The present invention provides a light-transmitting conductor comprising: a substrate; and a conduction layer on the substrate, wherein the conduction layer comprises a conductive material, and the conduction layer has a pattern corresponding to a network formed such that nanostructures are arranged to intersect with each other that includes a substrate and a conduction layer on the substrate.

An electrical conductor includes a substrate; and a first conductive layer disposed on the substrate and including a plurality of metal oxide nanosheets, wherein adjacent metal oxide nanosheets of the plurality of metal oxide nanosheets contact to provide an electrically conductive path between the contacting metal oxide nanosheets, wherein the plurality of metal oxide nanosheets include an oxide of Re, V, Os, Ru, Ta, Ir, Nb, W, Ga, Mo, In, Cr, Rh, Mn, Co, Fe, or a combination thereof, and wherein the metal oxide nanosheets of the plurality of metal oxide nanosheets have an average lateral dimension of greater than or equal to about 1.1 micrometers. Also an electronic device including the electrical conductor, and a method of preparing the electrical conductor.

A microelectronic substrate may be fabricated having a substrate core with at least one plated through hole extending therethrough, wherein the plated through hole includes a fluorescent conductive fill material which can be utilized to detect defects during the fabrication process. In one embodiment, the microelectronic substrate may be fabricated by forming a substrate core, forming a hole to extend from a first surface to an opposing second surface of the substrate core, forming a conductive material layer on a sidewall(s) of the substrate core hole, disposing a fluorescent conductive fill material to abut the conductive material layer and fill the remaining substrate core hole, illuminating an exposed portion of the fluorescent conductive fill material, and detecting anomalies in the light fluoresced by the exposed portion of the fluorescent conductive fill material.

Circuit board assemblies include a circuit board portion having a recess formed therein, an electrically and thermally conductive insert, shaped to fit in the recess formed in the circuit board portion, an electrically and thermally conductive layer adapted and configured to interface with an external chassis, and a thermally conductive electrically insulative portion interposed between the electrically and thermally conductive insert and the electrically and thermally conductive layer, adapted and configured to conduct heat from the electrically and thermally conductive insert to the electrically and thermally conductive layer without conducting electricity.

An electrical conductor includes a substrate; and a first conductive layer disposed on the substrate and including a plurality of metal oxide nanosheets, wherein adjacent metal oxide nanosheets of the plurality of metal oxide nanosheets contact to provide an electrically conductive path between the contacting metal oxide nanosheets, wherein the plurality of metal oxide nanosheets include an oxide of Re, V, Os, Ru, Ta, Ir, Nb, W, Ga, Mo, In, Cr, Rh, Mn, Co, Fe, or a combination thereof, and wherein the metal oxide nanosheets of the plurality of metal oxide nanosheets have an average lateral dimension of greater than or equal to about 1.1 micrometers.

A pattern-forming method for forming a conductive circuit pattern, the pattern-forming method including the steps of: preparing a pattern-forming composition composed of: Cu powder; solder particles for electrically coupling the Cu powder; a polymer resin; a deforming agent that is selected from among acrylate oligomer, polyglycols, glycerides, polypropylene glycol, dimethyl silicon, simethinecone, tributyl phosphare, and polymethylsiloxane, and that increases bonding force between the Cu powder and the solder particles; a curing agent; and a reductant; forming a circuit pattern by printing the pattern-forming composition on a substrate; heating the circuit pattern at a temperature effective to cure the pattern-forming composition and provide the conductive circuit pattern; and electrolytically plating a metal layer onto the conductive circuit pattern. A circuit pattern having superior conductivity is formed at low cost.

To provide a printed circuit board that allows for easy exchange of only a deterioration detection conductor, and can reduce costs. A printed circuit board includes: a main printed circuit board in which a wiring pattern is formed on an insulated substrate; and a deterioration detection wiring board in which deterioration detection wiring (deterioration detection wiring pattern) which is wiring having a form whereby deterioration is promoted compared to the wiring pattern on the insulated substrate is formed on a separate insulated substrate from the main printed circuit board, and is exchangeably connected to the main printed circuit board in a vicinity thereof by way of a replacement-enabling connection part. One mode of the replacement-enabling connection part of the printed circuit board is a connection part (solder joint) constituted by solder, another mode thereof is a connection part (electrically conductive adhesive connection part) constituted by electrically conductive adhesive, and yet another mode thereof is a connection part (cable) constituted by a cable.

A strip for an electronic device senses a liquid sample. The strip includes a substrate having a first surface, a plurality of protrusions disposed on the first surface, and each having a width, and a hydrophilic layer having a layer surface disposed on the first surface and the plurality of protrusions, and having a second surface opposite to the layer surface, whereby the liquid sample and the second surface have a contact angle therebetween ranging from 2 to 85 degrees when the liquid sample is disposed on the hydrophilic layer.

Provided is an optically transparent conductive material which is suitable as an optically transparent electrode for capacitive touchscreens, the optically transparent conductive material not causing moire even when placed over a liquid crystal display, having a favorably low pattern conspicuousness (non-conspicuousness), and having a high reliability. The optically transparent conductive material has, on an optically transparent support, an optically transparent conductive layer having optically transparent sensor parts electrically connected to terminal parts and optically transparent dummy parts not electrically connected to terminal parts, and in this optically transparent conductive material, the sensor parts and the dummy parts are formed of a metal thin line pattern having a mesh shape, and in the plane of the optically transparent conductive layer, the contour shape of each of the sensor parts extends in a first direction, the dummy parts are arranged alternately with the sensor parts in a second direction perpendicular to the first direction, the sensor parts are arranged at a cycle of L in the second direction, at least part of the metal thin line pattern in the sensor parts has a cycle of 2L/N in the second direction (wherein N is any natural number), and the metal thin line pattern in the dummy parts has a cycle longer than 2L/N or does not have a cycle in the second direction.

A process of constructing a filled via of a printed circuit board comprises drilling a via hole through a body of the printed circuit board, desmearing a barrel of the via hole, metallizing a outer surface of the via barrel, electroplating the via barrel, pushing nano-copper solder into the via hole and heating the circuit board in order to melt the nano-copper solder within the via hole. The nano-copper solder improves the thermal conductivity of the printed circuit board for applications when heat needs to be conducted from one side of the printed circuit board to another.