A dielectric substrate may support conductive traces that form windings for a least one pole of a planar armature of an axial flux machine. At least a portion of the dielectric substrate, which is adapted to be positioned within an annular active area of the axial flux machine, may include a soft magnetic material. Such a planar armature may be produced, for example, by forming the conductive traces on the dielectric substrate, and filling interstitial gaps between the conductive traces with at least one epoxy material in which the soft magnetic material is embedded.

A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board.

A circuit board according to an embodiment includes a first insulating portion including at least one insulating layer; a second insulating portion disposed on the first insulating portion and including at least one insulating layer; and a third insulating portion disposed under the first insulating portion and including at least one insulating layer; wherein the insulating layer constituting the first insulating portion includes a prepreg containing glass fibers, and wherein each of the insulating layers constituting the second and third insulating portions is made of resin coated copper (RCC).

An object of the present invention is to provide a resin composition which enables formation of a resin layer having excellent electrical performance including high frequency performance and appropriate solubility with desmear solution required on a material used in manufacturing of a printed wiring board. To achieve the object, the resin composition used for constituting a resin layer on a metal layer surface of a laminate includes a polyphenylene ether compound and 10 parts by mass to 100 parts by mass of a styrene-butadiene block copolymer and 0.1 parts by mass to 100 parts by mass of a component promoting solubility with desmear solution against 100 parts by mass of the polyphenylene ether compound.

A multi-layered board includes: a middle conductive layer; a first dielectric layer that is disposed directly on a first surface of the middle conductive layer; a second dielectric layer that is disposed directly on a second surface of the middle conductive layer; a first outer surface conductive layer that is disposed directly on an outer side of the first dielectric layer; and a second outer surface conductive layer that is disposed directly on an outer side of the second dielectric layer. The first outer surface conductive layer serves as a first outer surface of the multi-layered board, and the second outer surface conductive layer serves as a second outer surface of the multi-layered board. The middle conductive layer is solidly formed over an entire planar direction of the multi-layered board. The first dielectric layer and the second dielectric layer each independently have a thickness variation of 15% or less.

A printed circuit board with high-capacity and high-current copper circuit includes a conductive trace, a first protecting layer, and a second protecting layer on opposite sides of the conductive trace. The conductive trace includes a basic conductive trace pattern, a first conductive trace pattern, and a second conductive trace pattern. The first and second conductive trace patterns are directly formed on opposite surfaces of the basic copper conductive trace pattern. A width of trace of the first conductive trace pattern is the same as a line width of the second conductive trace pattern.

A circuit assembly (200) is disclosed comprising a substrate (210) and conducting layers (250) on opposing sides of the substrate (210), there being at least one via (220) through the substrate (210), which via (220) forms a conductive path between the conducting layers, wherein the substrate (210) is a foam substrate, and wherein the via (220) is provided with a solid dielectric lining (270) plated with a conducting material (250).

An electronic device is disclosed. The electronic device may comprise: a housing having a first dielectric constant and including a first part; a substrate disposed inside the housing and including a communication module disposed on the surface thereof opposite to the first part; and a ceramic layer formed between the substrate and the first part to cover the communication module, wherein the first part and the ceramic layer are formed to have a second dielectric constant different from the first dielectric constant. Various other embodiments understood through the specification are possible.

The present invention provides a low-dielectric resin composition comprising (A) a urethane resin obtained by reacting a polycarbonate diol and an isocyanate, (B) an epoxy resin, and (C) a filler, wherein the (A) urethane resin has a carboxyl group equivalent weight of 1,100 to 5,700 g/eq; the epoxy equivalent weight of the (B) epoxy resin is 0.3 to 4.5 equivalents per 1.0 equivalent of the carboxyl group of the (A) urethane resin, the (A) urethane resin has a weight-average molecular weight of 5,000 to 80,000; the (A) urethane resin has a polycarbonate content of 35% by mass or lower; the resin composition comprises 50 parts by mass or less of the (C) filler per 100 parts by mass of the (A) urethane resin; and the resin composition comprises substantially no imido group.

An electronic device is provided. The electronic device includes a hinge, a first housing having at least a portion coupled to a first side of the hinge and including a first substrate assembly, a second housing having at least a portion coupled to a second side of the hinge, including a second substrate assembly, and configured to be foldable and unfoldable, a flexible display supported on the first and second housing and configured to be foldable and unfoldable, an FPCB electrically connecting the first and second substrate assembly, a through hole formed in the first housing forming a path through which the at least one FPCB passes, a first sealing member disposed so as to compress a first side surface of the at least one FPCB disposed in the through hole, and a second sealing member presses the second side surface of the FPCB disposed in the through hole.