Patent classifications
H05K2201/043
MICROWAVE WIRELESS CHARGER WITH FOCUSING OF MICROWAVE FIELD
Disclosed is an apparatus and method for wirelessly transmitting power to power receivers from a power transmitter. The present disclosure provides a rational search procedure for locations of the power receivers, and provides a function of simultaneously charging multiple receivers using microwave multi-focusing. The wireless power transmission method performed by a power transmitter includes determining angular coordinates of the power transmitter in relation to a position of at least one power receiver; determining a distance between the at least one power receiver and the power transmitter based on the determined angular coordinates by using a focused microwave field; determining a location of the at least one power receiver based on the determined angular coordinates and the distance; and wirelessly transmitting power by focusing the microwave field to the determined location of the at least one power receiver.
THERMAL SOLUTIONS FOR MULTI-PACKAGE ASSEMBLIES
An integrated circuit assembly may be formed comprising at least two integrated circuit packages, wherein the at least two integrated circuit packages share a heat dissipation device. In one embodiment, the at least two integrated circuit packages may be electrically attached to an electronic card to form an intermediate integrated circuit assembly. In a further embodiment, the integrated circuit assembly may comprise at least one intermediate integrated circuit assembly electrically attached to an electronic board.
COOLING MODULE AND CIRCUIT BOARD
A cooling module includes an electroosmotic pump. The electroosmotic pump includes a first electrode which is permeable to a cooling fluid, a second electrode which is located with an interval from the first electrode and is permeable to the fluid, and a dielectric layer which is located between the first electrode and the second electrode and includes a microchannel which is permeable to the fluid. The first electrode and the second electrode have different polarities.
Microwave wireless charger with focusing of microwave field
Disclosed is an apparatus and method for wirelessly transmitting power to power receivers from a power transmitter. The present disclosure provides a rational search procedure for locations of the power receivers, and provides a function of simultaneously charging multiple receivers using microwave multi-focusing. The wireless power transmission method performed by a power transmitter includes determining angular coordinates of the power transmitter in relation to a position of at least one power receiver; determining a distance between the at least one power receiver and the power transmitter based on the determined angular coordinates by using a focused microwave field; determining a location of the at least one power receiver based on the determined angular coordinates and the distance; and wirelessly transmitting power by focusing the microwave field to the determined location of the at least one power receiver.
CIRCUIT BOARD MODULE AND HEAT-DISSIPATING BOARD STRUCTURE THEREOF
A heat-dissipating board structure and a circuit board module are provided. The heat-dissipating board structure includes a first board, a second board, a heat-transmitting layer and a buffering liquid. The first board has a first inner surface and the first inner surface has a plurality of first metal protrusions thereon. The second board is correspondingly engaged with the first board to form an accommodating chamber therebetween. The second board has a second inner surface and the second inner surface has a plurality of second metal protrusions thereon. The heat-transmitting layer is disposed in the accommodating chamber and arranged between the first metal protrusions and the second metal protrusions. The buffering liquid is filled in a residual space of the accommodating chamber. Therefore, the heat-dissipating board structure can meet the design requirements of a light-weight and thin electronic product and can effectively remove heat from a heat source.
Systems with electrical isolation between signal and power domains
The system includes power-over-ethernet (PoE) sockets that interface to dedicated power and signal printed circuit boards. More particularly, the system separates power transmission circuitry from signal transmission circuitry for PoE arrays of RJ-45 sockets. The sockets include pins of different length to accommodate a stacked configuration of the power board and signal board. The pins corresponding to higher-voltage powers are a different length than lower-voltage signal pins. More than one PoE connector array may be coupled to a stack printed circuit boards, with pins of varying length, configured to engage with respective boards of the stack. The boards of the stack may be electrically isolated from each other, although the boards may be structurally engaged with each other.
Flexible display device with reduced bend stress wires and manufacturing method for the same
There is provided a flexible display having a plurality of innovations configured to allow bending of a portion or portions to reduce apparent border size and/or utilize the side surface of an assembled flexible display.
ENCLOSURE WITH TAMPER RESPONDENT SENSOR
A method to fabricate a tamper respondent assembly is provided. The tamper respondent assembly includes an electronic component and an enclosure at least partly enclosing the electronic component. A piezoelectric sensor is integrated in the enclosure. The integrating includes providing a base structure that includes a first conductive layer, depositing a piezoelectric layer on the first conductive layer, covering the piezoelectric layer with a second conductive layer, and providing sensing circuitry for observing sensing signals of the piezoelectric layer. The piezoelectric layer includes a plurality of nanorods. Aspects of the invention further relates to a corresponding assembly and a corresponding computer program product.
Dual printed circuit board
A dual printed circuit board assembly for vehicle lights, the dual printed circuit board including a dual printed circuit board and a dual connector. The dual printed circuit board having a first substrate with a first layout, a second substrate opposite to the first substrate with a second layout, and a common panel that supports the first substrate on a first side and the second substrate on a second side, wherein the first layout is populable by a first plurality of light sources to be used in a first light of the vehicle lights and the second layout is populable by a second plurality of light sources to be used in a second light of the vehicle lights. The dual connector having a first jumper connector electrically connected to the first layout, and a second jumper connector opposite to the first jumper connector and electrically connected to the second layout.
Modularly expandable enclosure
A modularly expandable enclosure including a top end plate, a bottom end plate, and one or more elongated tray modules. The top end plate, the bottom end plate and the tray modules define an interior space of the enclosure. Opposite vertical ends of each tray module define an upper end connecting portion and a lower end connecting portion. The upper end connecting portion is configured for engagement with the top end plate and further configured for engagement with a lower end connecting portion of a vertically upwardly adjacent module tray. The lower end connecting portion is configured for engagement with the bottom end plate and further configured for engagement with an upper end connecting portion of a vertically downwardly adjacent tray module.