A component mounting system includes a component mounter group, a storage container, a loader, a host computer, and a production management computer. The host computer prepares jobs for each product based on a production plan for producing multiple types of products in which predetermined various types of components are mounted on a mounting target and sets a job in the jobs so prepared that satisfies a specified determination condition as a determined job. The production management computer shares the determined job with the host computer, makes a processing preparation for the determined job and thereafter causes the loader to unload and/or load component supply devices based on the results of the processing preparation for the determined job.

A work management device manages a board work line having multiple board work machines for performing work on a board. The work management device includes a problem detection section configured to detect that a problem has occurred in any of the multiple board work machines; a handling method database configured to accumulate handling methods for problems; an updating section configured to update handling methods for problems at any time; and a work instruction section configured to extract and indicate to an operator a handling method for a problem from the handling method database when the problem detection section detects that the problem has occurred.

A data creation device including a component data storage section to link in advance and store lead component shape data and multiple types of holding tools; a holding tool data storage section to store holding tool data including moving directions of the multiple holding tools and clamping directions for holding the lead component; a mounting data acquisition section to acquire mounting data including the types and mounting positions on the board of previously-attached components and lead components; an installation order determination section to extract, for each lead component according to a determined mounting order of lead components on the board based on shape data and mounting data of lead components, a holding tool to mount lead components without interfering with previously-attached components, and determine the installation order of holding tools; and an allocation data creation section to create allocation data according to the determined installation order.

A component mounting system includes a plurality of component mounters, a characteristic inspection device, and a management device. Each of the component mounters transmits inspection area component information including identification information of the corresponding component mounter, information of a conveyed-in board, and identification information of an inspection-required component installed in an inspection area, to the management device. The characteristic inspection device determines whether or not the inspection-required component installed in the inspection area is an error component, and transmits the information on the determined inspection-required component to the management device as error information. The management device specifies the component mounter in which the inspection-required component determined to be an error component is installed in the inspection area as an error component mounter, based on the transmitted error information, and stops an operation of the identified component mounter.

A component placing device to place a component on a board, including: a shaft having a lower portion and an upper portion; a component holder that is attached to the lower portion of the shaft in a state of being vertically displaceable and has a suction hole for holding the component by a negative pressure; an elastic body that biases the component holder downward with respect to the shaft; a servo motor that raises and lowers the shaft; and a controller that sets a thrust limit value for limiting a thrust of the servo motor and limits the thrust of the servo motor to be equal to or lower than the thrust limit value when the component holder is lowered toward the board. The thrust limit value is set within a range in which a load is smaller than a force by which the elastic body biases the component holder.

This patent application relates to apparatus and methods for enhanced microelectronic device handling. Apparatus comprises a pick arm having a pick surface configured for receiving a microelectronic device thereon, drives for moving the pick arm and reorienting the pick surface in the X, Y and Z planes and about a horizontal rotational axis and a vertical rotational axis, and a sensor device carried by the pick arm and configured to detect at least one of at least one magnitude of force and at least one location of force applied between the pick surface and a structure contacted by the pick surface or a structure and a microelectronic device carried on the pick surface. Related methods are also disclosed.

Component mounting system 1 includes electronic component mounting device 10, control device 100, image processing device 110, and storage device 115. Electronic component mounting device 10 includes mounting head 26, supply device 28, and component camera 90. Electronic component mounting device 10 holds a supplied electronic component with mounting head 26, and images the held electronic component with component camera 90. Controller 102 performs image processing on captured image data with image processing device 110 to determine the acceptability and position of the electronic component (S6). Controller 102 monitors the start and end of the storage period (S10, S13) based on the magnitude relationship between the error rate calculated from the determination result information in the error rate calculation process (S8) and the reference error rate (S9). If the image data captured with component camera 90 is stored within the storage period, controller 102 stores the image data in storage device 115 (S11).

A component mounting machine including a head unit that has a head main body configured to hold multiple pickup members each capable of picking up a component at a predetermined interval along a predetermined circumference and to be capable of rotating forward and reverse directions; a moving device configured to move the head unit; a lifting and lowering device configured to lift and lower a pickup member; a component supply device configured to be capable of supplying the component to the pickup member; and a control device configured to control those described above. The control device performs a control such that the pickup members pick up the components supplied by the component supply device, and each component is mounted on a board after a completion of the pickup, while performing an operation of rotating the head main body and an operation of moving the head unit together.

A parts replenishment system configured to replenish a parts supply device attached to a parts mounting device with parts includes an instruction device configured to issue an instruction to unload the parts from a storage. The parts replenishment system further includes a presentation device configured to present preprocessing identification information for identifying preprocessing, which is processing on a packaging material for the parts for which an unloading instruction has been issued by the instruction device before replenishment of the parts supply device with the parts.

The present invention comprises an arrangement and process for the fluxless manufacture of an integrated circuit component, comprising the steps of loading a solder ball and chip arrangement, solder ball side up or down, onto a first or a second donor chuck respectively; monitoring the solder ball and chip arrangement by a computer-controlled camera; removing the solder ball and chip arrangement from the donor chuck by a computer-controlled gripper mechanism; moving the solder ball and chip arrangement via the gripper mechanism onto a computer-controlled gang carrier, the monitored by a second computer controlled camera; flipping the gang carrier about a horizontal axis so as to arrange the solder ball and chip arrangement into an inverted, solder ball side down orientation over a receiver chuck substrate, monitored and positionally controlled by a third computer-controlled camera; and compressing the solder ball side down solder ball and chip arrangement onto the receiver chuck substrate by a computer-controlled compression rod so as to bond the solder ball side down solder ball and chip arrangement onto the receiver chuck substrate so as to form an integrated circuit assembly.