An electronic assembly 52 includes a plurality of circuit boards 70, 74, 78 each comprising engagement grooves 84 spaced around an outer wall. The assembly includes a plurality of spacers 72, 76 with alignment elements. The alignment elements comprise a first tab 92 and a first tab receiver 93 extending in a first axial direction. The alignment elements further comprising a second tab 90 extending in a second axial direction opposite the first and a second tab receiver 91 extending in the second axial direction. A first spacer 72 is disposed between a first circuit board 70 and a second circuit board 74. The first tab 92 of the first spacer 72 is disposed within a first engagement groove of the first circuit board 70. The second circuit board 74 is disposed between the first spacer 72 and a second spacer 76. A second tab 90 of the first spacer 72 is received in a second engagement groove 84 of the second circuit board 74 and a first tab receiver 93 of the second spacer 76.

A printed circuit board connecting device (1) for connecting printed circuit boards (3, 5) includes a non-conductive plate (21) having a top side and a bottom side, and a plurality of interface connections (23) which are arranged in the plate (21) so as to be spaced apart from one another. Each interface connection (23) has grouped-together conductors (41) which extend through the plate (21) and which are laterally enclosed by the plate material and the end regions of which protruding on the top side and lower side from the plate (21) can be fixed to interfaces (13) of two printed circuit boards (3, 5) to be connected. Therefore, the conductors (41) form both a mechanical and an electrical connection between the interfaces (13) of the printed circuit boards (3, 5).

Power electronics arrangement including a printed circuit board and at least one power module fastened on the printed circuit board, which has one or more electronic components potted by a potting compound. At least one module connecting point of the power module is electrically contacted with at least one board connecting point of the printed circuit board by an electrically conductive pin. A base section of the pin is fastened on the module connecting point or on the board connecting point, and the end of the pin opposite to the base section is pressed in the installation position into a contacting opening assigned or assignable to the respective other connecting point.

A circuit board structure includes a rigid circuit board, a flexible circuit board, a plurality of conductive bumps, and a plurality of spacers. The rigid and flexible circuit boards are stacked one above the other. The conductive bumps are formed between the rigid and flexible circuit boards. The spacers are formed between the rigid and flexible circuit boards and spaced apart from the conductive bumps.

An electronic system for a vehicle includes: a first module including: a first circuit board having a predetermined form factor; a first module on the first circuit board and including a plurality of pins; a first electrical connector disposed on a first surface of the first circuit board and including a plurality of pins; and a plurality of electrical conductors connecting the pins of the first electrical connector with the pins of the first module, respectively; and a second module including: a second circuit board having the predetermined form factor; a second module on the second circuit board and including a plurality of pins; a second electrical connector disposed on a first surface of the second circuit board and including a plurality of pins, the second electrical connector coupled to the first electrical connector.

A power supply module having at least one inductor modules, a top PCB mounted on top of the at least one inductor modules, and at least one pair of power device chips mounted on top of the top PCB, wherein power pins and signal pins for connecting the top PCB and a board that the at least one inductor modules are attached to, are implemented by metal layers wrapping each of the at least one inductor modules.

A multilayer printed circuit board including a first printed circuit board portion, including a first inserting connector, including a plurality of contacts for creating a first removable bus connection; a second printed circuit board portion, including a second inserting connector, including a plurality of contacts for creating a second removable bus connection; a third printed circuit board portion, connected between the first printed circuit board portion and to the second printed circuit board portion, wherein a rigidity of the third printed circuit board portion is less than a rigidity of each of the first printed circuit board portion and the second printed circuit board portion; wherein the multilayer printed circuit board is foldable along the third printed circuit board portion and, if so folded, the first printed circuit board portion is arranged on top of the second printed circuit board portion.

An antenna substrate includes: a first substrate including an antenna pattern disposed on an upper surface of the first substrate; a second substrate having a first planar surface, an area of which is smaller than an area of a planar surface of the first substrate; and a flexible substrate connecting the first and second substrates to each other and bent to allow the first planar surface of the second substrate to face a side surface of the first substrate, which is perpendicular to the upper surface of the first substrate.

An electronic device according to various embodiments of the present invention may comprise: a circuit substrate comprising a first layer including a first wire, a second wire formed at one side surface of the first wire along the first wire, and a third wire formed at the other side surface of the first wire along the first wire, a second layer including a ground plane formed along the first wire, the second wire, and the third wire and electrically connected to the second wire and the third wire, and an insulation layer disposed between the first layer and the second layer and having first permittivity; and a conductive member which is disposed above the first layer to have a dielectric-fillable interval space along the first wire and is electrically connected to the ground of the electronic device, the dielectric having second permittivity lower than the first permittivity.

A circuit assembly with an electrical connection between two individual Printed Circuit Boards (PCBs) or Circuit Card Assemblies (CCAs) that are vertically stacked with a connection formed entirely of solder and with a gap in between surfaces that components may occupy. Coalescing solder paste merges between the surfaces when it is in a liquid state to form a solder bridge. The resultant assembly can be encapsulated to form a solid monolithic electronic assembly to improve robustness and allow the assembly to better withstand compressive forces.