A photodetector is provided, including an active layer configured to generate charge carriers of a first type and of a second type by absorption of electromagnetic radiation; a first electrode configured to collect the charge carriers of the first type; and a second electrode configured to collect the charge carriers of the second type, the first electrode including a layer configured to collect the charge carriers of the first type, the layer including self-assembled monolayers, and nanowires comprising metal and functionalized by the self-assembled monolayers, the self-assembled monolayers of the layer are configured to functionalize the nanowires and to modify a work function of a material forming the nanowires. A method for manufacturing a photodetector and an electrode for a photodetector are also provided.

Technologies for integrated circuit components with liquid metal interconnects are disclosed. In the illustrative embodiment, a bed of nails socket can mate with an integrated circuit component with liquid metal interconnects. The nails pierce a foam cap layer that seals the liquid metal interconnects, electrically coupling the nails to the liquid metal interconnects. A fabric layer adjacent to the foam cap layer helps secure the foam cap layer, preventing small pieces of the foam cap layer that may be dislodged during repeated insertion into a bed of nails socket from becoming separated from the foam cap layer. The fabric layer can provide additional benefits, such as removing more of the liquid metal from the nails when the integrated circuit component is removed from the bed of nails socket.

A manufacturing method for a multi-layer circuit board is provided. The multi-layer circuit structure is disposed on the delivery loading plate through the bottom dielectric layer, the delivery loading plate and the patterned metal interface layer expose the conductive corrosion-barrier layer, and the top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and the electrical connection layer. Therefore, before the multi-layer circuit board is delivered to the assembly company or before the multi-layer circuit board is packaged with chips, an electrical testing can be applied to the multi-layer circuit board to check if the multi-layer circuit board can be operated normally or not.

A manufacturing method for a multi-layer circuit board is provided. According to the multi-layer circuit board manufactured by the manufacturing method, the multi-layer circuit structure is disposed on the delivery loading plate through the bottom dielectric layer, the delivery loading plate and the patterned metal interface layer expose the conductive corrosion-barrier layer, and the top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and the electrical connection layer. Therefore, before the multi-layer circuit board is delivered to the assembly company or before the multi-layer circuit board is packaged with chips, an electrical testing can be applied to the multi-layer circuit board to check if the multi-layer circuit board can be operated normally or not.

Detection column wires and detection row wires are configured of thin wires made of a conductive material having light reflectivity, such as a metal or alloy including silver and aluminum. A predetermined plural number of detection column wires are electrically connected to form a plurality of column-direction bundle wires. A predetermined plural number of detection row wires are electrically connected to form a plurality of row-direction bundle wires. A reflected-light distribution pattern is further provided. When viewed in a direction vertical to the surface of the touch screen, the reflected-light distribution pattern includes a curved portion, and the normal lines of the curved portion head for all directions.

A printed circuit board includes: multiple electrically insulating laminate sheets laminated together in a stack; a first electrically conductive layer formed from a superconductor material arranged on a first exterior surface of the stack, the first electrically conductive layer including a signal line and a ground plane; a second electrically conductive layer formed from a superconductor material arranged on a second exterior surface of the stack, the second exterior surface opposing the first exterior surface; a third conductive trace between a first electrically insulating laminate sheet of the stack and a directly adjacent second electrically insulating laminate sheet of the stack; a first via extending through from the signal line through the stack to the third conductive trace, in which the signal line is electrically connected to the third conductive trace through the via.

A multi-layer circuit board capable of being applied with electrical testing includes a patterned metal-interface layer, a metallic delivery loading plate, an electrical connection layer, a conductive corrosion-barrier layer, a bottom dielectric layer, and a multi-layer circuit structure. The multi-layer circuit structure is disposed on the delivery loading plate through the bottom dielectric layer. The top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and the electrical connection layer. The delivery loading plate and the patterned metal-interface layer expose the conductive corrosion-barrier layer. Therefore, before the multi-layer circuit board is packaged, an electrical testing can be applied to the multi-layer circuit board to check if it can be operated normally. Hence, costs for figuring out reasons of the unqualified electronic component can be reduced, and responsibilities for the unqualified electrical testing result of the electronic component can be clarified.

To provide a printed circuit board that allows for easy exchange of only a deterioration detection conductor, and can reduce costs. A printed circuit board includes: a main printed circuit board in which a wiring pattern is formed on an insulated substrate; and a deterioration detection wiring board in which deterioration detection wiring (deterioration detection wiring pattern) which is wiring having a form whereby deterioration is promoted compared to the wiring pattern on the insulated substrate is formed on a separate insulated substrate from the main printed circuit board, and is exchangeably connected to the main printed circuit board in a vicinity thereof by way of a replacement-enabling connection part. One mode of the replacement-enabling connection part of the printed circuit board is a connection part (solder joint) constituted by solder, another mode thereof is a connection part (electrically conductive adhesive connection part) constituted by electrically conductive adhesive, and yet another mode thereof is a connection part (cable) constituted by a cable.

A multi-layer circuit board capable of being applied with electrical testing includes a metallic delivery loading plate, a bottom-layer circuit structure, a conductive corrosion-barrier layer, and a multi-layer circuit structure. The bottom-layer circuit structure is overlapping on the delivery loading plate. The conductive corrosion-barrier layer is disposed on the bottom dielectric layer. The multi-layer circuit structure is overlapping on the bottom-layer circuit structure. The top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the inner-layer circuit of the multi-layer circuit structure and the bottom-layer circuit of the bottom-layer circuit structure. The delivery loading plate and the bottom dielectric layer of the bottom-layer circuit structure expose the conductive corrosion-barrier layer. Therefore, before the multi-layer circuit board is packaged, an electrical testing can be applied to the multi-layer circuit board to check if it can be operated normally.

A multi-layer circuit board capable of being applied with electrical testing includes a patterned metal-interface layer, a metallic delivery loading plate, an electrical connection layer, a conductive corrosion-barrier layer, a bottom dielectric layer, and a multi-layer circuit structure. The multi-layer circuit structure is disposed on the delivery loading plate through the bottom dielectric layer. The top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and the electrical connection layer. The delivery loading plate and the patterned metal-interface layer expose the conductive corrosion-barrier layer. Therefore, before the multi-layer circuit board is packaged, an electrical testing can be applied to the multi-layer circuit board to check if it can be operated normally. Hence, costs for figuring out reasons of the unqualified electronic component can be reduced, and responsibilities for the unqualified electrical testing result of the electronic component can be clarified.