. The host computer prepares jobs for each product based on a production plan for producing multiple types of products in which predetermined various types of components are mounted on a mounting target and sets a job in the jobs so prepared that satisfies a specified determination condition as a determined job. The production management computer shares the determined job with the host computer, makes a processing preparation for the determined job and thereafter causes the loader to unload and/or load component supply devices based on the results of the processing preparation for the determined job.

A component mounting machine including a component supply device to supply a component to a supply position; a component transfer device to pick up the component from the supply position and mount the component on a board; a component detecting section to detect whether the component is present at the supply position before or while the component is being picked up by the component mounting tool; a holding detecting section to detect whether the component mounting tool is holding the component following pickup; and a retry performing section to determine whether to perform a retry operation of attempting to pick up the component again using the component mounting tool based on a detection result of the component detecting section and a detection result of the holding detecting section, and to perform the retry operation in accordance with a result of the determining of whether to perform the retry operation.

There is provided a board work machine (a component mounting machine) including a data registration section for registering in advance multiple data (ultra-high precision data, high precision data, normal precision data) for each characteristic of a member constituting a base material for a circuit board in accordance with the type and characteristic of the member; a work performing section (a part camera) for performing work using the member or performing work on the member while selecting one item of data from the multiple data for reference; and an automatic data switching section for automatically switching among the multiple member data that the work performing section refers to in accordance with the performing situation of the work performed by the work performing section.

The present disclosure provides an apparatus for determining mounting information. The apparatus according to the present disclosure may be configured to acquire solder measurement information indicating a state of a solder printed on a first substrate, determine whether or not the state of the solder is changed from states of solders printed on second substrates, which are measured prior to measurement of the first substrate, based on the solder measurement information, upon the determination that the state of the solder is not changed, determine mounting information indicating a mounting condition for mounting a first component on the first substrate using one or more models, and deliver the mounting information to a mounter. The one or more models may be configured to output the mounting information based on a correlation between states of a second component before and after a reflow process for each of the second substrates.